Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2005
01/18/2005US6844268 Method for fabricating a semiconductor storage device having an increased dielectric film area
01/18/2005US6844267 Anisotropic etching of organic-containing insulating layers
01/18/2005US6844266 Anisotropic etching of organic-containing insulating layers
01/18/2005US6844265 Etching method
01/18/2005US6844264 Dry etching method
01/18/2005US6844263 LSI device polishing composition and method for producing LSI device
01/18/2005US6844262 CMP process
01/18/2005US6844261 Method of forming ruthenium and ruthenium oxide films on a semiconductor structure
01/18/2005US6844260 Insitu post atomic layer deposition destruction of active species
01/18/2005US6844259 Method for forming contact plug in semiconductor device
01/18/2005US6844258 Selective refractory metal and nitride capping
01/18/2005US6844257 Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
01/18/2005US6844255 Methods of providing an interlevel dielectric layer intermediate different elevation conductive metal layers in the fabrication of integrated circuitry
01/18/2005US6844254 Semiconductor device having bonding pad electrode of multi-layer structure
01/18/2005US6844253 Selective deposition of solder ball contacts
01/18/2005US6844252 Semiconductor processing methods of forming a conductive gate and line
01/18/2005US6844251 Method of forming a semiconductor device with a junction termination layer
01/18/2005US6844250 Method and system for laser thermal processing of semiconductor devices
01/18/2005US6844249 Method for manufacturing a semiconductor device using laser light
01/18/2005US6844248 Method of doping silicon, metal doped silicon, method of making solar cells, and solar cells
01/18/2005US6844247 Semiconductor device and method of manufacturing the same
01/18/2005US6844246 Production method of III nitride compound semiconductor, and III nitride compound semiconductor element based on it
01/18/2005US6844245 Method of preparing a self-passivating Cu laser fuse
01/18/2005US6844244 Dual sided lithographic substrate imaging
01/18/2005US6844243 Methods of forming semiconductor constructions
01/18/2005US6844242 Method of manufacturing SOI wafer
01/18/2005US6844241 Fabrication of semiconductor structures having multiple conductive layers in an opening
01/18/2005US6844240 Semiconductor device having trench isolation
01/18/2005US6844239 Method for forming shallow well of semiconductor device using low-energy ion implantation
01/18/2005US6844238 Multiple-gate transistors with improved gate control
01/18/2005US6844237 Method for improving dielectric polishing
01/18/2005US6844236 Method and structure for DC and RF shielding of integrated circuits
01/18/2005US6844235 Reticle repeater monitor wafer and method for verifying reticles
01/18/2005US6844234 Semiconductor device and method for manufacturing semiconductor device
01/18/2005US6844233 Semiconductor memory device and fabrication method thereof using damascene gate and epitaxial growth
01/18/2005US6844232 Flash memory device and fabricating method therefor
01/18/2005US6844231 Method of manufacturing a flash memory cell using a self-aligned floating gate
01/18/2005US6844230 Methods of forming capacitors and resultant capacitor structures
01/18/2005US6844229 Method of manufacturing semiconductor device having storage electrode of capacitor
01/18/2005US6844228 Manufacturing method of a semiconductor device capable of accurately setting a resistance value of a resistance element
01/18/2005US6844227 Semiconductor devices and method for manufacturing the same
01/18/2005US6844226 System and method to reduce noise in a substrate
01/18/2005US6844225 Self-aligned mask formed utilizing differential oxidation rates of materials
01/18/2005US6844224 Substrate contact in SOI and method therefor
01/18/2005US6844223 Semiconductor device having silicon on insulator and fabricating method therefor
01/18/2005US6844219 Semiconductor device and lead frame therefor
01/18/2005US6844217 Die support structure
01/18/2005US6844214 Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication
01/18/2005US6844210 Organic electroluminescence device and method of manufacturing same
01/18/2005US6844208 Method and system for monitoring implantation of ions into semiconductor substrates
01/18/2005US6844204 Magnetic random access memory
01/18/2005US6844203 Gate oxides, and methods of forming
01/18/2005US6844143 Sandwich photoresist structure in photolithographic process
01/18/2005US6844135 Chemically amplified resist material and patterning method using same
01/18/2005US6844134 For semiconductors; high transmittance; improved dry etching resistance, adhesiveness, and wettability
01/18/2005US6844132 Positive photosensitive compositions
01/18/2005US6844123 System for production of large area display panels with improved precision
01/18/2005US6844119 Alternately laminating, on a transparent substrate, thin layers made of tintanium nitride and thin layers made of silicon nitride to form multilayered semi-transmission film, heating the film at 300 degree C. or higher
01/18/2005US6844117 Reactive ion etching using a mixed gas including an oxygen containing gas and a halogen containing gas, and a reducing gas for dry etching a metal film; high precision pattern-etched product; dry etching apparatus
01/18/2005US6844076 Silicon oxide based gate dielectric layer
01/18/2005US6844074 Quartz layer; vibrators, oscillators, high frequency filter surface acoustic wave elements, optical waveguides, semicon-ductors; atmospheric pressure vapor phase epitaxial deposited silicate on gallium nitride or zinc oxide buffered substrate
01/18/2005US6844052 Method for underfilling semiconductor components
01/18/2005US6844027 Environment exchange control for material on a wafer surface
01/18/2005US6844023 Alumina insulation for coating implantable components and other microminiature devices
01/18/2005US6843975 Oxide sintered body and manufacturing method thereof
01/18/2005US6843929 Accelerated etching of chromium
01/18/2005US6843927 Method and apparatus for endpoint detection in electron beam assisted etching
01/18/2005US6843926 In-situ measurement of wafer position on lower electrode
01/18/2005US6843893 Metal dry etch using electronic field
01/18/2005US6843883 Vacuum processing apparatus and method for producing an object to be processed
01/18/2005US6843882 Gas flow control in a wafer processing system having multiple chambers for performing same process
01/18/2005US6843880 Enhanced endpoint detection for wet etch process control
01/18/2005US6843879 Separation method for object and glue membrane
01/18/2005US6843859 Dump door
01/18/2005US6843857 Rotating articles within chamber, applying heated liquid comprising water onto rotating articles, introducing ozone gas and carbon dioxide gas into chamber, ozone oxidizing contaminants on articles, cleaning articles
01/18/2005US6843855 TDrying chamber is supercritical or low pressure; the wet-cleaning chamber is single-wafer, horizontal spinning, megasonic wet-cleaning, or horizontal spinning having acoustic waves transmitted to the substrate.
01/18/2005US6843848 Semiconductor wafer made from silicon and method for producing the semiconductor wafer
01/18/2005US6843847 Silicon single crystal wafer and production method thereof and soi wafer
01/18/2005US6843833 Front opening unified pod and associated method for preventing outgassing pollution
01/18/2005US6843816 Cerium-based abrasive material and method for preparation thereof
01/18/2005US6843809 Vacuum/purge operation of loadlock chamber and method of transferring a wafer using said operation
01/18/2005US6843711 Chemical mechanical polishing pad having a process-dependent groove configuration
01/18/2005US6843709 Chemical mechanical polishing method for reducing slurry reflux
01/18/2005US6843707 Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing
01/18/2005US6843704 Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals
01/18/2005US6843572 Form-error-cancelling mirror-support devices and related methods, and microlithography systems comprising same
01/18/2005US6843259 Solution treatment unit
01/18/2005US6843257 Rotating wafer; prevent damage; pattern of transverse groove in cleaning detector; controlled spinning
01/18/2005US6843202 Thermal processing apparatus for substrate employing photoirradiation
01/18/2005US6843201 Temperature control for single substrate semiconductor processing reactor
01/18/2005US6843122 Mass flow controller for control purge and managing method of the same
01/18/2005US6843069 Etching apparatus
01/18/2005US6842933 Substrate cleaning apparatus and cleaning member
01/18/2005US6842932 Cleaning processing system and cleaning processing apparatus
01/18/2005CA2472900A1 Device with microwave integrated circuits shielded by elastic contact element(s)
01/13/2005WO2005004564A1 REFLOW SOLDERING METHOD USING Pb-FREE SOLDER ALLOY AND HYBRID PACKAGING METHOD AND STRUCTURE
01/13/2005WO2005004316A1 Dc/dc converter using bipolar transistor, method of manufacturing the same and dc power supply module using the same
01/13/2005WO2005004237A1 Method for interconnecting active and passive components, and a resulting thin heterogeneous component
01/13/2005WO2005004234A1 Selective capping of copper wiring
01/13/2005WO2005004233A1 Method for obtaining a structure having a supporting substrate and an ultra-thin layer