Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2005
05/12/2005US20050098903 Semiconductor device having a bond pad and method therefor
05/12/2005US20050098901 Bonding structure with compliant bumps
05/12/2005US20050098900 Relaxed tolerance flip chip assembly
05/12/2005US20050098899 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement
05/12/2005US20050098898 Generation of metal holes by via mutation
05/12/2005US20050098895 Diamond metal-filled patterns achieving low parasitic coupling capacitance
05/12/2005US20050098894 Semiconductor device and the fabricating method thereof
05/12/2005US20050098892 Structure and process of metal interconnects
05/12/2005US20050098891 Semiconductor device and method of manufacturing the same
05/12/2005US20050098890 Method for producing an adhesive bond and adhesive bond between a chip and a planar surface
05/12/2005US20050098889 Semiconductor device
05/12/2005US20050098888 Method and semiconductor device having copper interconnect for bonding
05/12/2005US20050098887 Using backgrind wafer tape to enable wafer mounting of bumped wafers
05/12/2005US20050098886 Flip chip interconnection pad layout
05/12/2005US20050098885 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
05/12/2005US20050098884 Semiconductor package
05/12/2005US20050098877 Heat treatment jig for semiconductor substrate and method of heat treating semiconductor substrate
05/12/2005US20050098876 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
05/12/2005US20050098875 Semiconductor package board using a metal base
05/12/2005US20050098871 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
05/12/2005US20050098863 Lead frame and method for fabricating semiconductor package employing the same
05/12/2005US20050098862 Lead frame and semiconductor device having the same as well as method of resin-molding the same
05/12/2005US20050098861 Bumped chip carrier package using lead frame and method for manufacturing the same
05/12/2005US20050098859 Semiconductor device and fabrication method thereof
05/12/2005US20050098858 Teardrop shaped lead frames
05/12/2005US20050098856 Low dielectric constant fluorine and carbon-containing silicon oxide dielectric material characterized by improved resistance to oxidation
05/12/2005US20050098854 Semiconductor device and method for fabricating the same
05/12/2005US20050098853 Semiconductor device
05/12/2005US20050098852 Bipolar transistor with selectively deposited emitter
05/12/2005US20050098851 Semiconductor device and manufacturing the same
05/12/2005US20050098850 Semiconductor device with self-aligned junction contact hole and method of fabricating the same
05/12/2005US20050098849 Semiconductor device
05/12/2005US20050098848 Semiconductor device
05/12/2005US20050098845 Semiconductor device with horizontal MOSFET and schottky barrier diode provided on single substrate
05/12/2005US20050098842 Image sensor having micro-lenses with integrated color filter and method of making
05/12/2005US20050098841 Nanopore chip with n-type semiconductor
05/12/2005US20050098840 Micromechanical structural element having a diaphragm and method for producing such a structural element
05/12/2005US20050098839 Semiconductor devices having different gate dielectrics and methods for manufacturing the same
05/12/2005US20050098838 Semiconductor device and manufacturing method thereof
05/12/2005US20050098836 Current-jump-control circuit including abrupt metal-insulator phase transition device
05/12/2005US20050098835 Semiconductor device and semiconductor integrated circuit device
05/12/2005US20050098834 Heterojunction bicmos semiconductor
05/12/2005US20050098833 Dual metal-alloy nitride gate electrodes
05/12/2005US20050098832 Semiconductor device and manufacturing method thereof
05/12/2005US20050098831 Semiconductor device and it's manufacturing method
05/12/2005US20050098830 Semiconductor device including a protection circuit
05/12/2005US20050098829 High mobility CMOS circuits
05/12/2005US20050098828 Silicon-on-insulator comprising integrated circuitry
05/12/2005US20050098827 Wafer, semiconductor device, and fabrication methods therefor
05/12/2005US20050098826 Semiconductor device and method of manufacturing semiconductor device
05/12/2005US20050098825 Programmable memory devices supported by semiconductor substrates
05/12/2005US20050098824 Bit line contact structure and fabrication method thereof
05/12/2005US20050098823 Non-volatile semiconductor memory and method of making same, and semiconductor device and method of making device
05/12/2005US20050098822 Transistor having three electrically isolated electrodes and method of formation
05/12/2005US20050098821 Method for manufacturing high density flash memory and high performance logic on a single die
05/12/2005US20050098820 Method to remove an oxide seam along gate stack edge, when nitride space formation begins with an oxide liner surrounding gate stack
05/12/2005US20050098819 Ferroelectric capacitor
05/12/2005US20050098818 Drain/source extension structure of a field effect transistor including doped high-k sidewall spacers
05/12/2005US20050098817 Non-volatile memory cell
05/12/2005US20050098816 Capacitor and method for fabricating the same, and semiconductor device and method for fabricating the same
05/12/2005US20050098815 Laser having active region formed above substrate
05/12/2005US20050098813 Semiconductor device and manufacturing method thereof
05/12/2005US20050098812 Semiconductor device having a capacitor and method for the manufacture thereof
05/12/2005US20050098810 Semiconductor memory devices and methods of fabricating semiconductor memory device
05/12/2005US20050098808 Electronic deivce and method for its fabrication
05/12/2005US20050098804 Methods for fabricating a metal-oxide-semiconductor device structure and metal-oxide-semiconductor device structures formed thereby
05/12/2005US20050098803 Semiconductor device having fuses
05/12/2005US20050098802 Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof
05/12/2005US20050098800 Nonvolatile memory cell comprising a reduced height vertical diode
05/12/2005US20050098794 Thyristor-based SRAM
05/12/2005US20050098792 Method of fabricating vertical structure LEDs
05/12/2005US20050098791 Nitride semiconductor, semiconductor device, and manufacturing methods for the same
05/12/2005US20050098788 Surface emitting semiconductor laser chip and method for producing the chip
05/12/2005US20050098785 Display panel
05/12/2005US20050098784 Semiconductor device and semiconductor device production system
05/12/2005US20050098783 Thin-film transistor, switching circuit, active element substrate, electro-optical device, electronic apparatus, thermal head, droplet ejecting head, printer and thin-film-transistor driving and light-emitting display device
05/12/2005US20050098782 Insulated gate field effect semiconductor devices and method of manufacturing the same
05/12/2005US20050098779 Production process for producing semiconductor devices, semiconductor devices produced thereby, and test system for carrying out yield-rate test in production of such semiconductor devices
05/12/2005US20050098778 Burn-in test adapter and burn-in test apparatus
05/12/2005US20050098775 Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment
05/12/2005US20050098764 Small particle size, narrow particle size distribution, spherical morphology and good crystallinity
05/12/2005US20050098758 applying slurries comprising carrier fluids, particles, etchants and surfactants, to the surfaces of glass, ceramic, metal or alloy substrates use in data storage, then rubbing with pads
05/12/2005US20050098741 Lithographic projection apparatus, particle barrier for use therein, integrated structure manufacturing method, and device manufactured thereby
05/12/2005US20050098631 Holographic laser scanning method and system employing visible scanning-zone indicators identifying a three-dimensional omni-directional laser scanning volume for package transport navigation
05/12/2005US20050098612 Design of an insulated cavity
05/12/2005US20050098610 Apparatus and method for mounting electronic components
05/12/2005US20050098606 Ball mounting apparatus and method
05/12/2005US20050098553 Shadow-free shutter arrangement and method
05/12/2005US20050098552 Apparatus and method for reducing stray light in substrate processing chambers
05/12/2005US20050098540 for use in chemical mechanical polishing; abrasion
05/12/2005US20050098536 Method of etching oxide with high selectivity
05/12/2005US20050098535 Method and apparatus for controlling etch selectivity
05/12/2005US20050098531 Method of forming conductive line
05/12/2005US20050098473 Container for containing semiconductor wafers
05/12/2005US20050098446 comprising backing layers secured to the polishing layers, having compressibility and hardness, used for chemical mechanical polishing
05/12/2005US20050098440 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
05/12/2005US20050098439 immersing substrate in baths containing plating solutions, then washing the surfaces, forming a second plating layer and drying; filling pits for fine wires formed in semiconductor wafers with copper or alloys
05/12/2005US20050098338 Electronic part, and electronic part mounting element and an process for manufacturing such the articles
05/12/2005US20050098265 Method and apparatus for improved baffle plate
05/12/2005US20050098264 Molecular airborne contaminants (MACs) film removal and wafer surface sustaining system and method
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