Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2005
03/10/2005WO2005022609A1 Adhesive film and method for forming metal film using same
03/10/2005WO2005022608A2 Siliciding spacer in integrated circuit technology
03/10/2005WO2005022607A1 Component mounting apparatus and component mounting method
03/10/2005WO2005022602A2 A method and apparatus for semiconductor processing
03/10/2005WO2005022592A2 Novel aqueous based metal etchant
03/10/2005WO2005022591A2 Reversible leadless package and methods of making and using same
03/10/2005WO2005022580A1 Heterojunction bipolar transistor with tunnelling mis emitter junction
03/10/2005WO2005022268A1 Liquid photoresist remover composition for substrate comprising silver and/or silver alloy, process for producing pattern with the same, and display employing the same
03/10/2005WO2005022262A1 Thin film transistor, manufacturing method for thin film transistor and manufacturing method for display device
03/10/2005WO2005022261A1 Polyamide acid-containing composition for forming antireflective film
03/10/2005WO2005022259A2 Attaching a pellicle frame to a reticle
03/10/2005WO2005022249A2 Laser thermal processing with laser diode radiation
03/10/2005WO2005021842A2 High-purity crystal growth
03/10/2005WO2005021832A2 Method and appartus for depositing materials with tunable properties
03/10/2005WO2005021828A2 Copper-containing pvd targets and methods for their manufacture
03/10/2005WO2005021669A1 Microsystem component and method for gluing microcomponents to a substrate
03/10/2005WO2005021647A1 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
03/10/2005WO2005021428A1 Boron nitride agglomerated powder
03/10/2005WO2005021267A1 Liquid discharge head, liquid discharge device, and method for manufacturing liquid discharge head
03/10/2005WO2005021258A1 Surface protection film and method for producing same
03/10/2005WO2005021173A1 Method of cleaning substrate processing chamber components having textured surfaces
03/10/2005WO2004108566A3 Conveyor for plate-shaped members
03/10/2005WO2004102592B1 Capacitor constructions, and their methods of forming
03/10/2005WO2004073036A3 High-pressure processing chamber for a semiconductor wafer
03/10/2005WO2004065934A3 Semiconductor fabrication method for making small features
03/10/2005WO2004063774A3 Optical monitoring of thin film deposition
03/10/2005WO2004057631A3 Reduction of dislocation pile-up formation during relaxed lattice-mismatched epitaxy
03/10/2005WO2004051713A3 Integrated process condition sensing wafer and data analysis system
03/10/2005WO2004046023A3 Fabrication of light emitting film coated fullerenes and their application for in-vivo light emission
03/10/2005WO2004044954A3 Gcib processing of integrated circuit interconnect structures
03/10/2005WO2004033758A3 Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof
03/10/2005WO2004013381A3 Insoluble anode loop in copper electrodeposition cell for interconnect formation
03/10/2005WO2004008816A3 Method and device for substrate etching with very high power inductively coupled plasma
03/10/2005WO2004003964A3 Discharge radiation source, in particular uv radiation
03/10/2005WO2003056609A3 Apparatus and method for electroplating a wafer surface
03/10/2005WO2003049159A8 Methods of forming capacitors and methods of forming capacitor dielectric layers
03/10/2005US20050055654 Method for checking an IC layout
03/10/2005US20050055651 Semiconductor device, and design method, inspection method, and design program therefor
03/10/2005US20050055611 Method of testing semiconductor apparatus
03/10/2005US20050055494 Structure and method for silicided metal gate transistors
03/10/2005US20050055122 Overlay registration control system and method employing multiple pilot lot in-line overlay registration measurement
03/10/2005US20050055016 Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
03/10/2005US20050054549 Using mixture of hydrofluoric acid and ammonia; cleaning metal gates; removal photoresists; corrosion resistance
03/10/2005US20050054548 Using mixture of hydroxylamine, hydroxide, antifoam agents,cleaner, precipitation inhibitor and water; printed circuits
03/10/2005US20050054274 Semiconductor wafer processing method and processing apparatus
03/10/2005US20050054272 Polishing method
03/10/2005US20050054268 Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
03/10/2005US20050054267 Polishing method
03/10/2005US20050054266 Pressure control system and polishing apparatus
03/10/2005US20050054217 Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
03/10/2005US20050054216 Methods of forming patterned photoresist layers over semiconductor substrates
03/10/2005US20050054215 Patterned functionalized silicon surfaces
03/10/2005US20050054214 Method for mitigating chemical vapor deposition phosphorus doping oxide surface induced defects
03/10/2005US20050054213 Methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and methods of forming trench isolation in the fabrication of integrated circuitry
03/10/2005US20050054210 Multiple exposure method for forming patterned photoresist layer
03/10/2005US20050054209 Plasma treatment method to reduce silicon erosion over HDI silicon regions
03/10/2005US20050054208 Electrospray systems and methods
03/10/2005US20050054207 Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer received operably proximate conductive electrodes
03/10/2005US20050054206 Etching method and recipe for forming high aspect ratio contact hole
03/10/2005US20050054205 Mask trimming apparatus and mask trimming method
03/10/2005US20050054204 Method of rounding top corner of trench
03/10/2005US20050054203 Polishing composition
03/10/2005US20050054202 Method for simultaneous degas and baking in copper damascene process
03/10/2005US20050054201 Filling small dimension vias using supercritical carbon dioxide
03/10/2005US20050054200 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates
03/10/2005US20050054197 Method for predicting the behavior of dopant and defect components
03/10/2005US20050054196 Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology
03/10/2005US20050054195 Semiconductor device and method for fabricating the same
03/10/2005US20050054194 Method for forming dual damascenes
03/10/2005US20050054193 [interconnect process and method for removing metal silicide]
03/10/2005US20050054192 Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer
03/10/2005US20050054191 Interconnect with composite barrier layers and method for fabricating the same
03/10/2005US20050054190 Semiconductor device and method of manufacturing the same
03/10/2005US20050054189 Methods of fabricating integrated circuit devices providing improved short prevention
03/10/2005US20050054188 Semiconductor device and method of manufacturing the same
03/10/2005US20050054187 Method for forming ball pads of BGA substrate
03/10/2005US20050054186 Wire bonding method, semiconductor chip, and semiconductor package
03/10/2005US20050054185 Capping layer for crystallizing germanium, and substrate having thin crystallized germanium layer
03/10/2005US20050054184 Method for fabricating microstructures and arrangement of microstructures
03/10/2005US20050054183 Method for forming contact having low resistivity using porous plug and method for forming semiconductor devices using the same
03/10/2005US20050054182 Method for suppressing boron penetration by implantation in P+ MOSFETS
03/10/2005US20050054181 Method of manufacturing a semiconductor device
03/10/2005US20050054180 Threading-dislocation-free nanoheteroepitaxy of Ge on Si using self-directed touch-down of Ge through a thin SiO2 layer
03/10/2005US20050054179 Method and apparatus for splitting semiconductor wafer
03/10/2005US20050054178 Electric device, its manufacturing method, and electronic equipment
03/10/2005US20050054177 Triple-diffused trench MOSFET and method of fabricating the same
03/10/2005US20050054176 Method for manufacturing device isolation film of semiconductor device
03/10/2005US20050054175 Deposition of silicon germanium on silicon-on-insulator structures and bulk substrates
03/10/2005US20050054174 Corner protection to reduce wrap around
03/10/2005US20050054173 Method of manufacturing metal-oxide-semiconductor transistor
03/10/2005US20050054172 Semiconductor device and mehtod
03/10/2005US20050054171 Incorporation of carbon in silicon/silicon germanium epitaxial layer to enhance yield for Si-Ge bipolar technology
03/10/2005US20050054170 Method of producing complementary sige bipolar transistors
03/10/2005US20050054169 Method of manufacture of raised source drain mosfet with top notched gate structure filled with dielectric plug in and device manufactured thereby
03/10/2005US20050054168 Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same
03/10/2005US20050054167 Local SONOS-type nonvolatile memory device and method of manufacturing the same
03/10/2005US20050054166 Conductive metal oxide gate ferroelectric memory transistor
03/10/2005US20050054165 Atomic layer deposited ZrAlxOy dielectric layers
03/10/2005US20050054164 Strained silicon MOSFETs having reduced diffusion of n-type dopants
03/10/2005US20050054163 Method of manufacturing transistor having recessed channel
1 ... 3942 3943 3944 3945 3946 3947 3948 3949 3950 3951 3952 3953 3954 3955 3956 3957 3958 3959 3960 3961 3962 ... 6590