| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 05/26/2005 | US20050112905 Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure |
| 05/26/2005 | US20050112904 Clean chemistry for tungsten/tungsten nitride gates |
| 05/26/2005 | US20050112903 Process for removing tungsten particles after tungsten etch-back |
| 05/26/2005 | US20050112902 Method to make small isolated features with pseudo-planarization for TMR and MRAM applications |
| 05/26/2005 | US20050112901 Removal of transition metal ternary and/or quaternary barrier materials from a substrate |
| 05/26/2005 | US20050112900 Method of processing wafers with resonant heating |
| 05/26/2005 | US20050112899 Methods and apparatus for cleaning semiconductor devices |
| 05/26/2005 | US20050112898 Method for etching a substrate and a device formed using the method |
| 05/26/2005 | US20050112897 Electrochemically polishing conductive films on semiconductor wafers |
| 05/26/2005 | US20050112896 Multi-bit phase change memory cell and multi-bit phase change memory including the same, method of forming a multi-bit phase change memory, and method of programming a multi-bit phase change memory |
| 05/26/2005 | US20050112895 Method of chemical-mechanical polishing |
| 05/26/2005 | US20050112894 CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method |
| 05/26/2005 | US20050112893 Method for producing a silicon wafer |
| 05/26/2005 | US20050112892 Chemical mechanical abrasive slurry and method of using the same |
| 05/26/2005 | US20050112891 Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulation |
| 05/26/2005 | US20050112890 CVD apparatuses and methods of forming a layer over a semiconductor substrate |
| 05/26/2005 | US20050112889 Semiconductor device manufacturing method and manufacturing line thereof |
| 05/26/2005 | US20050112888 Semiconductor metal contamination reduction for ultra-thin gate dielectrics |
| 05/26/2005 | US20050112887 Etching process |
| 05/26/2005 | US20050112885 Process for manufacturing a substrate and associated substrate |
| 05/26/2005 | US20050112884 Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate |
| 05/26/2005 | US20050112883 System and method for removal of photoresist in transistor fabrication for integrated circuit manufacturing |
| 05/26/2005 | US20050112880 Selective plating of package terminals |
| 05/26/2005 | US20050112879 Insulation film etching method |
| 05/26/2005 | US20050112878 Method for dry etching a semiconductor wafer |
| 05/26/2005 | US20050112877 Method of manufacturing a semiconductor device |
| 05/26/2005 | US20050112876 Method to form a robust TiCI4 based CVD TiN film |
| 05/26/2005 | US20050112875 Method for reducing the contact resistance of the connection regions of a semiconductor device |
| 05/26/2005 | US20050112873 Method for selective electroless attachment of contacts to electrochemically-active molecules |
| 05/26/2005 | US20050112872 Fabrication of nanoscale thermoelectric devices |
| 05/26/2005 | US20050112871 Multilevel copper interconnect with double passivation |
| 05/26/2005 | US20050112870 Method of forming a contact plug in a semiconductor device |
| 05/26/2005 | US20050112869 Method for fabricating semiconductor device |
| 05/26/2005 | US20050112868 Method and apparatus for localized material removal by electrochemical polishing |
| 05/26/2005 | US20050112867 Semiconductor device and manufacturing method thereof |
| 05/26/2005 | US20050112866 Semiconductor device and method of manufacturing the same |
| 05/26/2005 | US20050112865 Method for fabricating semiconductor device capable of preventing damages to conductive structure |
| 05/26/2005 | US20050112864 Back End Interconnect With a Shaped Interface |
| 05/26/2005 | US20050112863 Method for fabricating semiconductor device |
| 05/26/2005 | US20050112862 Crystallographic Modification of Hard mask Properties |
| 05/26/2005 | US20050112861 Roughened bonding pad and bonding wire surfaces for low pressure wire bonding |
| 05/26/2005 | US20050112860 Method for manufacturing nano-gap electrode device |
| 05/26/2005 | US20050112859 Method of forming a borderless contact opening featuring a composite tri-layer etch stop material |
| 05/26/2005 | US20050112858 Contact hole forming method |
| 05/26/2005 | US20050112857 Ultra-thin silicidation-stop extensions in mosfet devices |
| 05/26/2005 | US20050112856 Seed layer treatment |
| 05/26/2005 | US20050112855 Method and apparatus for doping semiconductors |
| 05/26/2005 | US20050112854 Method for manufacturing a semiconductor device |
| 05/26/2005 | US20050112853 System and method for non-destructive implantation characterization of quiescent material |
| 05/26/2005 | US20050112852 Using acoustic energy to activate implanted species |
| 05/26/2005 | US20050112851 Methods of forming semiconductor devices having multiple channel MOS transistors and related intermediate structures |
| 05/26/2005 | US20050112850 Method of manufacturing a semiconductor device |
| 05/26/2005 | US20050112848 Method of fabricating vertical integrated circuits |
| 05/26/2005 | US20050112847 Method for separating wafers bonded together to form a stacked structure |
| 05/26/2005 | US20050112846 Storage structure with cleaved layer |
| 05/26/2005 | US20050112845 Method for fabricating a substrate with useful layer on high resistivity support |
| 05/26/2005 | US20050112844 Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method |
| 05/26/2005 | US20050112843 Method for anodic bonding of wafers and device |
| 05/26/2005 | US20050112842 Integrating passive components on spacer in stacked dies |
| 05/26/2005 | US20050112841 Method for isolating semiconductor devices |
| 05/26/2005 | US20050112840 Shallow trench isolation dummy pattern and layout method using the same |
| 05/26/2005 | US20050112839 Method of selectively etching HSG layer in deep trench capacitor fabrication |
| 05/26/2005 | US20050112838 Method for forming inductor of semiconductor device |
| 05/26/2005 | US20050112837 Method of fabricating a bipolar junction transistor |
| 05/26/2005 | US20050112836 MIM capacitor structure and method of fabrication |
| 05/26/2005 | US20050112835 Method for fabricating transistor of semiconductor device |
| 05/26/2005 | US20050112834 Method of manufacturing a semiconductor device |
| 05/26/2005 | US20050112833 Method of fabricating a robust gate dielectric using a replacement gate flow |
| 05/26/2005 | US20050112832 Method of manufacturing semiconductor device |
| 05/26/2005 | US20050112831 Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants |
| 05/26/2005 | US20050112830 Ultra shallow junction formation |
| 05/26/2005 | US20050112829 Semiconductor device with silicided source/drains |
| 05/26/2005 | US20050112828 Method to form flash memory with very narrow polysilicon spacing |
| 05/26/2005 | US20050112827 High permittivity silicate gate dielectric |
| 05/26/2005 | US20050112826 Method of fabricating high voltage transistor |
| 05/26/2005 | US20050112825 Method for manufacturing a semiconductor device |
| 05/26/2005 | US20050112824 Method of forming gate oxide layers with multiple thicknesses on substrate |
| 05/26/2005 | US20050112823 Trench power MOSFET with reduced gate resistance |
| 05/26/2005 | US20050112822 Method in the fabrication of a monolithically integrated high frequency circuit |
| 05/26/2005 | US20050112821 Method of manufacturing split-gate memory |
| 05/26/2005 | US20050112820 Method for fabricating flash memory device and structure thereof |
| 05/26/2005 | US20050112819 Methods of forming capacitor structures including L-shaped cavities and related structures |
| 05/26/2005 | US20050112818 Capacitor structure having hemispherical grains |
| 05/26/2005 | US20050112817 Semiconductor device having high drive current and method of manufacture thereof |
| 05/26/2005 | US20050112815 Silicon-oxide-nitride-oxide-silicon (SONOS) memory device and methods of manufacturing and operating the same |
| 05/26/2005 | US20050112814 Method of fabricating CMOS transistor that prevents gate thinning |
| 05/26/2005 | US20050112813 Method for manufacturing transistor and image display device using the same |
| 05/26/2005 | US20050112812 Method for forming narrow trench structures |
| 05/26/2005 | US20050112811 Ultra-thin soi mosfet method and structure |
| 05/26/2005 | US20050112809 Method for crystallizing amorphous silicon film |
| 05/26/2005 | US20050112808 Metal-oxide-semiconductor device formed in silicon-on-insulator |
| 05/26/2005 | US20050112807 Thin film transistor, method of fabricating the same and flat panel display using thin film transistor |
| 05/26/2005 | US20050112806 Method of forming silicon oxide layer and method of manufacturing thin film transistor thereby |
| 05/26/2005 | US20050112805 Method for manufacturing semiconductor device |
| 05/26/2005 | US20050112803 Semiconductor device and its manufacturing method, and semiconductor device manufacturing system |
| 05/26/2005 | US20050112802 System and method for improved auto-boating |
| 05/26/2005 | US20050112800 Semiconductor device and method of fabricating the same |
| 05/26/2005 | US20050112799 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding |
| 05/26/2005 | US20050112798 Electronics circuit manufacture |
| 05/26/2005 | US20050112797 Wiring base, semiconductor device manufacturing method thereof and electronic equipment |