Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
---|
12/18/2013 | CN103456784A High-voltage P-type LDMOS (laterally diffused metal oxide semiconductor) device and manufacturing method |
12/18/2013 | CN103456783A High-breakdown-voltage P-type LDMOS (laterally diffused metal oxide semiconductor) device and manufacturing method |
12/18/2013 | CN103456782A Semiconductor device and production method thereof |
12/18/2013 | CN103456781A Compound semiconductor transistor with self aligned gate |
12/18/2013 | CN103456780A Epitaxy improved structure of pseudo crystal high electronic mobility transistor and heterojunction bipolar transistor and processing method thereof |
12/18/2013 | CN103456777A Heterojunction bipolar transistor structure with high current gain and processing method thereof |
12/18/2013 | CN103456775A Metal gate electrode of a semiconductor device |
12/18/2013 | CN103456774A Semiconductor device having non-orthogonal element |
12/18/2013 | CN103456773A Schottky diode and production method thereof |
12/18/2013 | CN103456772A Semiconductor device and method for manufacturing the same |
12/18/2013 | CN103456771A Structure for achieving control of service life of carrier in semiconductor device and manufacturing method thereof |
12/18/2013 | CN103456770A Semiconductor device having embedded strain-inducing pattern and method of forming the same |
12/18/2013 | CN103456769A Semiconductor Device with Trench Structures |
12/18/2013 | CN103456768A Semiconductor isolation structure with air gaps in deep trenches |
12/18/2013 | CN103456767A Mos structure and manufacturing method thereof |
12/18/2013 | CN103456766A Organic light emitting diode (OLED) panel thinning device, system and method |
12/18/2013 | CN103456760A Organic light emitting display device and method of manufacturing the same |
12/18/2013 | CN103456756A Active pixel structure and manufacture method thereof |
12/18/2013 | CN103456752A Cmos image sensor and method for forming the same |
12/18/2013 | CN103456747A Array substrate, manufacturing method of array substrate and display device |
12/18/2013 | CN103456746A Array substrate, manufacturing method thereof and display device |
12/18/2013 | CN103456745A Array substrate, manufacturing method thereof and display device |
12/18/2013 | CN103456744A Array substrate, preparing method of array substrate and display device |
12/18/2013 | CN103456743A Array substrate, manufacturing method of array substrate, flexible display device and electronic device |
12/18/2013 | CN103456742A Array substrate, manufacturing method of array substrate and display device |
12/18/2013 | CN103456741A Array substrate, manufacturing method of array substrate and display device |
12/18/2013 | CN103456740A Pixel unit and manufacturing method thereof, array substrate and display device |
12/18/2013 | CN103456739A Array substrate, manufacturing method thereof and display device |
12/18/2013 | CN103456737A Semiconductor device and method of manufacturing the same |
12/18/2013 | CN103456736A Semiconductor device and method of forming the same |
12/18/2013 | CN103456735A Cmos device and manufacturing method thereof |
12/18/2013 | CN103456734A Asymmetric LDMOS process deviation monitoring structure and manufacturing method thereof |
12/18/2013 | CN103456731A Low voltage protection devices for precision transceivers and methods of forming the same |
12/18/2013 | CN103456723A Ferroelectric crystal film, electronic component, manufacturing method of ferroelectric crystal film, and manufacturing apparatus therefor |
12/18/2013 | CN103456717A Measurement structure and method for resistance of active region and polysilicon bevels on semiconductor device |
12/18/2013 | CN103456716A Three-dimensional multi-chip stacking module and manufacturing method thereof |
12/18/2013 | CN103456715A Intermediary base material and manufacturing method thereof |
12/18/2013 | CN103456714A Semiconductor device and method of manufacturing thereof |
12/18/2013 | CN103456711A Fin-type anti-fuse structure and manufacturing method thereof |
12/18/2013 | CN103456710A Mos device and manufacturing method thereof |
12/18/2013 | CN103456708A Devices and methods for improved reflective electron beam lithography |
12/18/2013 | CN103456707A Semiconductor packaging structure and manufacturing method |
12/18/2013 | CN103456706A Discrete semiconductor device package and manufacturing method |
12/18/2013 | CN103456704A Design scheme for connector site spacing and resulting structures |
12/18/2013 | CN103456703A Semiconductor package and fabrication method thereof |
12/18/2013 | CN103456701A Integrated circuit die assembly with heat spreader |
12/18/2013 | CN103456699A Integrated circuit packaging structure and packaging method thereof |
12/18/2013 | CN103456698A Chip package structure and chip packaging method |
12/18/2013 | CN103456697A Isolation rings for packages and the method of forming the same |
12/18/2013 | CN103456696A Package substrate and method of manufacturing the same |
12/18/2013 | CN103456694A Semiconductor device with air gap and method for fabricating the same |
12/18/2013 | CN103456693A Middle in-situ doped sige junctions for pmos devices |
12/18/2013 | CN103456692A Method for forming complementary metal-oxide-semiconductor tube |
12/18/2013 | CN103456691A CMOS (complementary metal oxide semiconductor) manufacturing method |
12/18/2013 | CN103456690A Semiconductor device and manufacturing method of semiconductor device |
12/18/2013 | CN103456689A Device for separating flexible substrate from glass substrate and production device |
12/18/2013 | CN103456688A Interposer die for semiconductor packaging |
12/18/2013 | CN103456687A Array substrate and manufacturing method thereof |
12/18/2013 | CN103456686A Method of manufacturing semiconductor device |
12/18/2013 | CN103456685A Manufacturing method for TSV and first layer re-wiring layer needless of using CMP |
12/18/2013 | CN103456684A Manufacturing method of temperature safety valve (TSV) back connection end |
12/18/2013 | CN103456683A Methods of forming a through via structure, image sensor and integrated circuit |
12/18/2013 | CN103456682A Semiconductor processing method and semiconductor structure |
12/18/2013 | CN103456681A Method and apparatus for back end of line semiconductor device processing |
12/18/2013 | CN103456680A Method for forming holes and grooves in low K medium layer |
12/18/2013 | CN103456679A Interconnection structure and manufacturing method thereof |
12/18/2013 | CN103456678A Barrier stack structure and method for forming same |
12/18/2013 | CN103456677A Semiconductor device and manufacturing method thereof |
12/18/2013 | CN103456676A Contact silicon recess etching method |
12/18/2013 | CN103456675A Shallow trench isolation structure manufacturing method and semiconductor device |
12/18/2013 | CN103456674A Method for preparing deep groove morphology analyzing sample |
12/18/2013 | CN103456673A STI (shallow trench isolation) preparation method and CMOS (complementary metal oxide semiconductor) manufacturing method |
12/18/2013 | CN103456672A Open type supporting board for pin |
12/18/2013 | CN103456671A Wafer table and photoetching system |
12/18/2013 | CN103456670A Method of switching wafers in photoetching device |
12/18/2013 | CN103456669A Thin substrate electrostatic chuck system and method |
12/18/2013 | CN103456668A Method and device for peeling off silicon wafers |
12/18/2013 | CN103456667A Attaching bench |
12/18/2013 | CN103456666A Wafer cleaning device with a plurality of groups of bayonets and wafer cleaning method |
12/18/2013 | CN103456665A Substrate treating apparatus and substrate treating method |
12/18/2013 | CN103456664A Apparatus and method for drying substrate |
12/18/2013 | CN103456663A Substrate treating apparatus and substrate treating method |
12/18/2013 | CN103456662A Substrate separation device and method for separating the substrate using thereof |
12/18/2013 | CN103456661A UV curing system for semiconductors |
12/18/2013 | CN103456660A Plasma reinforcement cleaning device and system and method for cleaning wafers |
12/18/2013 | CN103456659A Method for manufacturing photoetching registration mark for manufacturing semiconductor device |
12/18/2013 | CN103456658A Detection method of semiconductor blind holes |
12/18/2013 | CN103456657A Detection method of blind holes |
12/18/2013 | CN103456656A Detection method of semiconductor blind holes |
12/18/2013 | CN103456655A Detection method of semiconductor blind holes |
12/18/2013 | CN103456654A Measurement method |
12/18/2013 | CN103456653A Detection method of semiconductor blind holes |
12/18/2013 | CN103456652A Mixed bonding implementation method |
12/18/2013 | CN103456651A Slice bonding working table |
12/18/2013 | CN103456650A Eyepoint training method for wire bond and related semiconductor processing operation |
12/18/2013 | CN103456649A Method for encapsulating semiconductors |
12/18/2013 | CN103456648A Protecting method of diode/transistor wafer PN junction |
12/18/2013 | CN103456647A Integrated circuit packaging system with substrate and method of manufacture thereof |
12/18/2013 | CN103456646A Method for preparing multilayer low-temperature cofired ceramics integrated liquid cooling circulation channel |
12/18/2013 | CN103456645A Packaging-after etching three-dimensional system-on-chip upright stacking packaging structure and technology method |