Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2005
03/10/2005US20050054162 Method to make minimal spacing between floating gates in split gate flash
03/10/2005US20050054161 Method of decreasing charging effects in oxide-nitride-oxide (ONO) memory arrays
03/10/2005US20050054160 Method of making nonvolatile transistor pairs with shared control gate
03/10/2005US20050054159 Semiconductor constructions, and methods of forming capacitor devices
03/10/2005US20050054158 Bulk contact mask process
03/10/2005US20050054157 Trench device structure with single-side buried strap and method for fabricating the same
03/10/2005US20050054156 Capacitor and fabrication method using ultra-high vacuum cvd of silicon nitride
03/10/2005US20050054155 Semiconductor device having fuse circuit on cell region and method of fabricating the same
03/10/2005US20050054154 Solder bump structure and method for forming the same
03/10/2005US20050054153 Method for manufacturing movable portion of semiconductor device
03/10/2005US20050054152 Symmetric inducting device for an integrated circuit having a ground shield
03/10/2005US20050054151 Symmetric inducting device for an integrated circuit having a ground shield
03/10/2005US20050054150 Apparatus and method of manufacture for integrated circuit and CMOS device including epitaxially grown dielectric on silicon carbide
03/10/2005US20050054149 Method for integrating metals having different work functions to fom cmos gates having a high-k gate dielectric and related structure
03/10/2005US20050054148 METHOD AND STRUCTURE FOR IMPROVED MOSFETs USING POLY/SILICIDE GATE HEIGHT CONTROL
03/10/2005US20050054146 Photo-mask process and method for manufacturing a thin film transistor using the process
03/10/2005US20050054145 Method for reduced n+ diffusion in strained si on sige substrate
03/10/2005US20050054144 Method for encapsulating a chip and/or other article
03/10/2005US20050054143 Using benzocyclobutene based polymers as underfill materials
03/10/2005US20050054141 Thin semiconductor package having stackable lead frame and method of manufacturing the same
03/10/2005US20050054140 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
03/10/2005US20050054139 Enhanced electrically-aligned proximity communication
03/10/2005US20050054137 Method of manufacturing display apparatus
03/10/2005US20050054135 Barrier layers for microelectromechanical systems
03/10/2005US20050054132 Nitride semiconductor device and manufacturing method thereof
03/10/2005US20050054131 Solution to thermal budget
03/10/2005US20050054130 Maskless Fabrication of waveguide mirrors
03/10/2005US20050054127 Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device
03/10/2005US20050054126 System and method for marking the surface of a semiconductor package
03/10/2005US20050054124 Silicon wafers and method of fabricating the same
03/10/2005US20050054123 Method and apparatus for detecting end point
03/10/2005US20050054122 FeRAM capacitor stack etch
03/10/2005US20050054121 Laser transfer article and method of making
03/10/2005US20050054115 Using focused ion beam to isolate, extract and analyze quality of semiconductor wafers
03/10/2005US20050053891 Heat treatment system and a method for cooling a loading chamber
03/10/2005US20050053890 Thermal treatment system for semiconductors
03/10/2005US20050053874 Supplying solution containing low concentration of developer; development; supplying solution containing high concentration of developer; rinsing
03/10/2005US20050053869 Integrated circuits; etching using chelate compound in liquids
03/10/2005US20050053859 Photoresist, photolithography method using the same, and method for producing photoresist
03/10/2005US20050053848 Pattern on surface of substrate ; extracting contours from image map ; generating features; analyzing, determination, positioning
03/10/2005US20050053845 Attenuating phase shift mask blank and photomask
03/10/2005US20050053722 Method for forming a titanium nitride layer
03/10/2005US20050053535 Gettering filter and associated method for removing oxygen from a gas
03/10/2005US20050053456 Magnetically coupled linear delivery system transferring wafers between a cassette and a processing reactor
03/10/2005US20050053369 Focused photon energy heating chamber
03/10/2005US20050052944 Semiconductor integrated circuit device
03/10/2005US20050052939 Semiconductor non-volatile memory
03/10/2005US20050052938 Magnetic memory device and method of manufacturing the same
03/10/2005US20050052936 High speed power-gating technique for integrated circuit devices incorporating a sleep mode of operation
03/10/2005US20050052929 Thin film magnetic memory device suppressing internal magnetic noises
03/10/2005US20050052926 Nonvolatile semiconductor memory device
03/10/2005US20050052918 Semiconductor device having a byte-erasable eeprom memory
03/10/2005US20050052915 Nonvolatile memory cell without a dielectric antifuse having high- and low-impedance states
03/10/2005US20050052914 Semiconductor memory device
03/10/2005US20050052906 Row decoder in flash memory and erase method of flash memory cell using the same
03/10/2005US20050052905 Magnetic memory cell structure
03/10/2005US20050052900 Magnetic device
03/10/2005US20050052899 Magnetoresistive element, magnetic memory cell, and magnetic memory device
03/10/2005US20050052855 Methods for producing passive components on a semiconductor substrate
03/10/2005US20050052823 Ferroelectric capacitor
03/10/2005US20050052822 Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board
03/10/2005US20050052817 Clamping and de-clamping semiconductor wafers on an electrostatic chuck using wafer inertial confinement by applying a single-phase square wave ac clamping voltage
03/10/2005US20050052800 Semiconductor integrated circuit device
03/10/2005US20050052651 Method and system for measuring stray light
03/10/2005US20050052642 Method and its apparatus for inspecting defects
03/10/2005US20050052634 Automatic focusing apparatus
03/10/2005US20050052633 Exposure apparatus and device fabrication method using the same
03/10/2005US20050052632 Exposure technique
03/10/2005US20050052631 Sealing assembly, a lithographic projection apparatus, and a device manufacturing method
03/10/2005US20050052608 Apparatus and method for fabricating liquid crystal display device
03/10/2005US20050052590 Liquid crystal display device
03/10/2005US20050052584 Method for producing display - device
03/10/2005US20050052583 Method for forming pattern of liquid crystal display device and method for fabricating thin film transistor array substrate of liquid crystal display device using the same
03/10/2005US20050052464 Multi-exposure drawing method and apparatus thereof
03/10/2005US20050052442 Display device
03/10/2005US20050052307 Semiconductor integrated circuit in which voltage down converter output can be observed as digital value and voltage down converter output voltage is adjustable
03/10/2005US20050052228 Non-volatile flash memory
03/10/2005US20050052219 Integrated circuit transistor body bias regulation circuit and method for low voltage applications
03/10/2005US20050052215 Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit
03/10/2005US20050052197 Multi-tool manager
03/10/2005US20050052195 Probe pins zero-point detecting method, and prober
03/10/2005US20050052143 Alignment stage apparatus, exposure apparatus, and semiconductor device manufacturing method
03/10/2005US20050052041 Ultra low contact area end effector
03/10/2005US20050051930 Protection film comprising mixture of polyvinyl alcohol and water having a viscosity of >/= .2 Pa.s at 25 degrees c applied to the composite prior to drying in a high pressure chamber using a liquefied or supercritical fluid
03/10/2005US20050051927 Placing a desired volume of thermoplastic adhesive in a mold having opposing concave inner surfaces and applying heat and pressure to adhesive until it conforms to concave inner surfaces of mold, thereby forming a thermoplastic preform having opposing convex outer surfaces; avoids entrapment of air
03/10/2005US20050051913 Fluid mixing device and cutting device
03/10/2005US20050051910 Capacitance type dynamic quantity sensor device
03/10/2005US20050051909 Semiconductor device
03/10/2005US20050051908 Diode exhibiting a high breakdown voltage
03/10/2005US20050051907 Integrated circuit package
03/10/2005US20050051904 Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
03/10/2005US20050051902 Semiconductor substrate and test pattern for the same
03/10/2005US20050051900 Method for forming dielectric barrier layer in damascene structure
03/10/2005US20050051899 Semiconductor device and production method therefor
03/10/2005US20050051898 Semiconductor device
03/10/2005US20050051895 BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
03/10/2005US20050051894 Thick metal layer integrated process flow to improve power delivery and mechanical buffering
03/10/2005US20050051887 Clock distribution networks and conductive lines in semiconductor integrated circuits
03/10/2005US20050051886 Semiconductor device and method of manufacturing the same
03/10/2005US20050051885 Semiconductor package structure