Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2005
01/13/2005WO2005004232A1 Method for simultaneously obtaining a pair of substrates covered by a useful layer
01/13/2005WO2005004231A1 Method for the production of semi-conductor chips
01/13/2005WO2005004230A1 Carrying apparatus and carrying control method for sheet-like substrate
01/13/2005WO2005004229A1 Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and the electrode
01/13/2005WO2005004228A1 Treating device
01/13/2005WO2005004227A1 Thin sheet-like article displacement detection method and displacement correction method
01/13/2005WO2005004226A1 Die bonding
01/13/2005WO2005004225A1 Joining method and joining device
01/13/2005WO2005004224A1 Semiconductor device and process for producing the same
01/13/2005WO2005004223A1 Method of forming low-permittivity insulation film of semiconductor device, semiconductor device using the method and low-permittivity insulation film forming device
01/13/2005WO2005004222A1 Precursor solution, method of preparation thereof and use thereof
01/13/2005WO2005004221A2 Low-k-dielectric material
01/13/2005WO2005004220A1 Process for producing low-k dielectric films
01/13/2005WO2005004219A1 Pressure reduction process device, pressure reduction process method, and pressure regulation valve
01/13/2005WO2005004218A1 Polishing apparatus and polishing method
01/13/2005WO2005004217A1 Substrate processing method and substrate processing device
01/13/2005WO2005004216A1 Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
01/13/2005WO2005004215A1 Substrate processing system
01/13/2005WO2005004214A1 Heat treatment apparatus and method of calibrating the apparatus
01/13/2005WO2005004213A1 Method for growing thin nitride film onto substrate and thin nitride film device
01/13/2005WO2005004212A1 Growth method of nitride semiconductor epitaxial layers
01/13/2005WO2005004209A1 Storage system for wafers
01/13/2005WO2005004208A2 Wafer inspection device
01/13/2005WO2005004206A2 Integrated circuit having pairs of parallel complementary finfets
01/13/2005WO2005004205A2 Methods for forming patterns of a filled dielectric material on substrates
01/13/2005WO2005004204A2 An electrochemical method and resulting structures for attaching molecular and biomolecular structures to semiconductor micro and nanostructures
01/13/2005WO2005004203A2 System and method based on field-effect transistors for addressing nanometer-scale devices
01/13/2005WO2005004201A2 Bipolar transistor and method of making same
01/13/2005WO2005004199A2 Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers
01/13/2005WO2005004198A2 Complex oxides for use in semiconductor devices and related methods
01/13/2005WO2005004197A2 Fluidic nanotubes and devices
01/13/2005WO2005004196A2 Article comprising gated field emission structures with centralized nanowires and method for making the same
01/13/2005WO2005004195A2 Method and apparatus for packaging integrated circuit devices
01/13/2005WO2005004189A2 Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith
01/13/2005WO2005004049A1 Flexible semiconductor device and identification label
01/13/2005WO2005003928A2 Replicated derivatives having demand-based, adjustable returns, and trading exchange therefor
01/13/2005WO2005003862A1 Device for the polarization-specific examination of an optical system
01/13/2005WO2005003861A1 Positive type resist composition and method of forming resist pattern from the same
01/13/2005WO2005003793A1 Probe card and semiconductor testing device using probe sheet or probe card and semiconductor device producing method
01/13/2005WO2005003736A1 Thin piece specimen preparing method and composite charged particle beam device
01/13/2005WO2005003735A1 Thin piece specimen preparing method and composite charged particle beam device
01/13/2005WO2005003668A2 Microchannel heat exchangers and methods of manufacturing the same
01/13/2005WO2005003404A2 Composite refractory metal carbide coating on a substrate and method for making thereof
01/13/2005WO2005003403A1 Film forming method and film forming device using plasma cvd
01/13/2005WO2005003193A1 Positive resist composition and method for forming resist pattern using same
01/13/2005WO2005003026A1 High purity phosphoric acid and method for production thereof
01/13/2005WO2005003001A1 Ball transfer unit and ball table
01/13/2005WO2005002804A1 Transfer device, thin plate-like article transfer method, and thin plate-like article production system
01/13/2005WO2005002794A2 Cell, system and article for electrochemical mechanical processing (ecmp)
01/13/2005WO2004105456A9 Transfer assembly for manufacturing electronic devices
01/13/2005WO2004105108A3 Manufacturing gallium nitride substrates by lateral overgrowth through masks and devices fabricated thereof
01/13/2005WO2004093176B1 Method for plasma etching using periodic modulation of gas chemistry
01/13/2005WO2004086459A3 Method for making tapered opening for programmable resistance memory element
01/13/2005WO2004079814A3 Modulated/composited cvd low-k films with improved mechanical and electrical properties for nanoelectronic devices
01/13/2005WO2004077504A3 Gallium arsenide hbt having increased performance and method for its fabrication
01/13/2005WO2004075264A3 Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems
01/13/2005WO2004072979A3 Mram cells having magnetic write lines with a stable magnetic state at the end regions
01/13/2005WO2004061916B1 Method of forming a low-k dual damascene interconnect structure
01/13/2005WO2004059689A3 Method and apparatus for monitoring a plasma in a material processing system
01/13/2005WO2004053456A3 Method using multi-component colloidal abrasives for cmp processing of semiconductor and optical materials
01/13/2005WO2004037877A3 Organosiloxanes
01/13/2005WO2004032209A3 Method of etching shaped features on a substrate
01/13/2005WO2004023567A3 Method of manufacturing a solar cell
01/13/2005WO2004008054A9 Variable heater element for low to high temperature ranges
01/13/2005WO2004007800A9 Thermal processing apparatus and method for evacuating a process chamber
01/13/2005WO2003097894A3 Sputtering cathode adapter
01/13/2005WO2003084684A8 In-situ local heating using megasonic transducer resonator
01/13/2005US20050010879 Method of analyzing semiconductor LSI circuit electrostatic discharge
01/13/2005US20050010878 Generating an optical model for lens aberrations
01/13/2005US20050010455 Early detection of contact liner integrity by chemical reaction
01/13/2005US20050010329 Paste dispenser and method for controlling the same
01/13/2005US20050010320 Methods of operating vacuum processing equipment and methods of processing wafers
01/13/2005US20050010319 System and method for validating and visualizing APC assisted semiconductor manufacturing processes
01/13/2005US20050010000 Process for improving dielectric properties in low-k organosilicate dielectric material
01/13/2005US20050009714 Process and slurry for chemical mechanical polishing
01/13/2005US20050009484 High frequency power amplifier module and semiconductor integrated circuit device
01/13/2005US20050009453 CMP polishing heads and methods of using the same
01/13/2005US20050009450 Apparatus for optical inspection of wafers during processing
01/13/2005US20050009449 Polishing pad with built-in optical sensor
01/13/2005US20050009374 Direct patterning of silicon by photoelectrochemical etching
01/13/2005US20050009373 Semiconductor device and method for preventing damage to anti-reflective structure during removing an overlying photoresist layer
01/13/2005US20050009372 Dielectric material forming methods and enhanced dielectric materials
01/13/2005US20050009371 System and method for forming a gate dielectric
01/13/2005US20050009370 Composite dielectric forming methods and composite dielectrics
01/13/2005US20050009369 Methods of forming a multi-layered structure using an atomic layer deposition process and methods of forming a capacitor of an integrated circuit device
01/13/2005US20050009368 Methods of forming a phosphorus doped silicon dioxide comprising layer, and methods of forming trench isolation in the fabrication of integrated circuitry
01/13/2005US20050009367 Novel method to increase fluorine stability to improve gap fill ability and reduce k value of fluorine silicate glass (FSG) film
01/13/2005US20050009366 Adhesive support method for wafer coating, thinning and backside processing
01/13/2005US20050009365 Method of forming fine patterns
01/13/2005US20050009364 Semiconductor processing methods of chemical vapor depositing SiO2 on a substrate
01/13/2005US20050009363 Method for forming a coating film on a plate-like workpiece
01/13/2005US20050009362 Method for forming dielectric thin film and dielectric thin film formed thereby
01/13/2005US20050009361 Methods and apparatus for forming a high dielectric film and the dielectric film formed thereby
01/13/2005US20050009360 Method for forming bottle-shaped trench
01/13/2005US20050009359 Micellar technology for post-etch residues
01/13/2005US20050009358 Method of fabricating a gate structure of a field effect transistor having a metal-containing gate electrode
01/13/2005US20050009357 Process to reduce substrate effects by forming channels under inductor devices and around analog blocks
01/13/2005US20050009356 Method of manufacturing semiconductor device and method of cleaning plasma etching apparatus used therefor
01/13/2005US20050009355 Reference pattern for creating a defect recognition level, method of fabricating the same and method of inspecting defects using the same
01/13/2005US20050009354 MOS transistor and fabrication method thereof