Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2005
01/13/2005US20050007200 Cascode circuit and integrated circuit having it
01/13/2005US20050007186 Boost clock generation circuit and semiconductor device
01/13/2005US20050007185 Booster circuit, semiconductor device, and display device
01/13/2005US20050007184 Booster circuit, semiconductor device, and display device
01/13/2005US20050007176 Semiconductor integrated circuit
01/13/2005US20050007171 Semiconductor equipment
01/13/2005US20050007146 Reducing coupling noise in an output driver
01/13/2005US20050007143 Fault tolerant semiconductor system
01/13/2005US20050007139 Power semiconductor module with detector for detecting main circuit current through power semiconductor element
01/13/2005US20050007136 Thermal control of a DUT using a thermal control substrate
01/13/2005US20050007134 Probe card
01/13/2005US20050007133 Articles of manufacture and wafer processing apparatuses
01/13/2005US20050007120 Semiconductor device
01/13/2005US20050007107 Complementary sensors metrological process and method and apparatus for implementing the same
01/13/2005US20050007076 Bootstrap capacitor charge circuit with limited charge current
01/13/2005US20050007015 Method of manufacturing laminated structure, laminated structure, display device and display unit
01/13/2005US20050006916 Endeffectors for handling semiconductor wafers
01/13/2005US20050006796 Process for making non-uniform minority carrier lifetime distribution in high performance silicon power devices
01/13/2005US20050006795 Corner free structure of nonvolatile memory
01/13/2005US20050006793 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
01/13/2005US20050006792 Semiconductor device and method of manufacturing the same
01/13/2005US20050006791 Semiconductor device, manufacturing method thereof, electronic device, electronic equipment
01/13/2005US20050006790 [bonding pad structure]
01/13/2005US20050006789 Packaging assembly and method of assembling the same
01/13/2005US20050006788 Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
01/13/2005US20050006787 Substrate-less microelectronic package
01/13/2005US20050006786 Semiconductor device and method of fabricating the same
01/13/2005US20050006783 Semiconductor device and manufacturing method thereof
01/13/2005US20050006781 Semiconductor integrated circuit having reduced cross-talk noise
01/13/2005US20050006780 Semiconductor integrated circuit having reduced cross-talk noise
01/13/2005US20050006779 Semiconductor device and method for producing the same
01/13/2005US20050006778 Semiconductor device having aluminum and metal electrodes and method for manufacturing the same
01/13/2005US20050006777 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof
01/13/2005US20050006776 Adhesion of copper and etch stop layer for copper alloy
01/13/2005US20050006775 Method, structure and process flow to reduce line-line capacitance with low-K material
01/13/2005US20050006774 Small grain size, conformal aluminum interconnects and method for their formation
01/13/2005US20050006773 Semiconductor device and method for fabricating the same
01/13/2005US20050006771 Semiconductor device and method of fabricating the same
01/13/2005US20050006770 Copper-low-K dual damascene interconnect with improved reliability
01/13/2005US20050006768 Vapor deposition of a amorphous, solidified dielectric overcoating substrate using pulsed dirert current
01/13/2005US20050006767 Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
01/13/2005US20050006766 Semiconductor device and method of manufacturing the same
01/13/2005US20050006765 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
01/13/2005US20050006764 Semiconductor device
01/13/2005US20050006763 Circuit substrate, semiconductor module and method of manufacturing circuit substrate
01/13/2005US20050006762 Semiconductor device, semiconductor module, and method of manufacturing semiconductor device
01/13/2005US20050006761 Bit line contact structure and fabrication method thereof
01/13/2005US20050006760 Semiconductor device with improved design freedom of external terminal
01/13/2005US20050006759 [wafer structure and bumping process thereof]
01/13/2005US20050006758 Method for packaging electronic modules and multiple chip packaging
01/13/2005US20050006753 Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument
01/13/2005US20050006752 Multi-layer interconnection circuit module and manufacturing method thereof
01/13/2005US20050006751 Semiconductor device
01/13/2005US20050006750 Integrated semiconductor power device for multiple battery systems
01/13/2005US20050006748 Multiple chip semiconductor package
01/13/2005US20050006744 Package for semiconductor devices
01/13/2005US20050006743 In-line apparatus and method for manufacturing double-sided stacked multi-chip packages
01/13/2005US20050006740 Substrate assembly for stressed systems
01/13/2005US20050006738 Structure and process for packaging rf mems and other devices
01/13/2005US20050006737 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
01/13/2005US20050006736 Selective consolidation processes for electrically connecting contacts of semiconductor device components
01/13/2005US20050006733 Lead frame and semiconductor device using the same
01/13/2005US20050006728 Semiconductor device and method of manufacturing the same
01/13/2005US20050006725 Semiconductor device and manufacturing method thereof
01/13/2005US20050006724 Bicmos structure, method for producing the same and bipolar transistor for a bicmos structure
01/13/2005US20050006723 Bipolar transistor
01/13/2005US20050006722 Process for forming a thin film of TiSiN, in particular for phase change memory devices
01/13/2005US20050006720 Semiconductor device and process for fabrication thereof
01/13/2005US20050006719 [three-dimensional memory structure and manufacturing method thereof]
01/13/2005US20050006718 Semiconductor device
01/13/2005US20050006717 Semiconductor device having super junction construction and method for manufacturing the same
01/13/2005US20050006716 Semiconductor device provided by silicon carbide substrate and method for manufacturing the same
01/13/2005US20050006715 Optical semiconductor device and method for manufacturing optical semiconductor device
01/13/2005US20050006712 PECVD silicon-rich oxide layer for reduced UV charging
01/13/2005US20050006711 Method and system for forming dual work function gate electrodes in a semiconductor device
01/13/2005US20050006710 Semiconductor memory with virtual ground architecture
01/13/2005US20050006709 Method for semiconductor integrated circuit fabrication and a semiconductor integrated circuit
01/13/2005US20050006708 Method for removal of a spacer
01/13/2005US20050006707 Semiconductor device and method for manufacturing the same
01/13/2005US20050006706 Symmetrical high frequency SCR structure and method
01/13/2005US20050006705 Ultra-uniform silicides in integrated circuit technology
01/13/2005US20050006704 Silicon-on-insulator (SOI) integrated circuit (IC) chip with the silicon layers consisting of regions of different thickness
01/13/2005US20050006703 Radiation-hardened silicon-on-insulator CMOS device, and method of making the same
01/13/2005US20050006702 Semiconductor integrated circuit, semiconductor device, and semiconductor device fabrication method
01/13/2005US20050006701 High voltage metal-oxide semiconductor device
01/13/2005US20050006699 Semiconductor device and its manufacturing method
01/13/2005US20050006698 Semiconductor device
01/13/2005US20050006697 Flash with finger-like floating gate
01/13/2005US20050006696 Semiconductor memory
01/13/2005US20050006695 Memory cells with nonuniform floating gate structures and methods of forming the same
01/13/2005US20050006694 NAND type dual bit nitride read only memory and method for fabricating the same
01/13/2005US20050006693 Undoped oxide liner/BPSG for improved data retention
01/13/2005US20050006691 [split gate flash memory cell and manufacturing method thereof]
01/13/2005US20050006690 Capacitor of semiconductor device and method for fabricating the same
01/13/2005US20050006689 Devices containing platinum-iridium films and methods of preparing such films and devices
01/13/2005US20050006688 Arrangement comprising a capacitor
01/13/2005US20050006687 Integrated stacked capacitor and method of fabricating same
01/13/2005US20050006686 Semiconductor device having trench capacitors and method for making the trench capacitors
01/13/2005US20050006685 Semiconductor device and method for fabricating the same
01/13/2005US20050006684 Capacitive element and semiconductor memory device