Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2005
10/06/2005US20050221740 Wafer holder and wafer conveyor system equipped with the same
10/06/2005US20050221733 Polishing apparatus
10/06/2005US20050221728 Low-K interlayer dielectric wafer grinding
10/06/2005US20050221725 Method of sucking water and water sucking device
10/06/2005US20050221724 Polishing apparatus and method of polishing a subject
10/06/2005US20050221720 Polishing apparatus
10/06/2005US20050221628 Semiconductor device and method of fabricating the same
10/06/2005US20050221627 Method for producing optical film
10/06/2005US20050221626 Chemically and electrically stabilized polymer films
10/06/2005US20050221625 Method for forming tungsten nitride film
10/06/2005US20050221624 Growing smooth semiconductor layers
10/06/2005US20050221623 Article comprising an oxide layer on a GaAs-based semiconductor structure and method of forming same
10/06/2005US20050221622 Deposition method and semiconductor device
10/06/2005US20050221621 Proximity head heating method and apparatus
10/06/2005US20050221620 Process for etching a substrate
10/06/2005US20050221619 System and method for etching a mask
10/06/2005US20050221618 System for controlling a plenum output flow geometry
10/06/2005US20050221617 Inductively coupled plasma chamber attachable to a processing chamber for analysis of process gases
10/06/2005US20050221616 3-stage method for forming deep trench structure and deep trench capacitor
10/06/2005US20050221615 Method of processing a substrate
10/06/2005US20050221614 Method and apparatus for forming contact hole
10/06/2005US20050221613 Electrode formation method, electrode and solar battery
10/06/2005US20050221612 A low thermal budget (mol) liner, a semiconductor device comprising said liner and method of forming said semiconductor device
10/06/2005US20050221611 Wiring structure of a semiconductor integrated circuit and a method of forming the wiring structure
10/06/2005US20050221608 Method for manufacturing semiconductor device and apparatus for manufacturing thereof
10/06/2005US20050221607 Method of forming metal wiring of semiconductor device
10/06/2005US20050221606 Single and dual damascene techniques utilizing composite polymer dielectric film
10/06/2005US20050221603 System architecture of semiconductor manufacturing equipment
10/06/2005US20050221602 Electrodepositing a metal in integrated circuit applications
10/06/2005US20050221601 Semiconductor device and method for manufacturing the same
10/06/2005US20050221600 Method of manufacturing a semiconductor device having damascene structures with air gaps
10/06/2005US20050221599 Etching method, semiconductor and fabricating method for the same
10/06/2005US20050221598 Wafer support and release in wafer processing
10/06/2005US20050221597 Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
10/06/2005US20050221595 System and method for forming a semiconductor with an analog capacitor using fewer structure steps
10/06/2005US20050221594 ISFET with TiO2 sensing film
10/06/2005US20050221593 Selective growth method, and semiconductor light emitting device and fabrication method thereof
10/06/2005US20050221592 Method of growing III-V compound semiconductor layer, substrate product, and semiconductor device
10/06/2005US20050221591 Method of forming high-quality relaxed SiGe alloy layers on bulk Si substrates
10/06/2005US20050221590 Manufacturing method of nitride semiconductor device and nitride semiconductor device
10/06/2005US20050221589 Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
10/06/2005US20050221588 Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
10/06/2005US20050221587 Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
10/06/2005US20050221586 Methods and apparatus for laser dicing
10/06/2005US20050221585 Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon
10/06/2005US20050221584 Wafer processing method
10/06/2005US20050221583 Method for making thin layers containing microcomponents
10/06/2005US20050221582 Bonding tool for mounting semiconductor chips
10/06/2005US20050221581 Wafer stacking using copper structures of substantially uniform height
10/06/2005US20050221580 Method of manufacturing semiconductor device
10/06/2005US20050221579 Semiconductor device and method of fabricating the same
10/06/2005US20050221578 Semiconductor device with shallow trench isolation and method of fabricating the same
10/06/2005US20050221576 Storage electrode of a semiconductor device and method of forming the same
10/06/2005US20050221575 Novel method to fabricate high reliable metal capacitor within copper back-end process
10/06/2005US20050221574 Method for fabricating semiconductor device
10/06/2005US20050221573 Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film
10/06/2005US20050221572 High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
10/06/2005US20050221571 Dual metal schottky diode
10/06/2005US20050221570 Process for producing a base connection of a bipolar transistor
10/06/2005US20050221569 Semiconductor thin film manufacturing method and device, beam-shaping mask, and thin film transistor
10/06/2005US20050221568 Manufacturing method of semiconductor device, semiconductor device, substrate for electro-optical device, electro-optical device, and electronic apparatus
10/06/2005US20050221565 Ferroelectric memory element and method for manufacturing the same
10/06/2005US20050221564 System and method for mitigating oxide growth in a gate dielectric
10/06/2005US20050221563 Enhanced substrate contact for a semiconductor device
10/06/2005US20050221562 Method for manufacturing semiconductor device having thick insulating layer under gate side walls
10/06/2005US20050221561 Semiconductor integrated circuit device and method for manufacturing the same
10/06/2005US20050221560 Method of forming a vertical memory device with a rectangular trench
10/06/2005US20050221559 Non-volatile semiconductor memory device and method of fabricating the same
10/06/2005US20050221558 Method for manufacturing flash memory device
10/06/2005US20050221557 Method for producing a deep trench capacitor in a semiconductor substrate
10/06/2005US20050221556 Method of manufacturing semiconductor device
10/06/2005US20050221555 Embedded capacitors using conductor filled vias
10/06/2005US20050221554 Back end IC wiring with improved electro-migration resistance
10/06/2005US20050221553 Floating gate non-volatile memory
10/06/2005US20050221552 Substrate support for in-situ dry clean chamber for front end of line fabrication
10/06/2005US20050221551 Method of forming semiconductor integrated device
10/06/2005US20050221550 Dual layer semiconductor devices
10/06/2005US20050221549 Semiconductor laser device
10/06/2005US20050221548 Semiconductor device having a laterally modulated gate workfunction and method of fabrication
10/06/2005US20050221547 Method for manufacturing semiconductor device
10/06/2005US20050221546 Thin film transistor array panel and manufacturing method thereof
10/06/2005US20050221545 Method for manufacturing semiconductor device
10/06/2005US20050221544 Methods of fabricating semiconductor devices having thin film transistors
10/06/2005US20050221543 Double gated transistor and method of fabrication
10/06/2005US20050221542 Semiconductor device and manufacturing method thereof
10/06/2005US20050221541 Ultra thin back-illuminated photodiode array fabrication methods
10/06/2005US20050221540 Use of DAR coating to modulate the efficiency of laser fuse blows
10/06/2005US20050221539 Semiconductor device capable of preventing moisture-absorption of fuse area thereof and method for manufacturing the fuse area
10/06/2005US20050221538 Resin encapsulated semiconductor device and the production method
10/06/2005US20050221537 Plastic packaging with high heat dissipation and method for the same
10/06/2005US20050221536 Method of manufacturing radiating plate and semiconductor apparatus using the same
10/06/2005US20050221535 Method for making self-coplanarity bumping shape for flip chip
10/06/2005US20050221534 Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
10/06/2005US20050221533 Method of making chip package with grease heat sink
10/06/2005US20050221532 Stress-compensation layers in contact arrays, and processes of making same
10/06/2005US20050221531 Carrier substrates and conductive elements thereof
10/06/2005US20050221530 Method for enhancing electrical characteristics of organic electronic devices
10/06/2005US20050221529 Complex microdevices and apparatus and methods for fabricating such devices
10/06/2005US20050221528 Microelectronic mechanical system and methods
10/06/2005US20050221527 Light emitting diode and fabrication method thereof