Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2005
05/17/2005US6893793 Photosensitive polymer and chemically amplified photoresist composition containing the same
05/17/2005US6893787 Method of a photolithography processing system
05/17/2005US6893785 Method of manufacturing an electronic device and a semiconductor integrated circuit device
05/17/2005US6893779 Phase shifting mask for manufacturing semiconductor device and method of fabricating the same
05/17/2005US6893736 Thermosetting resin compositions useful as underfill sealants
05/17/2005US6893726 Polysiloxane reaction product of silica and a hydrolyzate of an alkoxysilane and a readily decomposable resin
05/17/2005US6893712 Transport member
05/17/2005US6893709 Metal mask structure and method for manufacturing thereof
05/17/2005US6893684 Anti-reflective coating compositions for use with low k dielectric materials
05/17/2005US6893612 Transfer fluids to or from a fluid-holding vessel, and remain physically and sealably associated during transfer
05/17/2005US6893591 Thermoplastic adhesive preform for heat sink attachment
05/17/2005US6893578 Selective etchant for oxide sacrificial material in semiconductor device fabrication
05/17/2005US6893544 Apparatus and method for depositing thin films on a glass substrate
05/17/2005US6893541 Multi-step process for depositing copper seed layer in a via
05/17/2005US6893523 Method for bonding heat sinks to overmold material
05/17/2005US6893507 Self-centering wafer support system
05/17/2005US6893506 Comprises exposing semiconductor substrates to vacuum maintained by non-roughing pumps
05/17/2005US6893505 Valve for controlling fluid flow
05/17/2005US6893504 Multi-port chemical dispense
05/17/2005US6893503 Method of manufacturing a semiconductor device
05/17/2005US6893501 Method for manufacturing a semiconductor device having a capping layer covering a capacitor of the semiconductor device
05/17/2005US6893477 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry
05/17/2005US6893476 Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal
05/17/2005US6893336 Polishing pad conditioner and chemical-mechanical polishing apparatus having the same
05/17/2005US6893244 Apparatus for encasing array packages
05/17/2005US6893204 Substrate delivering robot
05/17/2005US6893172 Rapid, uniform production of thick film photoresists; chuck device with support portion holding spinner within anti-scattering cup
05/17/2005US6893171 Substrate treating apparatus
05/17/2005US6893069 Die edge-picking vacuum tool
05/17/2005US6892927 Method and apparatus for bonding a wire to a bond pad on a device
05/17/2005US6892917 Brittle material rotating and aligning mechanism for use in a brittle material scribing and/or breaking apparatus
05/17/2005US6892781 Method and apparatus for application of pressure to a workpiece by thermal expansion
05/17/2005US6892769 Substrate bonding apparatus for liquid crystal display device panel
05/17/2005US6892762 Manifolded fluid delivery system
05/17/2005US6892740 Method and apparatus for transferring chips
05/17/2005US6892669 CVD apparatus
05/17/2005US6892593 Polyhedron inspection feeder and polyhedron inspection apparatus
05/17/2005US6892582 Semiconductor pressure sensor and pressure sensing device
05/17/2005US6892472 Method and apparatus for cleaning and drying a workpiece
05/17/2005US6892447 Chip mounting device
05/17/2005CA2324451C Method for fabricating an electrically addressable silicon-on-sapphire light valve
05/12/2005WO2005043966A1 Solder stop barrier
05/12/2005WO2005043957A1 Selective layer millimeter-wave surface-heating system and method
05/12/2005WO2005043701A1 Method for manufacturing gratings in semiconductor materials
05/12/2005WO2005043696A2 Laser thermal annealing of lightly doped silicon substrates
05/12/2005WO2005043648A2 Synergetic sp-sp2-sp3 carbon materials and deposition methods thereof
05/12/2005WO2005043633A1 Semiconductor light-emitting device and method for manufacturing same
05/12/2005WO2005043629A1 Method for producing a vertical field effect transistor
05/12/2005WO2005043626A1 High-k dielectric stack in a mim capacitor and method for its fabrication
05/12/2005WO2005043623A2 Method for forming a dielectric on a metallic layer and capacitor assembly
05/12/2005WO2005043622A1 Semiconductor device and process for fabricating the same
05/12/2005WO2005043616A1 Method for the catastrophic transfer of a thin layer after co-implantation
05/12/2005WO2005043615A1 Method for self- supported transfer of a fine layer by pulsation after implantation or co-implantation
05/12/2005WO2005043614A2 METHOD FOR FABRICATING SiGe-ON-INSULATOR (SGOI) AND Ge-ON-INSULATOR (GOI) SUBSTRATES
05/12/2005WO2005043613A1 Substrate holder
05/12/2005WO2005043612A1 Method and device for encapsulating electronic components using a flexible pressure element
05/12/2005WO2005043611A1 Substrate treatment device and substrate treatment method
05/12/2005WO2005043610A1 Cleaning composition for semiconductor containing unsaturated dicarboxylic acid and ethylene urea and cleaning method
05/12/2005WO2005043609A1 Heat treatment apparatus and heat treatment method
05/12/2005WO2005043608A1 A processing liquid coating apparatus and a processing liquid coating method
05/12/2005WO2005043607A1 Exposure apparatus and device producing method
05/12/2005WO2005043606A1 A device and method for inhibiting oxidation of contact plugs in ferroelectric capacitor devices
05/12/2005WO2005043605A1 Integrated circuit with partly silicidated silicon layer
05/12/2005WO2005043603A2 Integrated ashing and implant annealing method
05/12/2005WO2005043602A2 Three-dimensional inductive micro components
05/12/2005WO2005043596A2 Layered hard mask and dielectric materials and methods therefor
05/12/2005WO2005043594A2 Method for forming photo-defined micro electrical contacts
05/12/2005WO2005043591A2 HIGH PERFORMANCE STRESS-ENHANCED MOSFETs USING Si:C AND SiGe EPITAXIAL SOURCE/DRAIN AND METHOD OF MANUFACTURE
05/12/2005WO2005043590A2 Strained dislocation-free channels for cmos and method of manufacture
05/12/2005WO2005043588A2 Gas-using facility including portable dry scrubber system and/or over-pressure control arrangement
05/12/2005WO2005043587A2 Design methodology for multiple channel heterostructures in polar materials
05/12/2005WO2005043584A2 Single mask via method and device
05/12/2005WO2005043583A2 High-temperature attachment of organic molecules to substrates
05/12/2005WO2005043582A2 Method for manufacturing p-type group iii nitride semiconductor, and group iii nitride semiconductor light-emitting device
05/12/2005WO2005043548A1 Programming method based on the behaviour of non-volatile memory cenlls
05/12/2005WO2005043248A1 Composition for forming underlying film containing dextrin ester compound
05/12/2005WO2005043247A1 Thick film or ultrathick film responsive chemical amplification type photosensitive resin composition
05/12/2005WO2005043242A1 Photomask and video device manufacturing method
05/12/2005WO2005043215A1 Specimen observation method and microscope, and, for use therein, solid immersion lens and optical contact liquid
05/12/2005WO2005042810A2 Membrane -mediated electropolishing
05/12/2005WO2005042804A2 Method and apparatus for fluid processing a workpiece
05/12/2005WO2005042800A1 Organic metal chemical vapor deposition apparatus
05/12/2005WO2005042798A1 High capacitance electrode and methods of producing same
05/12/2005WO2005042658A1 Abrasive-free che.mical mechanical polishing composition and polishing process containing same
05/12/2005WO2005042436A1 Aluminum nitride joined article and method for manufacture thereof
05/12/2005WO2005042426A2 Glass-ceramic (ltcc) capable of being assembled with silicon by anodic bonding
05/12/2005WO2005042247A1 Laminate and method for formation thereof, insulating film, semiconductor device, and composition for forming film
05/12/2005WO2005042160A2 Reaction system for growing a thin film
05/12/2005WO2005031842A3 Method of manufacturing a multilayer semiconductor structure with reduced ohmic losses
05/12/2005WO2005024912A3 Methods of processing thick ild layers using spray coating or lamination for c4 wafer level thick metal integrated flow
05/12/2005WO2005019141A3 Process for producing hexafluoroethane and use thereof
05/12/2005WO2005013349A3 Controlled growth of highly uniform, oxide layers, especially ultrathin layers
05/12/2005WO2005008763A3 Methods of forming deuterated silicon nitride-containing materials
05/12/2005WO2005004201A3 Bipolar transistor and method of making same
05/12/2005WO2005003668A9 Microchannel heat exchangers and methods of manufacturing the same
05/12/2005WO2005001934A3 High-frequency package
05/12/2005WO2004112124A3 Improved annealing method for stabilisation
05/12/2005WO2004110657A3 Uniform cavitation for particle removal
05/12/2005WO2004095600A3 Deposition of permanent polymer structures for oled fabrication
05/12/2005WO2004095545A3 Wafer carrier having improved processing characteristics
1 ... 3865 3866 3867 3868 3869 3870 3871 3872 3873 3874 3875 3876 3877 3878 3879 3880 3881 3882 3883 3884 3885 ... 6590