Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2013
12/24/2013DE102013211553A1 Monitorstrukturen und verfahren zu ihrer bildung Monitor structures and procedures for their education
12/24/2013DE102013106459A1 Elektrothermische Kühlvorrichtungen und Verfahren zu ihrer Herstellung Electrothermal cooling devices and processes for their preparation
12/24/2013DE102013106309A1 Vorrichtungskontakt, Gehäuse einer elektrischen Vorrichtung und Verfahren zur Herstellung eines Gehäuses einer elektrischen Vorrichtung Contact device, the housing of an electrical device and method of manufacturing a housing of an electrical device
12/24/2013DE102013106299A1 Chipanordnungen und ein Verfahren zum Ausbilden einer Chipanordnung Chip assemblies, and a method of forming a chip assembly
12/24/2013DE102013100035A1 Ätzverfahren für III-V Halbleitermaterialien Etching of III-V semiconductor materials
12/24/2013DE102013010245A1 Halbleitervorrichtung Semiconductor device
12/24/2013DE102012222927A1 Gerät zur Abscheidung organischer Schichten, Verfahren zum Fertigen von Geräten mit organischer lichtemittierender Anzeige unter Verwendung desselben und unter Verwendung des Verfahrens gefertigte Geräte mit organischer lichtemittierender Anzeige Apparatus for deposition of organic layers, methods of fabricating devices with organic light-emitting display using the same and fabricated using the method of devices with organic light-emitting display
12/24/2013DE102012210615A1 Conductive paste for forming electrode and wiring layer in or on hetero-junction solar cell, comprises silver-organic compound and/or silver oxide as metal precursors, and reducing agents promoting decomposition of metal precursors
12/24/2013DE102012210527A1 Verfahren zur Herstellung einer Diode und Diode Process for the preparation of a diode and diode
12/24/2013DE102012210480A1 Verfahren zum Herstellen eines Bauelements mit einer elektrischen Durchkontaktierung A method of manufacturing a device having an electrical plated-through hole
12/24/2013DE102012210472A1 Verfahren zum Herstellen eines Bauelements mit einer elektrischen Durchkontaktierung A method of manufacturing a device having an electrical plated-through hole
12/24/2013DE102012206478B4 Extrem-dünner-Halbleiter-auf-Isolator(ETSOI)-FET mit einem Rück-Gate und verringerter Parasitärkapazität sowie Verfahren zu dessen Herstellung Ultra-thin semiconductor-on-insulator (ETSOI)-FET having a back gate and a reduced parasitic capacitance, as well as method for its preparation
12/24/2013DE102011083139B4 Substratbehandlungsverfahren und Substratbehandlungsanlage The substrate processing method and substrate processing system
12/24/2013DE102010003533B4 Substratanordnung, Verfahren zur Herstellung einer Substratanordnung, Verfahren zur Herstellung eines Leistungshalbleitermoduls und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung Substrate assembly process for the preparation of a substrate assembly, method for producing a power semiconductor module and method of producing a power semiconductor module assembly
12/24/2013DE102010003451B4 Austauschgateverfahren für Metallgatestapel mit großem ε durch Vermeiden eines Polierprozesses zum Freilegen des Platzhaltermaterials Replacement gate process for metal gate stack with large ε by avoiding a polishing process to expose the placeholder material
12/24/2013DE102009040537B4 Mehrschichtiges Folienelement sowie Verfahren zur Bereitstellung eines Schwingkreises A multilayer film element and method of providing a resonant circuit
12/24/2013DE102009029644B4 Halbleiterbauelementanordnung zur Reduzierung von Querströmen in einem Halbleiterkörper A semiconductor device assembly for the reduction of shunt current in a semiconductor body
12/24/2013DE102008011810B4 Lichtemittierendes Bauteil und Verwendung sowie Herstellungsverfahren eines solchen The light-emitting device and manufacturing method and use of such
12/19/2013WO2013188602A1 Optical surface scanning systems and methods
12/19/2013WO2013188573A1 Method for forming staircase word lines in a 3d non-volatile memory having vertical bit lines
12/19/2013WO2013188547A1 Linear stage and metrology architecture for reflective electron beam lithography
12/19/2013WO2013188519A1 Workpiece carrier
12/19/2013WO2013188416A1 N-channel and p-channel end-to-end finfet cell architecture with relaxed gate pitch
12/19/2013WO2013188410A2 N-channel and p-channel end-to-end finfet cell architecture
12/19/2013WO2013188379A1 Methods of manufacture and use of customized flexomaster patterns for flexographic printing
12/19/2013WO2013188232A1 Apparatus and methods for inspecting extreme ultra violet reticles
12/19/2013WO2013188218A1 Methods for texturing a semiconductor material
12/19/2013WO2013188213A1 High sampling rate sensor buffering in semiconductor processing systems
12/19/2013WO2013188125A1 Melt depth determination using infrared interferometric technique in pulsed laser annealing
12/19/2013WO2013187751A1 Fabrication method of thick bottom oxide in deep trench of metal oxide semiconductor field effect transistors
12/19/2013WO2013187677A1 Method for coating carbon nanotubes containing an insulation layer, and vacuum suction apparatus coated with carbon nanotubes
12/19/2013WO2013187675A1 Carbon nanotube coating film and carbon nanotube solution composition for forming the carbon nanotube coating film
12/19/2013WO2013187624A1 Substrate processing system having breakage-preventing function
12/19/2013WO2013187537A1 Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board
12/19/2013WO2013187520A1 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film used therefor, and electronic device manufacturing method and electronic device using the same
12/19/2013WO2013187518A1 Adhesive composition and semiconductor device using same
12/19/2013WO2013187510A1 Dicing device and dicing method
12/19/2013WO2013187507A1 Insulating film and organic thin film transistor using same
12/19/2013WO2013187486A1 Thin-film transistor, method for producing a thin-film transistor, and semiconductor device
12/19/2013WO2013187441A1 Semiconductor wafer manufacturing method
12/19/2013WO2013187429A1 Plasma etching method and plasma treatment device
12/19/2013WO2013187358A1 Polishing material composition and production method therefor
12/19/2013WO2013187354A1 Abrasive particles and production method thereof
12/19/2013WO2013187349A1 Function-transferring object, method for transferring functional layer, package and function-transferring film roll
12/19/2013WO2013187343A1 Overlay error measuring device and computer program
12/19/2013WO2013187321A1 Coating device
12/19/2013WO2013187320A1 Substrate conveyance method and substrate conveyance device
12/19/2013WO2013187313A1 Liquid composition for cleaning, method for cleaning semiconductor element, and method for manufacturing semiconductor element
12/19/2013WO2013187300A1 Light irradiating device, and exposure device
12/19/2013WO2013187299A1 Light irradiating device, and exposure device
12/19/2013WO2013187292A1 Bonding device and method for producing semiconductor device
12/19/2013WO2013187290A1 Substrate conveyance method, and substrate conveyance device
12/19/2013WO2013187275A1 Solvent or solvent composition for organic transistor production
12/19/2013WO2013187244A1 Temporary adhesive for semiconductor device production, adhesive supporting body using same, and method for producing semiconductor device using same
12/19/2013WO2013187219A1 Etching method and plasma processing device
12/19/2013WO2013187218A1 Plasma processing device and probe device
12/19/2013WO2013187200A1 Operation analysis method for integrated circuit, and operation analysis device for integrated circuit
12/19/2013WO2013187193A1 Non-volatile logic gate element
12/19/2013WO2013187192A1 Substrate placing table and substrate processing apparatus
12/19/2013WO2013187190A1 Temporary adhesive for semiconductor-device production, adhesive support body using same, and method for producing semiconductor device
12/19/2013WO2013187187A1 Semiconductor device
12/19/2013WO2013187173A1 Display device, semiconductor device, and method for manufacturing display device
12/19/2013WO2013187140A1 Semiconductor substrate evaluating method, semiconductor substrate for evaluation, and semiconductor device
12/19/2013WO2013187121A1 Lid-opening/closing device
12/19/2013WO2013187104A1 Lid opening/closing device
12/19/2013WO2013187090A1 Substrate inverting apparatus and substrate processing apparatus
12/19/2013WO2013187079A1 Method for producing composite substrate and composite substrate
12/19/2013WO2013187078A1 Semiconductor substrate, method of manufacturing semiconductor substrate, and method of manufacturing composite substrate
12/19/2013WO2013187076A1 Semiconductor substrate, method of manufacturing semiconductor substrate, and method of manufacturing composite substrate
12/19/2013WO2013187046A1 Thin film transistor
12/19/2013WO2013187036A1 Chemical processing apparatus
12/19/2013WO2013187019A1 Silicon carbide semiconductor device and method for producing same
12/19/2013WO2013187017A1 Silicon carbide semiconductor device and method for producing same
12/19/2013WO2013186929A1 Mask protection device, exposure apparatus, and method for manufacturing device
12/19/2013WO2013186912A1 Substrate housing container minimizing intrusion of dust
12/19/2013WO2013186773A1 Visible and near infra red optical sensor
12/19/2013WO2013186749A1 Method for depositing a group iii nitride semiconductor film
12/19/2013WO2013186058A1 Transport and handing-over arrangement for disc-shaped substrates, vacuum treatment installation and method for manufacture treated substrates
12/19/2013WO2013186041A1 Adhesive film containing particles for the temporary protection of a workpiece surface, particularly during laser machining and composite of such a film
12/19/2013WO2013185866A1 Precursor solution for forming a semiconductor thin film on the basis of cis, cigs or czts
12/19/2013WO2013185839A1 Method for producing an optoelectronic semiconductor device comprising a connecting layer sintered under the action of heat, pressure and ultrasound
12/19/2013WO2013185804A1 Substrate-product substrate combination and device and method for producing a substrate-product substrate combination
12/19/2013WO2013185803A1 Device and method for aligning substrates
12/19/2013WO2013185526A1 Radio frequency device and preparation method thereof
12/19/2013WO2013185523A1 Semiconductor structure and method for forming the same
12/19/2013WO2013185433A1 Thin film transistor and fabrication method thereof, array substrate, and display device
12/19/2013WO2013185397A1 Semiconductor structure and manufacturing method thereof
12/19/2013WO2013151804A8 Installation fixture for elastomer bands and methods of using the same
12/19/2013WO2013128341A3 Wire arrangement for an electronic circuit and method of manufacturing the same
12/19/2013WO2013016130A3 A reactive hot-melt adhesive for use on electronics
12/19/2013US20130338818 Device and method for removing tested semiconductor components
12/19/2013US20130337661 Heat treatment method and heat treatment apparatus for heating substrate by irradiating substrate with light
12/19/2013US20130337660 Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
12/19/2013US20130337659 Novel group iv-b organometallic compound, and method for preparing same
12/19/2013US20130337658 Film deposition method
12/19/2013US20130337657 Apparatus and method for forming thin protective and optical layers on substrates
12/19/2013US20130337656 Structure and method for dual work function metal gate cmos with selective capping
12/19/2013US20130337655 Abatement and strip process chamber in a dual loadlock configuration
12/19/2013US20130337654 Clamped monolithic showerhead electrode
12/19/2013US20130337653 Semiconductor processing apparatus with compact free radical source