Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2005
05/19/2005US20050106479 deriving hyper-sampled correlation information indicative of photoresist behavior for a plurality of wafer substrates processed at pre-specified target processing conditions
05/19/2005US20050106478 applying layers containing carbon over the layer to be patterned, then spin coating a layer containing silicon and carbon, andapplying an antireflective coating layer to be used with an overlying photoresist layer that is patternable using nanotechnology
05/19/2005US20050106475 Mask substrate on which the patterned mask layer is arranged, has a protective layer to protect the mask layer from contact with impurity particles
05/19/2005US20050106474 Method for controlling linewidth in advanced lithography masks using electrochemistry
05/19/2005US20050106423 Carbonceous substrate such as graphite, coated by silicon carbide with reduced nitrogen and boron imputities; used as tools or jigs for the production of epitaxial layers of SiC semiconductors
05/19/2005US20050106396 Method of adhering transparent articles and quartz glass plate prepared through adhesion and device using the same
05/19/2005US20050106376 Prepared by reacting a silicon containing pre-polymer, a porogen, and a metal-ion-free catalyst selected from onium compounds and nucleophiles, coating a substrate with the composition to form a film, crosslinking composition to produce gelled film, and heating to remove porogen
05/19/2005US20050106366 Biocompatibility protective coating; dielectrics; prevent current leakage
05/19/2005US20050106359 Method of processing substrate
05/19/2005US20050106331 Introducing reactive gas containing a carbon compound into reaction chamber wherein reactive gas is converted into plasma by resonance using microwaves and the magnetic field, placing substrate in reaction chamber, and depositing film having amorphous structure on the substrate
05/19/2005US20050106329 Selective deposition of solder particles over metal interconnect features on electronic device substrate, such as a silicon wafer substrate, to provide electrical interconnection between substrate interconnect features and devices to be attached to substrate, using electrokinetic or electrostatic means
05/19/2005US20050106322 Film formation apparatus and film formation method and cleaning method
05/19/2005US20050106320 Silicon carbide and other films and method of deposition
05/19/2005US20050106319 Process and device for depositing thin layers on a substrate in a process chamber of adjustable height
05/19/2005US20050106318 Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics
05/19/2005US20050106059 Controlled melting; silver with silver or copper; reduced expansion; stress relieving
05/19/2005US20050105997 Methods and apparatus for carriers suitable for use in high-speed/high-acceleration transport systems
05/19/2005US20050105992 Apparatus of stocking substrates
05/19/2005US20050105991 Substrate processing apparatus
05/19/2005US20050105903 Transmission technique in system including chamber
05/19/2005US20050105869 Three-dimensional photonic crystal waveguide structure and method
05/19/2005US20050105855 Method for constructing an optical beam guide system in a contamination-free atmosphere and universal optical module for said construction
05/19/2005US20050105790 Wafer observation position designating apparatus and wafer display position designating method
05/19/2005US20050105784 Fingerprint sensor and fabrication method thereof
05/19/2005US20050105586 Temperature sensor circuit
05/19/2005US20050105375 Magnetic random access memory
05/19/2005US20050105361 Charge trapping memory cell and method for operating a charge trapping memory cell
05/19/2005US20050105359 Nonvolatile semiconductor memory
05/19/2005US20050105355 Method for homogeneously magnetizing an exchange-coupled layer system of a digital magnetic memory location device
05/19/2005US20050105353 Method for operating a memory cell array
05/19/2005US20050105347 Magnetic storage unit using ferromagnetic tunnel junction element
05/19/2005US20050105341 NROM flash memory with self-aligned structural charge separation
05/19/2005US20050105336 Nonvolatile semiconductor memory
05/19/2005US20050105335 Semiconductor memory device and electric device with the same
05/19/2005US20050105334 Nonvolatile semiconductor memory device, electronic card and electronic apparatus
05/19/2005US20050105332 Memory device and fabrication method thereof
05/19/2005US20050105330 Semiconductor memory device and manufacturing method thereof
05/19/2005US20050105325 Magnetic cell and magnetic memory
05/19/2005US20050105317 Data processor including an authentication function for judging access right
05/19/2005US20050105290 Illumination optical system and exposure apparatus
05/19/2005US20050105243 Electrostatic chuck for supporting a substrate
05/19/2005US20050105185 Tunable optical filter with heater on a CTE-matched transparent substrate
05/19/2005US20050105100 Optical position measuring system and method using a low coherence light source
05/19/2005US20050105093 Microprocessing apparatus, semiconductor device manufacturing apparatus, and device manufacturing method
05/19/2005US20050105087 Exposure apparatus and method of measuring mueller matrix of optical system of exposure apparatus
05/19/2005US20050105074 Mask supporting apparatus using vacuum and light exposing system, and method using the same
05/19/2005US20050105070 Lithographic apparatus and device manufacturing method
05/19/2005US20050105068 Reticle, exposure monitoring method, exposure method and manufacturing method for semiconductor device
05/19/2005US20050105067 Exposure apparatus and device manufacturing method
05/19/2005US20050105066 Lithographic apparatus and device manufacturing method
05/19/2005US20050105038 Thin film multilayer body, electronic device and actuator using the thin film multilayer body, and method of manufacturing the actuator
05/19/2005US20050105037 Flat panel display and method for fabricating the same
05/19/2005US20050105036 Panel module for an LCD module
05/19/2005US20050105023 Display apparatus with improved luminescence
05/19/2005US20050105010 Liquid crystal display, thin film diode panel, and manufacturing method of the same
05/19/2005US20050104814 Active matrix type organic electroluminescent display device and method of manufacturing the same
05/19/2005US20050104790 RFID tag with tunable antenna and associated reader
05/19/2005US20050104653 Multiple circuit blocks with interblock control and power conservation
05/19/2005US20050104621 Device and data processing method employing the device
05/19/2005US20050104620 Semiconductor device
05/19/2005US20050104617 Analog value adjustment circuit, display driver circuit, and method of adjusting analog value
05/19/2005US20050104525 Reducing apparatus and method
05/19/2005US20050104251 Integrated circuit chip packaging process
05/19/2005US20050104232 [memory device and fabrication method thereof]
05/19/2005US20050104230 Chip mounting device and method of calibrating the device
05/19/2005US20050104229 Semiconductor device having align key and method of fabricating the same
05/19/2005US20050104228 Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
05/19/2005US20050104226 Wafer level chip scale packaging structure and method of fabricating the same
05/19/2005US20050104225 Conductive bumps with insulating sidewalls and method for fabricating
05/19/2005US20050104223 Conductive bumps with non-conductive juxtaposed sidewalls and method for fabricating
05/19/2005US20050104222 Flip chip device having supportable bar and mounting structure thereof
05/19/2005US20050104220 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
05/19/2005US20050104219 Intermediate chip module, semiconductor device, circuit board, and electronic device
05/19/2005US20050104218 High frequency circuit chip and method of producing the same
05/19/2005US20050104216 Electroplated CoWP composite structures as copper barrier layers
05/19/2005US20050104213 Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same
05/19/2005US20050104211 Semiconductor device having semiconductor chips mounted on package substrate
05/19/2005US20050104210 Use of palladium in IC manufacturing with conductive polymer bump
05/19/2005US20050104206 Mounting structure in integrated circuit module
05/19/2005US20050104205 Substrate for electrical device and methods of manufacturing the same
05/19/2005US20050104204 Wafer-level package and its manufacturing method
05/19/2005US20050104202 Semiconductor device
05/19/2005US20050104198 Circuit device and manufacturing method thereof
05/19/2005US20050104194 Heat sink is disposed above the chip for improving heat dissipation, especially for stack type chip package structure; semiconductor electronic devices; solving heat generation problem
05/19/2005US20050104193 Semiconductor device with magnetically permeable heat sink
05/19/2005US20050104192 Electronic device
05/19/2005US20050104191 Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication
05/19/2005US20050104186 Chip-on-film package for image sensor and method for manufacturing the same
05/19/2005US20050104184 Semiconductor chip package and method
05/19/2005US20050104180 Electronic device with reduced entrapment of material between die and substrate electrical connections
05/19/2005US20050104179 Methods and apparatus for packaging integrated circuit devices
05/19/2005US20050104177 Post passivation interconnection schemes on top of the IC chips
05/19/2005US20050104176 High temperature electronic devices
05/19/2005US20050104174 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and semiconductor device and portable apparatus and electronic apparatus comprising the same
05/19/2005US20050104173 Semiconductor device and manufacturing method thereof
05/19/2005US20050104166 Semiconductor device and manufacturing method thereof
05/19/2005US20050104164 EMI shielded integrated circuit packaging apparatus method and system
05/19/2005US20050104163 Semiconductor texturing process
05/19/2005US20050104161 Semiconductor wafer
05/19/2005US20050104160 Bipolar junction transistor with improved extrinsic base region and method of fabrication
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