| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/25/2013 | CN203357255U Mechanism used for measuring thicknesses of wafers when wafers are polished |
| 12/25/2013 | CN203355935U Two-fluid spray pipe component and two-fluid etching device using two-fluid nozzle component |
| 12/25/2013 | CN103477721A Processing apparatus |
| 12/25/2013 | CN103477453A Method for producing a semiconductor body |
| 12/25/2013 | CN103477449A Light receiving element and method for manufacturing same |
| 12/25/2013 | CN103477441A Thin-film transistor, display panel, and method for producing thin-film transistor |
| 12/25/2013 | CN103477440A Organic thin film transistor |
| 12/25/2013 | CN103477439A Semiconductor device and process for production thereof |
| 12/25/2013 | CN103477438A Process for catalyst-free selective growth on a semiconductor structure |
| 12/25/2013 | CN103477433A Semiconductor substrate having dot markings, and method for producing same |
| 12/25/2013 | CN103477429A Semiconductor device and manufacturing method thereof |
| 12/25/2013 | CN103477427A Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes |
| 12/25/2013 | CN103477426A Support unit for supporting a substrate |
| 12/25/2013 | CN103477425A Processing station for flat substrates, in particular solar cells |
| 12/25/2013 | CN103477424A Method and device for the electrical bonding of connection areas of two substrates by laser soldering using a gaseous flux medium |
| 12/25/2013 | CN103477422A Low temperature silicon oxide conversion |
| 12/25/2013 | CN103477421A Method and device for detecting termination of etching |
| 12/25/2013 | CN103477420A Method for permanently bonding wafers |
| 12/25/2013 | CN103477419A Method for forming ultra-shallow doping regions by solid phase diffusion |
| 12/25/2013 | CN103477418A Nanowire epitaxy on a graphitic substrate |
| 12/25/2013 | CN103477285A System for magnetic shielding |
| 12/25/2013 | CN103477284A Chemically amplified positive photosensitive composition for an organic insulation film, and method for forming an organic insulation film using same |
| 12/25/2013 | CN103477208A Quantitative series resistance imaging of photovoltaic cells |
| 12/25/2013 | CN103476965A Method of deposition of AL2O3/SIO2 stacks, from aluminium and silicon precursors |
| 12/25/2013 | CN103476804A Active-energy-curable resin composition, molding, microrelief structure, water-repellent article, mold, and method for producing microrelief structure |
| 12/25/2013 | CN103476682A Dicing die bonding film packing structure and packing method |
| 12/25/2013 | CN103476566A Tank and method for producing polishing pad using tank |
| 12/25/2013 | CN103476546A Laminated polishing pad |
| 12/25/2013 | CN103476236A Braid strip unit and electric component detection apparatus |
| 12/25/2013 | CN103474582A Electroluminescence device and manufacturing method thereof |
| 12/25/2013 | CN103474557A Method for manufacturing light-emitting diode array |
| 12/25/2013 | CN103474527A LED chip lossless cutting method |
| 12/25/2013 | CN103474479A Vertical MIM (metal/insulator/metal) capacitor and manufacturing method thereof |
| 12/25/2013 | CN103474476A Non-volatile memory and its manufacturing method |
| 12/25/2013 | CN103474475A Thin film transistor, method for manufacturing thin film transistor, array substrate of thin film transistor and display device of thin film transistor |
| 12/25/2013 | CN103474474A TFT and manufacturing method thereof, array substrate and manufacturing method thereof and X-ray detector |
| 12/25/2013 | CN103474473A Thin film transistor switch and manufacturing method thereof |
| 12/25/2013 | CN103474471A Thin film transistor and preparation method thereof, array substrate and preparation method thereof, and display device |
| 12/25/2013 | CN103474470A Thin film transistor, array substrate and manufacturing method thereof, and display device |
| 12/25/2013 | CN103474469A Laminate structure including oxide semiconductor thin film layer, and thin film transistor |
| 12/25/2013 | CN103474466A High-voltage device and manufacturing method thereof |
| 12/25/2013 | CN103474465A Super-junction MOSFET device and manufacturing method thereof |
| 12/25/2013 | CN103474464A Tunneling field-effect transistor with composite-mechanism strip-type grid and preparation method of tunneling field-effect transistor |
| 12/25/2013 | CN103474463A MOSFET with improved performance through induced net charge region in thick bottom insulator |
| 12/25/2013 | CN103474462A Lateral double diffused metal oxide semiconductor and manufacturing method thereof |
| 12/25/2013 | CN103474461A Finned-type field-effect tube and its formation method |
| 12/25/2013 | CN103474458A Insulated gate bipolar transistor (IGBT) device and preparation method thereof |
| 12/25/2013 | CN103474457A Heterojunction bipolar transistor and manufacturing method thereof |
| 12/25/2013 | CN103474454A Semiconductor-metal-semiconductor lamination structure and preparation method thereof |
| 12/25/2013 | CN103474439A Display device, array substrate and manufacturing method of array substrate |
| 12/25/2013 | CN103474437A Array substrate, manufacturing method thereof and display device |
| 12/25/2013 | CN103474436A Array substrate, manufacturing method thereof and display device |
| 12/25/2013 | CN103474435A Array substrate and manufacturing method thereof |
| 12/25/2013 | CN103474434A Array substrate, preparation method and display device |
| 12/25/2013 | CN103474433A Thin film transistor array substrate and manufacturing method thereof |
| 12/25/2013 | CN103474432A Array substrate and preparation method and display device of array substrate |
| 12/25/2013 | CN103474430A Thin-film transistor substrate, preparation method thereof and display |
| 12/25/2013 | CN103474428A Integrated type both-way ultra-low capacitance TVS device and manufacturing method thereof |
| 12/25/2013 | CN103474427A Integrated type one-way ultra-low capacitance TVS device and manufacturing method thereof |
| 12/25/2013 | CN103474421A High-yield semiconductor device |
| 12/25/2013 | CN103474420A Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers |
| 12/25/2013 | CN103474419A Inductive element with interrupter region and method for forming |
| 12/25/2013 | CN103474418A Array substrate, manufacturing method of array substrate, and display device of array substrate |
| 12/25/2013 | CN103474417A Three-dimensional interconnection structure and manufacturing method thereof |
| 12/25/2013 | CN103474416A Interconnection structure and its formation method |
| 12/25/2013 | CN103474415A Inductor and its formation method |
| 12/25/2013 | CN103474414A Inductor and its formation method |
| 12/25/2013 | CN103474410A Power semiconductor packaging piece and wire bonding method thereof |
| 12/25/2013 | CN103474408A Gold and silver alloy bonding wire with gold-plated layer on surface and preparation method thereof |
| 12/25/2013 | CN103474407A Semiconductor package structure |
| 12/25/2013 | CN103474406A Copper-free flat packaging piece of AAQFN frame product and manufacturing process thereof |
| 12/25/2013 | CN103474401A Support plate structure and chip packaging structure and manufacturing method thereof |
| 12/25/2013 | CN103474400A Boron-free oxidation dumet wire and manufacturing processes thereof |
| 12/25/2013 | CN103474399A TFT array substrate manufacturing method, TFT array substrate and display equipment |
| 12/25/2013 | CN103474398A Method for increasing driving current of three-dimensional field effect transistor |
| 12/25/2013 | CN103474397A Method of making a FINFET device |
| 12/25/2013 | CN103474396A Manufacturing method of thin film transistor liquid crystal display (TFT-LCD) array substrate |
| 12/25/2013 | CN103474395A TSV planarization method |
| 12/25/2013 | CN103474394A TSV process method without metal CMP |
| 12/25/2013 | CN103474393A Electroplating process method capable of removing copper layer and reusing barrier layer without CMP |
| 12/25/2013 | CN103474392A Method for preparing ruthenium thin film |
| 12/25/2013 | CN103474391A Method for forming high-k metal-gate device contact hole |
| 12/25/2013 | CN103474390A Aluminum metal wire making method |
| 12/25/2013 | CN103474389A Metal interconnection structure manufacturing method |
| 12/25/2013 | CN103474388A Method of forming air space between grooves |
| 12/25/2013 | CN103474387A Method of forming air space between grooves |
| 12/25/2013 | CN103474386A Method for preparing SGOI or GOI by utilizing C adulteration SiGe preparing layer |
| 12/25/2013 | CN103474385A Chip bonding working table |
| 12/25/2013 | CN103474384A Wedge-structure precision positioning lifting platform on semiconductor processing equipment |
| 12/25/2013 | CN103474383A Silicon wafer box |
| 12/25/2013 | CN103474382A Quartz bearing boat |
| 12/25/2013 | CN103474381A Method utilizing temperature difference for monitoring positional deviation of wafer in high temperature cavity |
| 12/25/2013 | CN103474380A Ink dot cleaning device for wafer electrical performance test |
| 12/25/2013 | CN103474379A Wafer holding device in vacuum prewet cavity |
| 12/25/2013 | CN103474378A Vacuum pre-wetting device and vacuumizing pre-wetting method based on TSV manufacture procedure |
| 12/25/2013 | CN103474377A Pre-soldering jig for GPP chips and using method thereof |
| 12/25/2013 | CN103474376A Edge breaking device for DBC substrate |
| 12/25/2013 | CN103474375A Core binding machine and workpiece table thereof |
| 12/25/2013 | CN103474374A Repairing apparatus for micro-ball-loaded workpiece |
| 12/25/2013 | CN103474373A Electroplating machine material collecting device |