Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2005
01/25/2005US6846380 Substrate processing apparatus and related systems and methods
01/25/2005US6846375 Method of manufacturing multilayer ceramic wiring board and conductive paste for use
01/25/2005US6846364 Heater block having catalyst spray means
01/25/2005US6846360 Apparatus and method for bubble-free application of a resin to a substrate
01/25/2005US6846227 Electro-chemical machining appartus
01/25/2005US6846224 Surface planarization equipment for use in the manufacturing of semiconductor devices
01/25/2005US6846213 Electron source, image display device manufacturing apparatus and method, and substrate processing apparatus and method
01/25/2005US6846149 Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
01/25/2005US6846146 Load storage equipment
01/25/2005US6846095 Lighted cassette alignment fixture
01/25/2005US6845901 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
01/25/2005US6845898 Bondhead lead clamp apparatus
01/25/2005US6845897 Ultrasonic horn for a bonding apparatus
01/25/2005US6845788 Fluid handling component with ultraphobic surfaces
01/25/2005US6845779 Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
01/25/2005US6845778 An apparatus for cleaning a semiconductor substrate is provided. In embodiment of the present invention, a megasonic cleaner capable of providing localized heating is provided. The megasonic cleaner includes a transducer and a resonator.
01/25/2005US6845734 Deposition apparatuses configured for utilizing phased microwave radiation
01/25/2005US6845733 Device for treating planar elements with a plasma jet
01/25/2005US6845732 Gas heating apparatus for chemical vapor deposition process and semiconductor device fabrication method using same
01/25/2005US6845731 Adding interlock for pause after polyimide coating
01/25/2005US6845695 Removal segment of protective tape from semiconductor; adjustment, calibration
01/25/2005US6845647 Heat sink processing method
01/25/2005US6845554 Method for connection of circuit units
01/25/2005CA2124355C Nonvolative random access memory device
01/20/2005WO2005006556A2 Integrated circuit with interface tile for coupling to a stacked -die second integrated circuit
01/20/2005WO2005006463A1 Ofet channel fabrication
01/20/2005WO2005006458A2 Test structures and methods
01/20/2005WO2005006447A1 Double-gate transistor with enhanced carrier mobility
01/20/2005WO2005006446A1 Insulated gate power semiconductor devices
01/20/2005WO2005006444A1 Heterojunction bipolar transistor and method for manufacturing same
01/20/2005WO2005006440A2 Non-volatile semiconductor memory
01/20/2005WO2005006439A1 Semiconductor device
01/20/2005WO2005006436A1 Integrated coolant circuit arrangement, operating method and production method
01/20/2005WO2005006433A2 Mold compound cap in a flip chip multi-matrix array package and process of making same
01/20/2005WO2005006431A1 System and method for integrating in-situ metrology within a wafer process
01/20/2005WO2005006430A1 Packaging method and system of electric component
01/20/2005WO2005006429A1 Integrated circuit arrangement with low-resistance contacts and method for production thereof
01/20/2005WO2005006428A1 Underfill and mold compounds including siloxane-based aromatic diamines
01/20/2005WO2005006427A1 Method for passivating semiconductor devices
01/20/2005WO2005006426A1 High-pressure heat treatment apparatus
01/20/2005WO2005006424A1 Method and apparatus for removing a residual organic layer from a substrate using reactive gases
01/20/2005WO2005006423A1 Electroless and immersion plating of integrated circuits using an activation plate
01/20/2005WO2005006421A1 Epitaxial growth process
01/20/2005WO2005006420A1 Nitride semiconductor element and method for manufacturing thereof
01/20/2005WO2005006419A2 Substrate assembly for stressed systems
01/20/2005WO2005006414A1 Focusing optical system, light source unit, illumination optical apparatus, and exposure apparatus
01/20/2005WO2005006413A2 Semiconductor etch speed modification
01/20/2005WO2005006412A2 A method of forming an integrated circuit substrate
01/20/2005WO2005006411A2 Feedforward, feedback wafer to wafer control method for an etch process
01/20/2005WO2005006410A1 Method of manufacturing a semiconductor device and an apparatus for use in such a method
01/20/2005WO2005006409A1 Device for cleaning wafers after a cmp process
01/20/2005WO2005006408A1 Feeding facility for use in wafer processing methods
01/20/2005WO2005006407A1 Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components
01/20/2005WO2005006406A2 Methods of incorporating germanium within cmos process
01/20/2005WO2005006405A2 Reduced movement wafer box
01/20/2005WO2005006400A2 Substrate support having dynamic temperature control
01/20/2005WO2005006362A2 Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby
01/20/2005WO2005006339A2 A scalable flash eeprom memory cell with notched floating gate and graded source region, and method of manufacturing the same
01/20/2005WO2005006337A2 Variable gate bias for a reference transistor in a non-volatile memory
01/20/2005WO2005006078A1 Resist composition, multilayer body, and method for forming resist pattern
01/20/2005WO2005006004A1 Scan test design method, scan test circuit, scan test circuit insertion cad program, large-scale integrated circuit, and mobile digital device
01/20/2005WO2005005692A1 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
01/20/2005WO2005005562A2 Plasma spraying for joining silicon parts
01/20/2005WO2005005561A1 Cmp of noble metals
01/20/2005WO2005005501A1 Heat releasable wafer dicing tape
01/20/2005WO2005005404A1 Cyclic fluorine compounds, polymerizable fluoromonomers, fluoropolymers, and resist materials containing the fluoropolymers and method for pattern formation
01/20/2005WO2005005320A1 A ferroelectric ceramic compound, a ferroelectric ceramic single crystal, and preparation processes thereof
01/20/2005WO2005005278A1 Non-contact protective packaging for surface-sensitive articles
01/20/2005WO2005005096A1 Perforated plate for wafer chuck
01/20/2005WO2005005088A2 Method and apparatus for flip chip attachment by post-collapse re-melt and re-solidification of bumps
01/20/2005WO2005005063A1 Cleaning and drying a substrate
01/20/2005WO2005004978A1 Conductive elements
01/20/2005WO2004107412A3 Wafer treatment system having load lock and buffer
01/20/2005WO2004105039A3 STACKED 1T-nMEMORY CELL STRUCTURE
01/20/2005WO2004102673A3 Trenched dmos devices and processes for making same
01/20/2005WO2004102592A3 Capacitor constructions, and their methods of forming
01/20/2005WO2004102279A3 Method of manufacturing an electronic device
01/20/2005WO2004099471A3 Method of forming a layer of silicon carbide on a silicon wafer
01/20/2005WO2004096451A8 Method for forming pattern and droplet discharging device
01/20/2005WO2004095513A3 A method for plasma deposition of a substrate barrier layer
01/20/2005WO2004094701A3 Method and apparatus for monitoring, dosing, and distribution of chemical compositions
01/20/2005WO2004079783A3 Method to improve profile control and n/p loading in dual doped gate applications
01/20/2005WO2004075263A3 System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
01/20/2005WO2004073028A3 Method and apparatus for holding a substrate during high pressure processing
01/20/2005WO2004070776A3 Methods for transferring supercritical fluids in microelectronic and other industrial processes
01/20/2005WO2004068536A3 A thin film semiconductor device and method of manufacturing a thin film semiconductor device
01/20/2005WO2004066364A3 Binder diffusion patterning of a thick film paste layer
01/20/2005WO2004066348A3 Organic electronic component and method for producing organic electronic devices
01/20/2005WO2004027826A3 System and method for removing material
01/20/2005WO2004021489A3 Fixtures and methods for facilitating the fabrication of devices having thin film materials
01/20/2005WO2004001355A3 Temperature control sequence of electroless plating baths
01/20/2005WO2003103017A3 Method and system of determining chamber seasoning condition by optical emission
01/20/2005WO2003100859A3 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component
01/20/2005US20050015739 Method for creating patterns for producing integrated circuits
01/20/2005US20050015736 In-plane distribution data compression method, in-plane distribution measurement method, in-plane distribution optimization method, process apparatus control method, and process control method
01/20/2005US20050015735 Method for compressing semiconductor integrated circuit, using design region divided into plural blocks
01/20/2005US20050015691 Semiconductor integrated circuit device and test method thereof
01/20/2005US20050015660 Self-reparable semiconductor and method thereof
01/20/2005US20050015572 Semiconductor integrated circuit
01/20/2005US20050015235 Simulator and parameter extraction device for transistor, simulator and parameter extraction method for transistor, and associated computer program and storage medium