| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/27/2005 | US20050017364 Semiconductor device and method of fabricating the same |
| 01/27/2005 | US20050017359 Capacitor constructions, semiconductor constructions, and methods of forming electrical contacts and semiconductor constructions |
| 01/27/2005 | US20050017356 Semiconductor device |
| 01/27/2005 | US20050017355 Water level processing method and structure to manufacture two kinds of bumps, gold and solder, on one wafer |
| 01/27/2005 | US20050017352 Structure of multi-tier wire bonding for high frequency integrated circuit |
| 01/27/2005 | US20050017349 Method for supporting circuit component having solder column array interconnects using interposed support shims |
| 01/27/2005 | US20050017348 Manufacture of mountable capped chips |
| 01/27/2005 | US20050017346 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device |
| 01/27/2005 | US20050017344 Interconnecting component |
| 01/27/2005 | US20050017343 Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same |
| 01/27/2005 | US20050017340 Semiconductor device and fabrication method thereof |
| 01/27/2005 | US20050017336 [multi-chip package] |
| 01/27/2005 | US20050017333 Interposer and method of making same |
| 01/27/2005 | US20050017331 Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it |
| 01/27/2005 | US20050017330 Process for fabricating a semiconductor package and semiconductor package with leadframe |
| 01/27/2005 | US20050017328 Device having a useful structure and an auxiliary structure |
| 01/27/2005 | US20050017326 Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same |
| 01/27/2005 | US20050017325 Method for fabricating an NPN transistor in a BICMOS technology |
| 01/27/2005 | US20050017324 Multilayer analog interconnecting line layout for a mixed-signal integrated circuit |
| 01/27/2005 | US20050017323 Semicoductor device containing an ultra thin dielectric film or dielectric layer |
| 01/27/2005 | US20050017320 Semiconductor device method of generating semiconductor device pattern method of semiconductor device and pattern generator for semiconductor device |
| 01/27/2005 | US20050017319 Semiconductor device and production method therefor |
| 01/27/2005 | US20050017318 Circuit array substrate and method of manufacturing the same |
| 01/27/2005 | US20050017316 CMOS image sensor device and method |
| 01/27/2005 | US20050017313 System and method of fabricating micro cavities |
| 01/27/2005 | US20050017312 Barrier in gate stack for improved gate dielectric integrity |
| 01/27/2005 | US20050017310 Methods of forming silicide films in semiconductor devices |
| 01/27/2005 | US20050017309 Nitrogen controlled growth of dislocation loop in stress enhanced transistor |
| 01/27/2005 | US20050017307 MOSFET with short channel structure and formation method thereof |
| 01/27/2005 | US20050017306 Semiconductor integrated circuit |
| 01/27/2005 | US20050017305 Semiconductor device and method of manufacturing the same |
| 01/27/2005 | US20050017304 Field effect transistor and method of manufacturing the same |
| 01/27/2005 | US20050017303 Semiconductor element, semiconductor device and methods for manufacturing thereof |
| 01/27/2005 | US20050017301 Semiconductor device having a diffusion layer and a manufacturing method thereof |
| 01/27/2005 | US20050017298 Shielding structure for use in a metal-oxide-semiconductor device |
| 01/27/2005 | US20050017297 Semiconductor device, method for manufacturing the semiconductor device, and integrated circuit including the semiconductor device |
| 01/27/2005 | US20050017296 Semiconductor device and a method of manufacturing the same |
| 01/27/2005 | US20050017295 Semiconductor devices having a buried and enlarged contact hole and methods of fabricating the same |
| 01/27/2005 | US20050017294 Semiconductor device having shallow trenches and method for manufacturing the same |
| 01/27/2005 | US20050017292 Super-junction semiconductor device and method of manufacturing the same |
| 01/27/2005 | US20050017290 Insulated gate bipolar transistor with built-in freewheeling diode |
| 01/27/2005 | US20050017289 Vertical double-channel silicon-on-insulator transistor and method of manufacturing the same |
| 01/27/2005 | US20050017288 Insulating barrier, NVM bandgap design |
| 01/27/2005 | US20050017286 Capacitor with improved capacitance density and method of manufacture |
| 01/27/2005 | US20050017285 Novel embedded dual-port DRAM process |
| 01/27/2005 | US20050017284 Semiconductor device including a TCAM having a storage element formed with a DRAM |
| 01/27/2005 | US20050017283 Semiconductor device |
| 01/27/2005 | US20050017282 Dram buried strap process with silicon carbide |
| 01/27/2005 | US20050017281 Methods of fabricating buried digit lines and semiconductor devices including same |
| 01/27/2005 | US20050017280 Semiconductor memory device and method for fabricating the same |
| 01/27/2005 | US20050017278 Image sensor having micro-lens array separated with trench structures and method of making |
| 01/27/2005 | US20050017275 Novel field effect transistor and method of fabrication |
| 01/27/2005 | US20050017274 Semiconductor integrated circuitry and method for manufacturing the circuitry |
| 01/27/2005 | US20050017273 Gettering using voids formed by surface transformation |
| 01/27/2005 | US20050017272 Semiconductor device and production method therefor |
| 01/27/2005 | US20050017269 Ferroelectric memory device |
| 01/27/2005 | US20050017267 Hetero-bipolar transistor having the base interconnection provided on the normal mesa surface of the collector mesa |
| 01/27/2005 | US20050017266 Wide bandgap bipolar transistors |
| 01/27/2005 | US20050017265 Semiconductor device and method for fabricating the same |
| 01/27/2005 | US20050017264 Module for high voltage power for converting a base of IGBT components |
| 01/27/2005 | US20050017262 [led device, flip-chip led package and light reflecting structure] |
| 01/27/2005 | US20050017261 Semiconductor light-emitting device and method for manufacturing same |
| 01/27/2005 | US20050017260 Quantum dots of group IV semiconductor materials |
| 01/27/2005 | US20050017256 Flip-chip bonding of light emitting devices |
| 01/27/2005 | US20050017255 Semiconductor device and manufacturing method thereof |
| 01/27/2005 | US20050017250 Semiconductor light emitting element, its manufacturing method and semiconductor light emitting device |
| 01/27/2005 | US20050017248 Image sensor with improved dynamic range and method of formation |
| 01/27/2005 | US20050017246 Semiconductor device and method for manufacturing the same |
| 01/27/2005 | US20050017243 Electro-optical device and thin film transistor and method for forming the same |
| 01/27/2005 | US20050017242 Electro-optical device and manufacturing method thereof |
| 01/27/2005 | US20050017241 Semiconductor device and method of fabricating same |
| 01/27/2005 | US20050017240 Integrated circuit device, and method of fabricating same |
| 01/27/2005 | US20050017239 Test element group, method of manufacturing a test element group, method of testing a semiconductor device, and semiconductor device |
| 01/27/2005 | US20050017238 Forming a high dielectric constant film using metallic precursor |
| 01/27/2005 | US20050017236 Semiconductor device and semiconductor substrate |
| 01/27/2005 | US20050017235 Semiconductor device including band-engineered superlattice |
| 01/27/2005 | US20050017199 Ion implantation system with an interlock function |
| 01/27/2005 | US20050017168 Residual gas analyzer of semiconductor device manufacturing equipment |
| 01/27/2005 | US20050017156 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 01/27/2005 | US20050017154 Solid-state imaging device and method for driving the same |
| 01/27/2005 | US20050017100 Nozzle plate member for supplying fluids in dispersed manner and manufacturing method of the same |
| 01/27/2005 | US20050017058 [method of fabricating circuit substrate] |
| 01/27/2005 | US20050016987 Ceramic heater |
| 01/27/2005 | US20050016986 Ceramic heater |
| 01/27/2005 | US20050016960 Method for producing semiconductor device, polishing apparatus, and polishing method |
| 01/27/2005 | US20050016959 Ultrasonic assisted etch using corrosive liquids |
| 01/27/2005 | US20050016957 Dry etching method for magnetic material |
| 01/27/2005 | US20050016954 System and methods of altering a very small surface area |
| 01/27/2005 | US20050016953 Method of detecting particles and a processing apparatus using the same |
| 01/27/2005 | US20050016952 System and method of altering a very small surface area by multiple channel probe |
| 01/27/2005 | US20050016948 Method for fabricating trench isolations with high aspect ratio |
| 01/27/2005 | US20050016947 Method and apparatus for endpoint detection using partial least squares |
| 01/27/2005 | US20050016929 System and method for point-of-use filtration and purification of fluids used in substrate processing |
| 01/27/2005 | US20050016898 Electronic package carrier tape |
| 01/27/2005 | US20050016897 Connection structure of circuit substrate |
| 01/27/2005 | US20050016868 Providing a wafer electrical connection by holding the conductive surface against the surface of the belt pad, applying a potential difference between the electrode and the wafer electrical connection and establishing a relative motion between the surface of the belt pad and the wafer |
| 01/27/2005 | US20050016861 On a semiconductor wafer with an insulating layer of a field region and a plurality of features, forming a barrier layer overlying the field region; electrodepositing copper filling the features in the insulating layer, polishing to remove the copper layer and the barrier layer from the field region |
| 01/27/2005 | US20050016859 Increasing step current to carry out an electroplating operation so that the bumps have a uniform thickness |
| 01/27/2005 | US20050016837 Controlling heat treatment , pulsation; power flux generated by particle emission; process control |
| 01/27/2005 | US20050016818 Substrate processing apparatus and method for adjusting a substrate transfer position |