| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/13/2005 | US20050006683 Capacitor and method for fabricating ferroelectric memory device with the same |
| 01/13/2005 | US20050006681 Semiconductor memory device and method for fabricating the same |
| 01/13/2005 | US20050006680 Ferroelectric memory devices with improved ferroelectric properties and associated methods for fabricating such memory devices |
| 01/13/2005 | US20050006677 Photodiode having three doped regions, photodetector incorporating such a photodiode and method of operating such a photodetector |
| 01/13/2005 | US20050006675 Semiconductor device having a gate insulating film structure including an insulating film containing metal, silicon and oxygen and manufacturing method thereof |
| 01/13/2005 | US20050006674 Semiconductor device and method for manufacturing semiconductor device |
| 01/13/2005 | US20050006673 Nanowhiskers with PN junctions, doped nanowhiskers, and methods for preparing them |
| 01/13/2005 | US20050006672 Method of fabricating semiconductor memory device and semiconductor memory device driver |
| 01/13/2005 | US20050006671 System and method based on field-effect transistors for addressing nanometer-scale devices |
| 01/13/2005 | US20050006669 Group III nitride based flip-chip integrated circuit and method for fabricating |
| 01/13/2005 | US20050006668 Semiconductor device package |
| 01/13/2005 | US20050006666 Method of manufacturing a semiconductor device having a U-shaped gate structure |
| 01/13/2005 | US20050006665 Carbon containing silicon oxide film having high ashing tolerance and adhesion |
| 01/13/2005 | US20050006664 Semisonductor device |
| 01/13/2005 | US20050006663 Implant-controlled-channel vertical JFET |
| 01/13/2005 | US20050006655 Laser beam treatment device and semiconductor device |
| 01/13/2005 | US20050006653 Electrode layer, light generating device including the same and method of forming the same |
| 01/13/2005 | US20050006647 Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic system |
| 01/13/2005 | US20050006646 Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device |
| 01/13/2005 | US20050006645 [thin film transistor and fabricating method thereof] |
| 01/13/2005 | US20050006644 Electroless deposition of doped noble metals and noble metal alloys |
| 01/13/2005 | US20050006639 Semiconductor electronic devices and methods |
| 01/13/2005 | US20050006637 Semiconductor device and method of manufacturing the same |
| 01/13/2005 | US20050006635 Semiconductor apparatus, method for growing nitride semiconductor and method for producing semiconductor apparatus |
| 01/13/2005 | US20050006606 Missing die detection |
| 01/13/2005 | US20050006605 Lithography device |
| 01/13/2005 | US20050006603 Charged particle beam exposure method, charged particle beam exposure apparatus, and device manufacturing method |
| 01/13/2005 | US20050006583 Method of inspecting pattern and inspecting instrument |
| 01/13/2005 | US20050006581 Method and scanning electron microscope for measuring width of material on sample |
| 01/13/2005 | US20050006563 Lithographic apparatus, method of calibrating, and device manufacturing method |
| 01/13/2005 | US20050006560 Film forming apparatus and film forming method |
| 01/13/2005 | US20050006556 In situ substrate holder leveling method and apparatus |
| 01/13/2005 | US20050006374 Systems for supporting ceramic susceptors |
| 01/13/2005 | US20050006361 Machining apparatus utilizing laser beam |
| 01/13/2005 | US20050006358 Laser beam processing method and laser beam processing machine |
| 01/13/2005 | US20050006348 Method and apparatus for processing a substrate with rinsing liquid |
| 01/13/2005 | US20050006347 Hard mask removal |
| 01/13/2005 | US20050006346 Method for providing uniform removal of organic material |
| 01/13/2005 | US20050006344 Method and apparatus for deciding cause of abnormality in plasma processing apparatus |
| 01/13/2005 | US20050006341 Interferometric endpoint detection in a substrate etching process |
| 01/13/2005 | US20050006335 Method of forming high resolution electronic circuits on a substrate |
| 01/13/2005 | US20050006325 Wafer protective cassette |
| 01/13/2005 | US20050006266 Container for housing a mask blank, method of housing a mask blank, and mask blank package |
| 01/13/2005 | US20050006245 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 01/13/2005 | US20050006244 Electrode assembly for electrochemical processing of workpiece |
| 01/13/2005 | US20050006230 Semiconductor processing system |
| 01/13/2005 | US20050006229 useful in contact vias where high conductivity of the via is important, and a lower resistivity barrier layer provides improved overall via conductivity |
| 01/13/2005 | US20050006224 Mechanical or electromechanical systems, real time feedback control operating on a time scale commensurate with the formation of nanoscale solid state features |
| 01/13/2005 | US20050006222 Self-ionized and inductively-coupled plasma for sputtering and resputtering |
| 01/13/2005 | US20050006029 Method and apparatus for picking up work piece and mounting machine |
| 01/13/2005 | US20050006027 of wafers; circuit with a variable capacitor that sets the initial phase angle of the measurement circuit to about zero and alters the phase angle; improved detection under noisy conditions |
| 01/13/2005 | US20050006026 Transfer apparatus, cleaning apparatus, chemical processing apparatus, and method for manufacturing circuit substrate |
| 01/13/2005 | US20050005996 Liquid droplet ejection apparatus, method of ejecting liquid droplet, method of manufacturing electrooptic device, electrooptic device, electronic device, and substrate |
| 01/13/2005 | US20050005994 Method for supplying gas while dividing to chamber from gas supply facility equipped with flow controller |
| 01/13/2005 | US20050005957 Cleaning apparatus for cleaning objects to be treated with use of cleaning composition |
| 01/13/2005 | US20050005953 Installation for treating semiconductor wafers |
| 01/13/2005 | US20050005948 Atmospheric pressure non-thermal plasma device to clean and sterilize the surfaces of probes, cannulas, pin tools, pipettes and spray heads |
| 01/13/2005 | US20050005859 Ring mechanism, and plasma processing device using the ring mechanism |
| 01/13/2005 | US20050005858 Susceptor with epitaxial growth control devices and epitaxial reactor using the same |
| 01/13/2005 | US20050005855 Plasma enhanced pulsed layer deposition |
| 01/13/2005 | US20050005854 Surface wave plasma treatment apparatus using multi-slot antenna |
| 01/13/2005 | US20050005850 Method of fabricating an EL display device, and apparatus for forming a thin film |
| 01/13/2005 | US20050005849 Semiconductor processing system |
| 01/13/2005 | US20050005847 Semiconductor processing system and semiconductor carrying mechanism |
| 01/13/2005 | US20050005845 Apparatus and method for in-situ chamber cleaning in a compound semiconductor etching system |
| 01/13/2005 | US20050005844 Process and apparatus for forming oxide film, and electronic device material |
| 01/13/2005 | US20050005808 Transfer system and semiconductor manufacturing system |
| 01/13/2005 | US20050005801 Method and device for forming a surface structure on a wafer |
| 01/13/2005 | US20050005799 Method for forming thin film pattern, device and production method therefor, electro-optical apparatus and electronic apparatus, and production method for active matrix substrate |
| 01/13/2005 | US20050005748 Using laser ; electronics covered with protective coating of potting compound |
| 01/13/2005 | US20050005722 Positioning device |
| 01/13/2005 | US20050005707 Gap adjustment apparatus and gap adjustment method for adjusting gap between two objects |
| 01/13/2005 | US20050005702 Transporting tool for object to be tested, and object-to-be-tested transporting system |
| 01/13/2005 | US20050005629 Anti-stratification-solution delivery system for spin-on dielectrics |
| 01/13/2005 | US20050005525 Non-polymeric organic particles for chemical mechanical planarization |
| 01/13/2005 | US20050005466 Apparatus for measuring horizontal level of a wafer chuck |
| 01/13/2005 | US20050005434 Method, system, and apparatus for high volume transfer of dies |
| 01/13/2005 | DE10334634B3 Lateral contacting method for semiconductor chip, by applying adhesive layer, pressing on particle of thermally fusible material, applying semiconductor chip and heating |
| 01/13/2005 | DE10333549B3 Charge trapping memory cell used as transistor comprises semiconductor body or substrate having upper side with curve in channel region |
| 01/13/2005 | DE10328250A1 Surface processing method e.g. for lenses and semiconductors, requires generating plasma beam at specified pressure and bringing beam into contact with workpiece |
| 01/13/2005 | DE10327709A1 Integrierte Schaltungsanordnung mit npn- und pnp-Bipolartransistoren sowie Herstellungsverfahren Integrated circuit with NPN and PNP bipolar transistors and manufacturing processes |
| 01/13/2005 | DE10327126A1 Chip modules manufacturing procedure for construction of electronic equipment involves adhering cover foil, with cutouts for chip modules, onto substrate strip, and pouring in cast material |
| 01/13/2005 | DE10326805A1 Speicherzelle und Herstellungsverfahren Memory cell, and manufacturing method |
| 01/13/2005 | DE10326508A1 Semiconductor circuit arrangement comprises a thin carrier substrate containing semiconductor components, a galvanic seed layer, a galvanic filler material galvanically formed on the seed layer and a material resistant to shearing stress |
| 01/13/2005 | DE10326507A1 Verfahren zur Herstellung eines bruchfesten scheibenförmigen Gegenstands sowie zugehörige Halbleiterschaltungsanordung A process for producing a shatter-resistant disc-shaped object and associated Halbleiterschaltungsanordung |
| 01/13/2005 | DE10325549A1 Production of relaxed semiconductor layer on semiconductor substrate used in production of high frequency circuits comprises roughening surface of substrate by dry etching, and forming semiconductor layer on surface |
| 01/13/2005 | DE10325541A1 Elektronisches Bauteil, sowie Halbleiterwafer und Bauteilträger zur Herstellung des Bauteils Electronic component, and semiconductor wafer, and the component carrier for producing the component |
| 01/13/2005 | DE10309266B3 Verfahren zum Bilden einer Öffnung einer Licht absorbierenden Schicht auf einer Maske A method of forming an opening of a light-absorbing layer on a mask |
| 01/13/2005 | DE10257707A1 Verfahren zum Herstellen eines gestapelten Chip-Paketes A method of manufacturing a stacked chip package |
| 01/13/2005 | DE102004030268A1 Making power semiconductor component with thermal activation of doped layers employs pulsed laser beams in successive localized heating operations causing activation |
| 01/13/2005 | DE102004030237A1 Herstellungsverfahren für ein Halbleiterbauelement Manufacturing method of a semiconductor device |
| 01/13/2005 | DE102004029843A1 Semiconductor device, i.e. memory circuit for board on chip configuration, comprises power supply line formed over second portion of landing pads |
| 01/13/2005 | DE102004028331A1 Verfahren zum Kristallisieren von Silicium Method of crystallizing silicon |
| 01/13/2005 | DE102004027960A1 Elektrische Leistungs-Halbleitervorrichtung Electrical power semiconductor device |
| 01/13/2005 | DE102004027176A1 Semiconductor device manufacturing method e.g. for diode, involves performing electro-less plating of nickel on aluminum electrode, after forming insulation film on open electrode |
| 01/13/2005 | DE102004026434A1 Wire Bonder Wire Bonder |
| 01/13/2005 | DE102004021156A1 Flüssigkristalldisplay und Verfahren zu dessen Herstellung Liquid crystal display and method for its production |
| 01/13/2005 | DE102004017533A1 Verfahren zum Ätzen von porösem Dielektrikum A method of etching of porous dielectric |
| 01/13/2005 | DE102004014179A1 Chemical mechanical polishing pad for monitoring chemical mechanical polishing process or detecting end point, comprises polishing layer including pseudo window area, having thickness less than thickness of polishing layer |
| 01/13/2005 | DE102004012845A1 Verfahren zur Herstellung einer Halbleitervorrichtung, Halbleitervorrichtung, Schaltungssubstrat und elektronischer Apparat A process for producing a semiconductor device, semiconductor device, electronic circuit substrate and apparatus |