Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2005
01/26/2005CN1569955A Electronic device manufacture
01/26/2005CN1569590A Transport mechanism and wet type processing device thereof
01/26/2005CN1569399A 抛光垫和化学机械抛光方法 Chemical mechanical polishing pad and polishing method
01/26/2005CN1569398A Polishing pad and method of polishing a semiconductor wafer
01/26/2005CN1186865C Burnin screening equipment and method for semiconductor laser
01/26/2005CN1186824C Method and apparatus for mfg. compound semiconductor device
01/26/2005CN1186823C 光电元件 Optoelectronics
01/26/2005CN1186822C Organic thin film transistor and preparing method
01/26/2005CN1186821C Double perpendicular channel thin film transistor and its manufacturing method
01/26/2005CN1186820C 半导体存储阵列及其制造方法 The semiconductor memory array and method of manufacturing
01/26/2005CN1186819C Column-foot type storage note and its contact plug and its production method
01/26/2005CN1186818C Metal wire fused wire structure possessing cavity body
01/26/2005CN1186815C Passivating glass coating liquid for improving high-temp. reversal property of glass passivating silicon device
01/26/2005CN1186814C Diffusion barrier and semiconductor device with diffusion barrier and manufacturing method thereof
01/26/2005CN1186813C Flip chip packaging structure and its preparing process
01/26/2005CN1186812C Method for manufacturing semiconductor memory device with anti-reflecting film
01/26/2005CN1186811C Compensating metal oxide semiconductor device structure and manufacturing method thereof
01/26/2005CN1186810C Semiconductor device chip scale surface assembling and packaging, and mfg. method therefor
01/26/2005CN1186809C Embedded internal storage test platform device and testing method
01/26/2005CN1186808C Method for producing circuit device
01/26/2005CN1186807C Method for producing circuit device
01/26/2005CN1186806C Chip glue packaging method and packaging method of its double-interface card
01/26/2005CN1186805C Chip attachment with reduced adhesive bleed-out
01/26/2005CN1186804C Post-treatment process of dry etched metal film and integral etching and photoresist-eliminating system
01/26/2005CN1186802C Surface planarization of thin silicon film during and after processing by sequential lateral solidification method
01/26/2005CN1186801C Process improvements for titanium-tungsten alloy etching in presence of connecting solder project of electroplated control sagging chip
01/26/2005CN1186800C Open tube zinc diffusing method for producing indium-gallium-arsenic photoelectric detector
01/26/2005CN1186799C Shared bit line cross point storage array
01/26/2005CN1186786C Diluted magnetic ZnO-base semiconductor prepared by sol-gel method
01/26/2005CN1186780C Film magnet memory capable of fast and stable reading data
01/26/2005CN1186739C Selectively processing system for work piece and control method thereof
01/26/2005CN1186700C Adaptive sampling method for improving control in semiconductor manufacturing
01/26/2005CN1186684C Display unit and its manufacture
01/26/2005CN1186644C System, method and appts. suitable for actively selecting scan test
01/26/2005CN1186643C Method and apparatus for testing signal paths between integrated circuit wafer and wafer tester
01/26/2005CN1186642C Reliability of vias and e-beam probing diagnosis
01/26/2005CN1186476C Device and method for detecting and preventing arcing in RF plasma systems
01/26/2005CN1186388C Semiconductor packing epoxy resin composition and its making process and semiconductor device
01/26/2005CN1186166C Heating head for hot-pressing bonding and making method thereof
01/26/2005CN1186128C Electrode forming method on electronic component part and conductive paste coating device
01/25/2005US6848055 Integrated circuit having various operational modes and a method therefor
01/25/2005US6847730 Automated substrate processing system
01/25/2005US6847577 Semiconductor memory with inter-block bit wires and inter-block ground wires
01/25/2005US6847574 Enhanced fuse configuration for low-voltage flash memories
01/25/2005US6847557 Method of erasing non-volatile memory data
01/25/2005US6847556 Method for operating NOR type flash memory device including SONOS cells
01/25/2005US6847545 Magnetic thin film element, memory element using the same, and method for recording and reproducing using the memory element
01/25/2005US6847542 SRAM cell and integrated memory circuit using the same
01/25/2005US6847540 Semiconductor memory device and control method thereof
01/25/2005US6847527 Interconnect module with reduced power distribution impedance
01/25/2005US6847516 Electrostatic chuck for preventing an arc
01/25/2005US6847512 Electrostatic breakdown prevention circuit for semiconductor device
01/25/2005US6847511 Circuit protecting against electrostatic discharge
01/25/2005US6847485 Beam shaping element for use in a lithographic system
01/25/2005US6847458 Method and apparatus for measuring the shape and thickness variation of polished opaque plates
01/25/2005US6847444 Surface inspecting apparatus and method
01/25/2005US6847432 Alignment system and projection exposure apparatus
01/25/2005US6847430 Lithographic apparatus and device manufacturing method
01/25/2005US6847343 Active matrix type display device
01/25/2005US6847252 Semiconductor integrated circuit device
01/25/2005US6847222 Apparatus for measuring voltage fluctuation waveform in semiconductor integrated circuit, and semiconductor integrated circuit having function for measuring voltage fluctuation waveform
01/25/2005US6847221 Probe pin assembly
01/25/2005US6847218 Probe card with an adapter layer for testing integrated circuits
01/25/2005US6847202 Apparatus for recognizing working position of device transfer system in semiconductor device test handler and method thereof
01/25/2005US6847134 Displacement device
01/25/2005US6847124 Semiconductor device and fabrication method thereof
01/25/2005US6847121 Semiconductor device and package product of the semiconductor device
01/25/2005US6847120 Flip chip semiconductor device having signal pads arranged outside of power supply pads
01/25/2005US6847118 Thin cap layer of tin on an outer surface of a lead rich ball attached to a semiconductor; lead and tin are diffused and intermixed after reflowing and annealing
01/25/2005US6847117 Semiconductor device including a passivation film to cover directly an interface of a bump and an intermediated layer
01/25/2005US6847114 Micro-scale interconnect device with internal heat spreader and method for fabricating same
01/25/2005US6847112 Semiconductor device and manufacturing the same
01/25/2005US6847110 Method and apparatus for conducting heat in a flip-chip assembly
01/25/2005US6847109 Area array semiconductor package and 3-dimensional stack thereof
01/25/2005US6847108 Semiconductor integrated circuit
01/25/2005US6847103 Semiconductor package with exposed die pad and body-locking leadframe
01/25/2005US6847102 Low profile semiconductor device having improved heat dissipation
01/25/2005US6847099 Offset etched corner leads for semiconductor package
01/25/2005US6847098 Non-floating body device with enhanced performance
01/25/2005US6847097 Glass substrate assembly, semiconductor device and method of heat-treating glass substrate
01/25/2005US6847096 Semiconductor wafer having discharge structure to substrate
01/25/2005US6847093 Semiconductor integrated circuit device
01/25/2005US6847092 Microelectronic capacitor structure with radial current flow
01/25/2005US6847091 Vertical semiconductor component having a reduced electrical surface field
01/25/2005US6847089 Gate edge diode leakage reduction
01/25/2005US6847088 Non-volatile semiconductor memory devices and methods for manufacturing the same
01/25/2005US6847087 Bi-directional Fowler-Nordheim tunneling flash memory
01/25/2005US6847086 Semiconductor device and method of forming the same
01/25/2005US6847085 High aspect ratio contact surfaces having reduced contaminants
01/25/2005US6847084 Semiconductor device
01/25/2005US6847083 Semiconductor device, electro-optic device, and electronic instrument
01/25/2005US6847082 Semiconductor integrated device including an electrostatic breakdown protection circuit having uniform electrostatic surge response
01/25/2005US6847081 Dual gate oxide high-voltage semiconductor device
01/25/2005US6847080 Semiconductor device with high and low breakdown voltage and its manufacturing method
01/25/2005US6847079 Semiconductor device having a stacked gate insulation film and a gate electrode and manufacturing method thereof
01/25/2005US6847078 Non-volatile memory device and method of forming the same
01/25/2005US6847077 Capacitor for a semiconductor device and method for fabrication therefor
01/25/2005US6847076 Enhanced retention time for embedded dynamic random access memory (DRAM)
01/25/2005US6847075 Semiconductor integrated circuit apparatus and fabrication method thereof
01/25/2005US6847074 Semiconductor memory device