Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2005
01/20/2005US20050012140 EEPROM device having selecting transistors and method of fabricating the same
01/20/2005US20050012139 Data erasing method, and memory apparatus having data erasing circuit using such method
01/20/2005US20050012138 Nonvolatile semiconductor memory device
01/20/2005US20050012137 Nonvolatile memory cell having floating gate, control gate and separate erase gate, an array of such memory cells, and method of manufacturing
01/20/2005US20050012136 Method for forming silicon film with changing grain size by thermal process
01/20/2005US20050012135 Split-gate flash with source/drain multi-sharing
01/20/2005US20050012134 Nonvolatile memory device driving method, semiconductor storage device, and liquid crystal display device including the semiconductor storage device
01/20/2005US20050012133 Semiconductor device and method for fabricating the same
01/20/2005US20050012132 Method of improving the top plate electrode stress inducting voids for 1t-ram process
01/20/2005US20050012131 Trench-capacitor dram cell having a folded gate conductor
01/20/2005US20050012130 6F2 3-Transistor DRAM gain cell
01/20/2005US20050012129 Magnetic switching element and a magnetic memory
01/20/2005US20050012128 Memory cell having bar-shaped storage node contact plugs and methods of fabricating same
01/20/2005US20050012126 Hydrogen barrier for protecting ferroelectric capacitors in a semiconductor device and methods for fabricating the same
01/20/2005US20050012125 Ferroelectric memory cell with angled cell transistor active region and methods for fabricating the same
01/20/2005US20050012123 Semiconductor device having a flip-chip construction
01/20/2005US20050012122 Semiconductor device and manufacturing method thereof
01/20/2005US20050012120 Method for making high density nonvolatile memory
01/20/2005US20050012119 Method for making high density nonvolatile memory
01/20/2005US20050012117 Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET
01/20/2005US20050012111 Double diffused vertical jfet
01/20/2005US20050012110 Transflective liquid crystal display device and fabricating method thereof
01/20/2005US20050012101 Semiconductor device
01/20/2005US20050012100 Flat panel display
01/20/2005US20050012099 Fabrication of crystalline materials over substrates
01/20/2005US20050012098 Thin film transistor formed on a transparent substrate
01/20/2005US20050012097 Light-emitting device
01/20/2005US20050012096 Semiconductor device and method for producing it
01/20/2005US20050012089 Metal organic chemical vapor deposition and atomic layer deposition of metal oxynitride and metal silicon oxynitride
01/20/2005US20050012088 Semiconductor device and method of manufacturing the same
01/20/2005US20050012087 Self-aligned MOSFET having an oxide region below the channel
01/20/2005US20050012068 Stable solutions of organic semiconducting compounds
01/20/2005US20050012066 Load-lock device for introducing substrates into a vacuum chamber
01/20/2005US20050012052 Ion irradiation of a target at very high and very low kinetic ion energies
01/20/2005US20050012032 Camera module for compact electronic equipments
01/20/2005US20050011974 Methods of operating a liquid vaporizer
01/20/2005US20050011934 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus
01/20/2005US20050011878 Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober
01/20/2005US20050011872 Laser processing
01/20/2005US20050011862 Method and apparatus for dry-etching half-tone phase-shift films, half-tone phase-shift photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof
01/20/2005US20050011860 Substrate for magnetic recording medium, method for manufacturing the same and magnetic recording medium
01/20/2005US20050011859 Removing dielectric materials from layered substrates
01/20/2005US20050011809 Wafer storage container with wafer positioning posts
01/20/2005US20050011808 Wafer shipper with orientation control
01/20/2005US20050011758 Magnetic control oscillation-scanning sputter
01/20/2005US20050011757 Sputtering apparatus
01/20/2005US20050011752 Spin coating film for photoresist; vacuum, vapor deposition; evaporation; sputtering; edge cleaning; plasma etching; masking
01/20/2005US20050011669 Low temperature bonding of multilayer substrates
01/20/2005US20050011660 Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating same
01/20/2005US20050011612 Plasma etching apparatus and plasma etching method
01/20/2005US20050011611 Wafer probe for measuring plasma and surface characteristics in plasma processing environments
01/20/2005US20050011581 Chamber, exposure apparatus, and device manufacturing method
01/20/2005US20050011541 Error-preventing device and method for semiconductor fabrication equipment
01/20/2005US20050011540 Wafer container cleaning system
01/20/2005US20050011537 Substrate processing method and apparatus
01/20/2005US20050011535 Cleaning semiconductor wafers
01/20/2005US20050011460 Substrate chucking apparatus
01/20/2005US20050011458 Wafer holder with peripheral lift ring
01/20/2005US20050011457 Controlling the temperature of a substrate in a film deposition apparatus
01/20/2005US20050011456 Processing apparatus and gas discharge suppressing member
01/20/2005US20050011455 Plasma process apparatus and its processor
01/20/2005US20050011454 Liner for use in processing chamber
01/20/2005US20050011450 Plasma treatment apparatus, matching box, impedance matching device, and coupler
01/20/2005US20050011448 Gasification monitor, method for detecting mist, film forming method and film forming apparatus
01/20/2005US20050011444 Vapor deposition systems having separate portions configured for purging using different materials and methods of operating same
01/20/2005US20050011441 Processing system, processing method and mounting member
01/20/2005US20050011434 Silicon crystallization using self-assembled monolayers
01/20/2005US20050011351 Pressure control apparatus and method of establishing a desired level or pressure within at least one processing chamber
01/20/2005US20050011294 Articulated robot
01/20/2005US20050011068 Semiconductor manufacturing apparatus, and method for manufacturing semiconductor device
01/20/2005US20050011067 Apparatus for mounting semiconductors
01/20/2005US20050011056 Bare die tray clip
01/20/2005DE4406861B4 Ohmsche Kontaktstruktur für eine hochintegrierte Halbleitervorrichtung und Herstellungsverfahren The ohmic contact structure for a highly integrated semiconductor device and manufacturing method
01/20/2005DE19855268B4 Verfahren und Vorrichtung zur Herstellung eines dreidimensionalen metallischen Bauteils Method and apparatus for producing a three-dimensional metallic component
01/20/2005DE19758547B4 Ball grid array for semiconductor component - has substrate plate dimensions forming multiple of dimensions of individual substrate parts
01/20/2005DE10362018A1 Anordnung und Verfahren zur Herstellung von vertikalen Transistorzellen und transistorgesteuerten Speicherzellen Arrangement and method for the production of vertical transistor cells and transistor-controlled memory cells
01/20/2005DE10358767A1 Verfahren zum Bilden einer Bit-Leitung eines Flashbauelements A method of forming a bit line of a flash device
01/20/2005DE10332095B3 Halbleiterspeicher mit Charge-trapping-Speicherzellen Semiconductor memory having charge trapping memory cells
01/20/2005DE10330022A1 Verfahren zur Herstellung von Iow-k dielektrischen Filmen Process for the preparation of Iow-k dielectric films
01/20/2005DE10329868A1 Lagersystem für Wafer Storage system for wafer
01/20/2005DE10328842A1 Beschichtete Halbleiterscheibe und Verfahren und Vorrichtung zur Herstellung der Halbleiterscheibe Coated wafer and method and apparatus for producing the semiconductor wafer
01/20/2005DE10328343A1 Production of semiconductor structure for integrated circuits comprises forming semiconductor substrate with a trench, depositing germanium-containing silicate glass to fill trench, melting silicate glass, and optionally back-polishing
01/20/2005DE10323842B3 Verfahren zum Herstellen einer Chipanordnung und Lack mit ferromagnetischen Partikeln A method of producing a chip arrangement and varnish with ferromagnetic particles
01/20/2005DE102004030345A1 Single chip data processing device as e.g. microcontroller unit comprises first conductivity type second well deeper than first well and having higher dopant concentration than first conductivity type substrate
01/20/2005DE102004029846A1 Integrated circuit memory device, has column select IO blocks and N-type sense amplifier blocks arranged in zig-zag layout pattern that spans two rows of zeroth sense amplifier region
01/20/2005DE102004028397A1 Verfahren für die Überprüfung der Qualität einer Wedgeverbindung Procedures for verifying the quality of a wedge connection
01/20/2005CA2530688A1 Laser pulse picking employing controlled aom loading
01/19/2005EP1499167A2 Folded flex circuit interconnect having a grid array interface
01/19/2005EP1498959A2 Manufacturing method of a semiconductor device
01/19/2005EP1498958A2 Mutiple gate semiconductor device and method for forming same
01/19/2005EP1498956A1 Semiconductor element and manufacturing method thereof
01/19/2005EP1498955A1 Semiconductor device and its manufacturing method
01/19/2005EP1498953A2 Semiconductor memory with charge trapping memory cells
01/19/2005EP1498950A1 Microwave hybrid circuit device with resilient contact shielding elements
01/19/2005EP1498948A2 A reconnectable chip interface and chip package
01/19/2005EP1498945A2 Low power flash memory cell and method
01/19/2005EP1498943A2 In-plane distribution data compression method, in-plane distribution measurement method, in-plane distribution optimization method, process apparatus control method, and process control method
01/19/2005EP1498942A1 Signal detection contactor and signal correcting system
01/19/2005EP1498941A2 Unsaturated oxygenated fluorocarbons for selective anisotropic etch applications
01/19/2005EP1498940A2 Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas