| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/27/2005 | US20050020089 Etching method used in fabrications of microstructures |
| 01/27/2005 | US20050020088 Dual depth trench isolation |
| 01/27/2005 | US20050020087 Method and apparatus for removing an edge region of a layer applied to a substrate and for coating a substrate and a substrate |
| 01/27/2005 | US20050020086 Self-aligned inner gate recess channel transistor and method of forming the same |
| 01/27/2005 | US20050020085 Fabrication of silicon-on-nothing (SON) MOSFET fabrication using selective etching of Si1-xGex layer |
| 01/27/2005 | US20050020084 Method of preparing a surface of a semiconductor wafer to make it epiready |
| 01/27/2005 | US20050020083 Method of making photomask blank substrates |
| 01/27/2005 | US20050020080 Method of depositing a diffusion barrier layer and a metal conductive layer |
| 01/27/2005 | US20050020078 Method of planarizing a surface |
| 01/27/2005 | US20050020077 Formation of protection layer by dripping DI on wafer with high rotation to prevent stain formation from H2O2/H2SO4 chemical splash |
| 01/27/2005 | US20050020076 Method for manufacturing MTJ cell of magnetic random access memory |
| 01/27/2005 | US20050020075 Method for forming isolation film for semiconductor devices |
| 01/27/2005 | US20050020074 Sealing porous dielectrics with silane coupling reagents |
| 01/27/2005 | US20050020073 Method and system for electronic spatial filtering of spectral reflectometer optical signals |
| 01/27/2005 | US20050020072 Means and method for patterning a substrate with a mask |
| 01/27/2005 | US20050020071 Method and apparatus for cleaning and method and apparatus for etching |
| 01/27/2005 | US20050020070 Etching method and apparatus |
| 01/27/2005 | US20050020069 Nickel bonding cap over copper metalized bondpads |
| 01/27/2005 | US20050020068 Plating method |
| 01/27/2005 | US20050020067 Chemistry for chemical vapor deposition of titanium containing films |
| 01/27/2005 | US20050020066 Methods of forming a semiconductor device including a metal silicide layer between a conductive plug and a bottom electrode of a capacitor |
| 01/27/2005 | US20050020065 Method of forming an oxidation-resistant TiSiN film |
| 01/27/2005 | US20050020064 Stable electroless fine pitch interconnect plating |
| 01/27/2005 | US20050020063 Method for forming flowable dielectric layer in semiconductor device |
| 01/27/2005 | US20050020061 Method of modifying conductive wiring |
| 01/27/2005 | US20050020060 Process for producing metal thin films by ALD |
| 01/27/2005 | US20050020059 Method for forming aluminum-containing interconnect |
| 01/27/2005 | US20050020058 Protecting metal conductors with sacrificial organic monolayers |
| 01/27/2005 | US20050020057 Method for fabricating a semiconductor device |
| 01/27/2005 | US20050020056 Method for an integrated circuit contact |
| 01/27/2005 | US20050020054 Formation of a contact in a device, and the device including the contact |
| 01/27/2005 | US20050020053 Method and structure for contacting an overlying electrode for a magnetoelectronics element |
| 01/27/2005 | US20050020052 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging |
| 01/27/2005 | US20050020051 Method for forming bump protective collars on a bumped wafer |
| 01/27/2005 | US20050020050 [bumping process] |
| 01/27/2005 | US20050020049 Method for an integrated circuit contact |
| 01/27/2005 | US20050020048 Method of depositing dielectric films |
| 01/27/2005 | US20050020047 Methods of forming conductive structures including titanium-tungsten base layers and related structures |
| 01/27/2005 | US20050020046 Planarization for integrated circuits |
| 01/27/2005 | US20050020045 Semiconductor device having a low-resistance gate electrode |
| 01/27/2005 | US20050020044 Method for fabricating semiconductor device having stacked-gate structure |
| 01/27/2005 | US20050020043 Methods for reducing cell pitch in semiconductor devices |
| 01/27/2005 | US20050020042 Methods of forming a semiconductor device having a metal gate electrode and associated devices |
| 01/27/2005 | US20050020041 SOI device with reduced drain induced barrier lowering |
| 01/27/2005 | US20050020040 Manufacturing method of a semiconductor device |
| 01/27/2005 | US20050020039 Semiconductor integrated circuit device manufacturing method |
| 01/27/2005 | US20050020037 Semiconductor film, semiconductor device and method of their production |
| 01/27/2005 | US20050020036 Method of fabricating a compound semiconductor layer |
| 01/27/2005 | US20050020034 [method of fabricating polysilicon film] |
| 01/27/2005 | US20050020033 Doping-assisted defect control in compound semiconductors |
| 01/27/2005 | US20050020032 Method for making thin film devices intended for solar cells or silicon-on-insulator (SOI) applications |
| 01/27/2005 | US20050020031 Methods for preparing a semiconductor assembly |
| 01/27/2005 | US20050020030 Production method for silicon wafer and soi wafer, and soi wafer |
| 01/27/2005 | US20050020029 Method of producing a contact system on the rear of a component with stacked substrates and a component equipped with one such contact system |
| 01/27/2005 | US20050020028 Method for fabricating trench isolation |
| 01/27/2005 | US20050020027 Method for manufacturing shallow trench isolation in semiconductor device |
| 01/27/2005 | US20050020026 Capacitor constructions, semiconductor constructions, and methods of forming electrical contacts and semiconductor constructions |
| 01/27/2005 | US20050020025 Semiconductor device and method of manufacturing the same |
| 01/27/2005 | US20050020024 Method for fabricating a trench capacitor with an insulation collar which is electrically connected to a substrate on one side via a buried contact, in particular for a semiconductor memory cell |
| 01/27/2005 | US20050020023 Bipolar transistor and method for producing the same |
| 01/27/2005 | US20050020022 Transistor sidewall spacer stress modulation |
| 01/27/2005 | US20050020021 Semiconductor integrated circuit device and process for manufacturing the same |
| 01/27/2005 | US20050020020 Integrated semiconductor fin device and a method for manufacturing such device |
| 01/27/2005 | US20050020019 Method for semiconductor gate line dimension reduction |
| 01/27/2005 | US20050020018 Method of manufacturing a semiconductor integrated circuit device |
| 01/27/2005 | US20050020017 Lanthanide oxide / hafnium oxide dielectric layers |
| 01/27/2005 | US20050020016 Method of controlling implantation dosages during coding of read-only memory devices |
| 01/27/2005 | US20050020015 Method for converting a planar transistor design to a vertical double gate transistor design |
| 01/27/2005 | US20050020014 Etch stop layer in poly-metal structures |
| 01/27/2005 | US20050020013 Non-volatile semiconductor memory device and a method of producing the same |
| 01/27/2005 | US20050020012 Method for manufacturing a nonvolatile memory transistor |
| 01/27/2005 | US20050020011 Magnetic memory device and method of manufacturing the same |
| 01/27/2005 | US20050020010 Method for forming non-volatile memory cell with low-temperature-formed dielectric between word and bit lines, and non-volatile memory array including such memory cells |
| 01/27/2005 | US20050020009 Memory for producing a memory component |
| 01/27/2005 | US20050020008 Collar formation using selective SiGe/Si etch |
| 01/27/2005 | US20050020007 Semiconductor element and method for its production |
| 01/27/2005 | US20050020006 Semiconductor device and method for manufacturing the same |
| 01/27/2005 | US20050020005 Manufacturing method of a micro structure |
| 01/27/2005 | US20050020004 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates |
| 01/27/2005 | US20050020003 Semiconductor process and integrated circuit |
| 01/27/2005 | US20050020002 Semiconductor device, method of fabricating same, and, electrooptical device |
| 01/27/2005 | US20050020001 Selective treatment of the surface of a microelectronic workpiece |
| 01/27/2005 | US20050020000 Transistor manufacturing method, electro-optic device and electronic instrument |
| 01/27/2005 | US20050019999 Semiconductor chip having multiple functional blocks integrated in a single chip and method for fabricating the same |
| 01/27/2005 | US20050019997 Laser annealing method and laser annealing device |
| 01/27/2005 | US20050019996 Method for fabricating a low temperature polysilicon thin film transistor |
| 01/27/2005 | US20050019995 [method of fabricating polysilicon film] |
| 01/27/2005 | US20050019994 [method of fabricating polysilicon film] |
| 01/27/2005 | US20050019993 Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage |
| 01/27/2005 | US20050019992 Method for manufacturing gate electrode for use in semiconductor device |
| 01/27/2005 | US20050019991 Method of manufacturing semiconductor device having thin film SOI structure |
| 01/27/2005 | US20050019990 [method of fabricating polysilicon film] |
| 01/27/2005 | US20050019989 Method for making a module comprising at least an electronic component |
| 01/27/2005 | US20050019988 Method and apparatus for attaching microelectronic substrates and support members |
| 01/27/2005 | US20050019987 Large area flat image sensor assembly |
| 01/27/2005 | US20050019986 Method for making electronic devices including silicon and LTCC and devices produced thereby |
| 01/27/2005 | US20050019985 Charge coupled device package |
| 01/27/2005 | US20050019982 Semiconductor package having semiconductor constructing body and method of manufacturing the same |
| 01/27/2005 | US20050019981 [method of fabricating flip chip ball grid array package] |
| 01/27/2005 | US20050019980 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |