Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2005
05/24/2005US6897096 Method of packaging semiconductor dice employing at least one redistribution layer
05/24/2005US6897095 Semiconductor process and integrated circuit having dual metal oxide gate dielectric with single metal gate electrode
05/24/2005US6897094 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
05/24/2005US6897093 Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package
05/24/2005US6897091 Semiconductor device and manufacturing method thereof
05/24/2005US6897090 Method of making a compliant integrated circuit package
05/24/2005US6897089 Method and system for fabricating semiconductor components using wafer level contact printing
05/24/2005US6897088 Method for connecting circuit devices
05/24/2005US6897086 Image sensor and method for fabricating the same
05/24/2005US6897084 Control of oxygen precipitate formation in high resistivity CZ silicon
05/24/2005US6897082 Method of forming well for CMOS imager
05/24/2005US6897081 Method for fabricating a monolithic chip including pH, temperature and photo-intensity multi-sensors and a readout circuit
05/24/2005US6897079 Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same
05/24/2005US6897078 Programmable multi-chip module
05/24/2005US6897076 Lithography system, exposure apparatus and their control method, and device manufacturing method
05/24/2005US6897075 Method and apparatus for controlling photolithography overlay registration incorporating feedforward overlay information
05/24/2005US6897074 Method for making single-phase c-axis doped PGO ferroelectric thin films
05/24/2005US6897012 Negative-working photoresist composition
05/24/2005US6897010 Opaque patterns; forming photoresists; exposure; photolithography
05/24/2005US6897009 Fabrication of nanometer size gaps on an electrode
05/24/2005US6897004 Intermediate layer material composition for multilayer resist process and pattern formation process using the same
05/24/2005US6896998 Pattern forming method
05/24/2005US6896976 Tin antimony solder for MOSFET with TiNiAg back metal
05/24/2005US6896969 Oxidative conditioning compositions for metal oxide layer and applications thereof
05/24/2005US6896955 Process for forming dielectric layer over substrate comprising coating substrate with solution comprising soluble source of silicon oxide, water, solvent, nonionic surfactant, ionic additive, acid catalyst, hardening
05/24/2005US6896929 Susceptor shaft vacuum pumping
05/24/2005US6896927 Method of preventing organic contamination from the atmosphere of electronic device substrates and electronic device substrates treated therewith
05/24/2005US6896861 Silicon oxide layer reduced in dangling bonds through treatment with hypofluorous acid, process for growing silicon oxide layer and method for deactivating dangling bonds therein
05/24/2005US6896826 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
05/24/2005US6896825 Oxidizing agent for a metal and a dissolving agent, first and second film forming agents
05/24/2005US6896821 Fabrication of MEMS devices with spin-on glass
05/24/2005US6896784 Method for controlling local current to achieve uniform plating thickness
05/24/2005US6896776 Method and apparatus for electro-chemical processing
05/24/2005US6896774 Vapor deposition; applying vacuum; applying energy; for semiconductors, integrated circuits
05/24/2005US6896765 Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
05/24/2005US6896764 Vacuum processing apparatus and control method thereof
05/24/2005US6896763 Method and apparatus for monitoring a process by employing principal component analysis
05/24/2005US6896762 Separation method for object and glue membrane
05/24/2005US6896760 Fabrication of stacked microelectronic devices
05/24/2005US6896744 Method for cleaning a surface of a substrate
05/24/2005US6896743 Wafer drying methods of Marangoni type and apparatus suitable therefor
05/24/2005US6896740 Method of reducing water spotting and oxide growth on a semiconductor structure
05/24/2005US6896738 Induction heating devices and methods for controllably heating an article
05/24/2005US6896736 Photoresist purge control of semiconductor wafer coating equipment
05/24/2005US6896731 P-type single crystal zinc-oxide having low resistivity and method for preparation thereof
05/24/2005US6896728 Process for producing low defect density, ideal oxygen precipitating silicon
05/24/2005US6896710 Abrasives for CMP applications
05/24/2005US6896602 Wafer holding ring for chemical and mechanical polisher
05/24/2005US6896593 Microporous polishing pads
05/24/2005US6896590 CMP slurry and method for manufacturing a semiconductor device
05/24/2005US6896586 Method and apparatus for heating polishing pad
05/24/2005US6896585 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
05/24/2005US6896584 Method of controlling carrier head with multiple chambers
05/24/2005US6896513 Large area substrate processing system
05/24/2005US6896470 Front-opening unified pod auto-loading structure
05/24/2005US6896466 Substrate processing apparatus
05/24/2005US6896408 Temperature detection from differences in off leak currents of NMOS and PMOS transistors on CPU chip
05/24/2005US6896304 Automatic sensing wafer blade and method for using
05/24/2005US6896186 Semiconductor device and an information management system thereof
05/24/2005US6896173 Method of fabricating circuit substrate
05/24/2005US6896170 Wire bonder for ball bonding insulated wire and method of using same
05/24/2005US6895981 Cross flow processor
05/24/2005US6895979 Processing apparatus and processing method
05/24/2005US6895831 Sensor device for non-intrusive diagnosis of a semiconductor processing system
05/24/2005US6895776 Anti-stratification-solution delivery system for spin-on dielectrics
05/24/2005US6895731 Apparatus for populating transport tapes
05/24/2005US6895685 Vacuum processing apparatus and semiconductor manufacturing line using the same
05/24/2005US6895666 Underfill system for semiconductor package
05/24/2005US6895664 Method of making an optical coupling device
05/24/2005US6895658 Includes a free layer formed on a lower gap layer, a tunnel barrier layer formed on the free layer, and a pinned layer formed on the tunnel barrier layer
05/24/2005CA2357790C Heater module and optical waveguide module
05/24/2005CA2172888C Planar dielectric line and integrated circuit using same
05/24/2005CA2163130C Thin film capacitors on gallium arsenide substrate and process for making the same
05/19/2005WO2005046299A1 An apparatus and method for manufacturing integrated circuits, microelectromechanical system (mems) devices and nanofilters
05/19/2005WO2005046298A1 Method of conformal coating using noncontact dispensing
05/19/2005WO2005046292A1 Barrier thin film and organic el element employing barrier thin film
05/19/2005WO2005046207A2 Image sensor with deep well region and method of fabricating the image sensor
05/19/2005WO2005046013A1 Method for manufacturing gratings in semiconductor materials that readily oxidise
05/19/2005WO2005045997A2 An electrical circuit assembly with improved shock resistance
05/19/2005WO2005045934A2 Method and device for connecting chips
05/19/2005WO2005045932A1 Generation of metal holes by via mutation
05/19/2005WO2005045931A2 Semiconductor chip having flip-chip contacts and method for producing the same
05/19/2005WO2005045930A1 Leadframe with insulating ring
05/19/2005WO2005045925A1 Electronic device and process for manufacturing same
05/19/2005WO2005045924A1 An advanced technique for forming transistors having raised drain and source regions with different height
05/19/2005WO2005045923A1 A method for making a semiconductor device having increased conductive material reliability
05/19/2005WO2005045922A1 Method for forming a filled trench in a semiconductor layer
05/19/2005WO2005045921A1 Method of making a mems electrostatic chuck
05/19/2005WO2005045920A1 Device for carrying in and out boards, board carrying method and device therefor
05/19/2005WO2005045919A1 Non-contact id card and manufacturing method thereof
05/19/2005WO2005045918A1 Silicide formation for a semiconductor device
05/19/2005WO2005045917A1 Jig for heat treating semiconductor substrate and method for heat treating semiconductor substrate
05/19/2005WO2005045916A1 Method for processing substrate
05/19/2005WO2005045915A1 Radical generating method, etching method and apparatus for use in these methods
05/19/2005WO2005045914A1 Method of forming a low k dielectric in a semiconductor manufacturing process
05/19/2005WO2005045912A1 Etching liquid and etching method for low-k film
05/19/2005WO2005045911A1 Pattern formation method, electronic circuit manufactured by the same, and electronic device using the same
05/19/2005WO2005045910A1 Electronic device and method for its fabrication
05/19/2005WO2005045909A1 Ferroelectric capacitor devices and a method for compensating for damage to a capacitor caused by etching
05/19/2005WO2005045908A1 Method for bonding substrate, bonded substrate, and direct bonded substrate