| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/28/2005 | WO2005038391A1 Eddy current sensor |
| 04/28/2005 | WO2005038094A2 Apparatus for electroless deposition |
| 04/28/2005 | WO2005038088A1 Electroless copper plating liquid and method for manufacturing wiring board using same |
| 04/28/2005 | WO2005038087A1 Electroless copper plating solution and method for electroless copper plating |
| 04/28/2005 | WO2005038085A2 Selective self-initiating electroless capping of copper with cobalt-containing alloys |
| 04/28/2005 | WO2005038084A2 Selective self-initiating electroless capping of copper with cobalt-containing alloys |
| 04/28/2005 | WO2005038081A2 Substrate heater assembly |
| 04/28/2005 | WO2005037698A1 Adhesive tape peeling device |
| 04/28/2005 | WO2005037691A1 Free ball bearing and supporting table |
| 04/28/2005 | WO2005037495A1 Calibration method |
| 04/28/2005 | WO2005037488A1 Polishing apparatus |
| 04/28/2005 | WO2005037418A2 Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| 04/28/2005 | WO2005018864A3 Capillary with contained inner chamfer |
| 04/28/2005 | WO2005017976A3 Device threshold control of front-gate silicon-on-insulator mosfet using a self-aligned back-gate |
| 04/28/2005 | WO2005013347A3 Precise patterning of high-k films |
| 04/28/2005 | WO2005013339A3 Methods of forming conductive structures including titanium-tungsten base layers and related structures |
| 04/28/2005 | WO2005010971A3 Ultaviolet curing processes for advanced low-k materials |
| 04/28/2005 | WO2005010967A3 Device and method for machining the rear side of semiconductor chips |
| 04/28/2005 | WO2005008740A3 Methods of processing of gallium nitride |
| 04/28/2005 | WO2004109794A3 Coiled circuit device and method of making the same |
| 04/28/2005 | WO2004099466B1 Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation |
| 04/28/2005 | WO2004095517A3 Passivation layer for group iii-v semiconductor devices |
| 04/28/2005 | WO2004088718A3 In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration |
| 04/28/2005 | WO2004070778A3 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups |
| 04/28/2005 | WO2004054922A3 Nanostructure, electronic device and method of manufacturing the same |
| 04/28/2005 | WO2004035528A8 Method for the production of a multi-metal oxide material |
| 04/28/2005 | WO2004027866A8 Method for creating a link in an integrated metal substrate |
| 04/28/2005 | WO2004027858A8 Formation of a relaxed useful layer from a wafer with no buffer layer |
| 04/28/2005 | WO2004025726A3 Method for selectively covering a micro machined surface |
| 04/28/2005 | WO2004021410A3 Deterministically doped field-effect devices and methods of making same |
| 04/28/2005 | WO2004003663A3 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 04/28/2005 | WO2004001904A3 Stabilized wire bonded electrical connections and method of making same |
| 04/28/2005 | WO2003034478A3 Apparatus and method for electro chemical plating using backside electrical contacts |
| 04/28/2005 | WO2002004704A3 Method and apparatus for patching electrochemically deposited layers using electroless deposited materials |
| 04/28/2005 | US20050091634 Renesting interaction map into design for efficient long range calculations |
| 04/28/2005 | US20050091631 Extending the range of lithographic simulation integrals |
| 04/28/2005 | US20050091621 Methods for designing a circuit |
| 04/28/2005 | US20050091561 Scan test method, device, and system |
| 04/28/2005 | US20050091560 System for optimizing anti-fuse repair time using fuse id |
| 04/28/2005 | US20050091014 Performance in model-based OPC engine utilizing efficient polygon pinning method |
| 04/28/2005 | US20050091013 Incorporation of a phase map into fast model-based optical proximity correction simulation kernels to account for near and mid-range flare |
| 04/28/2005 | US20050090999 Method of determining the irregularities of a hole |
| 04/28/2005 | US20050090927 Method of maintaining and automatically inspecting processing apparatus |
| 04/28/2005 | US20050090926 Methods of self-diagnosing software for driving processing apparatus |
| 04/28/2005 | US20050090925 Method and device for control of the data flow on application of reticles in a semiconductor component production |
| 04/28/2005 | US20050090923 Method for monitoring a batch system |
| 04/28/2005 | US20050090916 Intra-chip power and test signal generation for use with test structures on wafers |
| 04/28/2005 | US20050090914 Process monitoring device for sample processing apparatus and control method of sample processing apparatus |
| 04/28/2005 | US20050090605 Acid generator and thin film composition containing the same |
| 04/28/2005 | US20050090570 Composition for forming dielectric film and method for forming dielectric film or pattern using the composition |
| 04/28/2005 | US20050090416 Using aqueous solution of 2-ethylaminoethyl-2-ethanol and a hydroxylamine compound of given formula; high flash point; removing photoresist residue for example without damaging underlying layers |
| 04/28/2005 | US20050090188 Method and apparatus for polishing workpiece |
| 04/28/2005 | US20050090185 Method of dressing polishing pad and polishing apparatus |
| 04/28/2005 | US20050090123 Thin film forming apparatus cleaning method |
| 04/28/2005 | US20050090122 Sioc properties and its uniformity in bulk for damascene applications |
| 04/28/2005 | US20050090120 removing post-etch residue; passivating silicon oxide low-k materials; solution comprises a silylating agent such as hexamethyldisilazane (HMDS), chlorotrimethylsilane (TMCS), trichloromethylsilane (TCMS) |
| 04/28/2005 | US20050090119 Magnetic tunnel junction device with dual-damascene conductor and dielectric spacer |
| 04/28/2005 | US20050090118 Plasma control using dual cathode frequency mixing |
| 04/28/2005 | US20050090117 Method for fabricating semiconductor device with fine pattern |
| 04/28/2005 | US20050090116 Method for etching smooth sidewalls in III-V based compounds for electro-optical devices |
| 04/28/2005 | US20050090115 Post plasma clean process for a hardmask |
| 04/28/2005 | US20050090114 Method for the production of a semiconductor device |
| 04/28/2005 | US20050090113 Method for removing photoresist after etching the metal layer |
| 04/28/2005 | US20050090112 Tungsten plug corrosion prevention method using ionized air |
| 04/28/2005 | US20050090111 Magnetic tunnel junction device with etch stop layer and dielectric spacer |
| 04/28/2005 | US20050090110 Use of photoresist in substrate vias during backside grind |
| 04/28/2005 | US20050090109 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
| 04/28/2005 | US20050090108 High capacitance electrode and methods of producing same |
| 04/28/2005 | US20050090107 Substrate with enhanced properties for planarization |
| 04/28/2005 | US20050090106 Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent |
| 04/28/2005 | US20050090104 Slurry compositions for chemical mechanical polishing of copper and barrier films |
| 04/28/2005 | US20050090103 Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers |
| 04/28/2005 | US20050090102 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding |
| 04/28/2005 | US20050090101 Tungsten plug corrosion prevention method using gas sparged water |
| 04/28/2005 | US20050090100 Simplified dual damascene process |
| 04/28/2005 | US20050090099 Thin film semiconductor package and method of fabrication |
| 04/28/2005 | US20050090098 Method for making a semiconductor device having increased conductive material reliability |
| 04/28/2005 | US20050090097 Via electromigration improvement by changing the via bottom geometric profile |
| 04/28/2005 | US20050090096 Method of forming a contact on a silicon-on-insulator wafer |
| 04/28/2005 | US20050090095 Method to fabricate aligned dual damascene openings |
| 04/28/2005 | US20050090094 Method of forming a metal pattern for a semiconductor device |
| 04/28/2005 | US20050090093 Stress free etch processing in combination with a dynamic liquid meniscus |
| 04/28/2005 | US20050090092 Semiconductor devices and methods of fabricating the same |
| 04/28/2005 | US20050090091 Method of forming multi-piled bump |
| 04/28/2005 | US20050090090 Method of fabricating ultra thin flip-chip package |
| 04/28/2005 | US20050090089 Method for forming solder bump structure |
| 04/28/2005 | US20050090088 Method for forming a word line spacer with good square profile |
| 04/28/2005 | US20050090087 Nickel silicide - silicon nitride adhesion through surface passivation |
| 04/28/2005 | US20050090086 Method of fabricating self-aligned contact structures |
| 04/28/2005 | US20050090085 NAND memory arrays |
| 04/28/2005 | US20050090084 Method of forming a gate structure |
| 04/28/2005 | US20050090083 Advanced barrier linear formation for vias |
| 04/28/2005 | US20050090082 Method and system for improving performance of MOSFETs |
| 04/28/2005 | US20050090081 Single electron transistor manufacturing method by electro-migration of metallic nanoclusters |
| 04/28/2005 | US20050090080 Patterned SOI by oxygen implantation and annealing |
| 04/28/2005 | US20050090079 Method for gettering transition metal impurities in silicon crystal |
| 04/28/2005 | US20050090078 Processing apparatus and method |
| 04/28/2005 | US20050090077 Wafer dividing method |
| 04/28/2005 | US20050090076 Hard substrate wafer sawing process |
| 04/28/2005 | US20050090075 Semiconductor device, method of manufacturing thereof, and method of manufacturing base material |