Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2005
05/06/2005WO2005041301A1 Semiconductor device and production method therefor
05/06/2005WO2005041298A1 System and method for reducing or eliminating semiconductor device wire sweep
05/06/2005WO2005041293A1 Backside of chip implementation of redundancy fuses and contact pads
05/06/2005WO2005041292A1 Method for manufacturing semiconductor substrate and semiconductor substrate
05/06/2005WO2005041291A2 Mask and method for using the mask in lithographic processing
05/06/2005WO2005041290A1 Nickel alloy sputtering target and nickel alloy thin film
05/06/2005WO2005041289A2 Method for gluing a circuit component to a circuit substrate
05/06/2005WO2005041288A1 Epitaxially deposited source/drain
05/06/2005WO2005041287A1 Method for manufacturing compound semiconductor substrate
05/06/2005WO2005041286A1 Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method
05/06/2005WO2005041285A1 Shower head and film-forming device using the same
05/06/2005WO2005041284A1 Vertical heat treatment device
05/06/2005WO2005041283A1 Gallium nitride semiconductor substrate and process for producing the same
05/06/2005WO2005041282A1 Sheet-peeling device and method
05/06/2005WO2005041281A1 Hard substrate wafer sawing process
05/06/2005WO2005041280A1 Method for manufacturing semiconductor device
05/06/2005WO2005041279A1 PROCESS FOR PRODUCING n-TYPE SEMICONDUCTOR DIAMOND AND n-TYPE SEMICONDUCTOR DIAMOND
05/06/2005WO2005041277A1 Lighting optical device and projection aligner
05/06/2005WO2005041275A1 Wafer handler method and system
05/06/2005WO2005041274A1 Positioning device and method for transferring electronic components
05/06/2005WO2005041273A2 Method for reducing parasitic couplings in circuits
05/06/2005WO2005041272A2 Production method and device for improving the bonding between plastic and metal
05/06/2005WO2005041271A2 Method and device for fixing a chip in a housing
05/06/2005WO2005041270A2 Mram array with segmented word and bit lines
05/06/2005WO2005041269A2 Maskless lateral epitaxial overgrowth of aluminum nitride and high aluminum composition aluminum gallium nitride
05/06/2005WO2005041266A2 Semiconductor device package utilizing proud interconnect material
05/06/2005WO2005041258A2 Self-aligning tray and carrier apparatus
05/06/2005WO2005041252A2 SPLIT POLY-SiGe/POLY-Si ALLOY GATE STACK
05/06/2005WO2005040952A2 Power system inhibit method and device and structure therefor
05/06/2005WO2005040931A1 Composition for separating photoresist and separating method
05/06/2005WO2005040922A1 Resist composition and method for forming resist pattern
05/06/2005WO2005040921A1 Resist composition for electron beam or euv
05/06/2005WO2005040919A1 Photo mask, pattern formation method using the same, and mask data generation method
05/06/2005WO2005040776A1 Surface inspection device and surface inspection method
05/06/2005WO2005040755A2 Nanoscale transduction systems for detecting molecular interactions
05/06/2005WO2005040719A1 Shape profile measuring unit and production method for semiconductor device using it
05/06/2005WO2005040459A2 Electroplating compositions and methods for electroplating
05/06/2005WO2005040454A1 Surface treatment method and device
05/06/2005WO2005040348A2 Method for two- and three-dimensional microassembly of patterns and structures
05/06/2005WO2005040324A1 Cleaning agent for substrate and cleaning method
05/06/2005WO2005040011A1 Photochromic substrate container
05/06/2005WO2005039868A2 Structuring of electrical functional layers by means of a transfer film and structuring the adhesive
05/06/2005WO2005039824A1 Multi-wire saw
05/06/2005WO2005022645A3 Electronic device comprising an ldmos transistor
05/06/2005WO2005010934A3 Three-dimensional integrated circuit structure and method of making same
05/06/2005WO2005006337A3 Variable gate bias for a reference transistor in a non-volatile memory
05/06/2005WO2004113585A3 Atomic layer deposition of barrier materials
05/06/2005WO2004111296A3 Stress reduction of sioc low k film by addition of alkylenes to omcts based processes
05/06/2005WO2004109763A3 High impedance radio frequency power plastic package
05/06/2005WO2004102793A3 Maintaining the dimensions of features being etched on a lithographic mask
05/06/2005WO2004099461A3 Method of forming compressive alpha-tantalum on substrates and devices including same
05/06/2005WO2004093157A3 Diffusion bonding method for microchannel plates
05/06/2005WO2004084266A3 System, method and apparatus for improved global dual-damascene planarization
05/06/2005WO2004055887A3 Manipulation of micrometer-sized electronic objects with liquid droplets
05/06/2005WO2004033103B1 High temperature, high strength, colorable materials for device processing systems
05/06/2005WO2004032192A3 Composition and chemical vapor deposition method for forming organic low k dielectric films
05/06/2005WO2004019077A3 Structures and methods for reducing retardance
05/06/2005WO2000075713A9 Method/system measuring object features with 2d and 3d imaging coordinated
05/06/2005CA2543782A1 Method for two- and three-dimensional microassembly of patterns and structures
05/06/2005CA2542704A1 Methods of forming power semiconductor devices using boule-grown silicon carbide drift layers and power semiconductor devices formed thereby
05/05/2005US20050097498 Automatic wiring method for the crosstalk reduction
05/05/2005US20050097496 High-speed and low-power logical unit
05/05/2005US20050097495 Semiconductor designing apparatus
05/05/2005US20050097494 Automatic circuit design apparatus, method for automatically designing a circuit, and computer program product for executing an application for an automatic circuit design apparatus
05/05/2005US20050097492 Semiconductor integrated circuit and method of designing the same
05/05/2005US20050097491 Integrated circuit design method and system
05/05/2005US20050097490 Method of implementing polishing uniformity and modifying layout data
05/05/2005US20050097481 Method, apparatus, and computer program of searching for clustering faults in semiconductor device manufacturing
05/05/2005US20050097419 Method and apparatus for selectively compacting test reponses
05/05/2005US20050097415 Scan test method, integrated circuit, and scan test circuit
05/05/2005US20050096794 Method and apparatus for monitoring the position of a semiconductor processing robot
05/05/2005US20050096784 Control method and system for an automated material handling system
05/05/2005US20050096779 Tunable alignment geometry
05/05/2005US20050096776 Manufacturing product carrier environment and event monitoring system
05/05/2005US20050096513 Wearable biomonitor with flexible thinned integrated circuit
05/05/2005US20050096432 Two-pack type adhesive
05/05/2005US20050096429 Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto
05/05/2005US20050096415 Producing a silicon dioxide film having a low relative dielectric constant and exhibiting excellent chemical resistance, adhesion, and insulating properties by hydrolyzing and condensing at least one silane compound and a cyclic silane compound
05/05/2005US20050096246 Solvent compositions containing chlorofluoroolefins
05/05/2005US20050096238 Using fluorocarbon and oxygen with nitrogen trifluoride, fluorine, nitrogen oxide and inert gases; etching resistance; semiconductors
05/05/2005US20050096237 Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
05/05/2005US20050096230 Electronic device and electronic apparatus
05/05/2005US20050095976 Design for LPT arm cover
05/05/2005US20050095963 Chemical mechanical polishing system
05/05/2005US20050095958 Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
05/05/2005US20050095875 Fabrication method of semiconductor package with heat sink
05/05/2005US20050095874 Active matrix organic electroluminescent display device and fabricating method thereof
05/05/2005US20050095873 Method for the heat treatment of substrates
05/05/2005US20050095872 Hdp process for high aspect ratio gap filling
05/05/2005US20050095870 Etching method, gate etching method, and method of manufacturing semiconductor devices
05/05/2005US20050095869 Low K dielectric surface damage control
05/05/2005US20050095868 Method of manufacturing semiconductor device
05/05/2005US20050095867 Method of manufacturing semiconductor device
05/05/2005US20050095866 Method for forming patterned conductive film, electrooptical device, and electronic appliance
05/05/2005US20050095864 Planarizing method employing hydrogenated silicon nitride planarizing stop layer
05/05/2005US20050095863 Chemical mechanical polishing method and apparatus
05/05/2005US20050095862 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
05/05/2005US20050095861 GaN single-crystal substrate, nitride type semiconductor epitaxial substrate, nitride type semiconductor device, and methods of making the same
05/05/2005US20050095860 Abrasive liquid for metal and method for polishing
05/05/2005US20050095859 Precursor delivery system with rate control
1 ... 3874 3875 3876 3877 3878 3879 3880 3881 3882 3883 3884 3885 3886 3887 3888 3889 3890 3891 3892 3893 3894 ... 6590