Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2005
12/06/2005US6972254 Manufacturing a conformal atomic liner layer in an integrated circuit interconnect
12/06/2005US6972253 Method for forming dielectric barrier layer in damascene structure
12/06/2005US6972252 Method of improving adhesion between two dielectric films
12/06/2005US6972251 Method for fabricating copper damascene structures in porous dielectric materials
12/06/2005US6972250 Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned CoSi2 on raised source drain Si/SiGe device
12/06/2005US6972249 Use of nitrides for flip-chip encapsulation
12/06/2005US6972248 Method of fabricating semiconductor device
12/06/2005US6972247 Method of fabricating strained Si SOI wafers
12/06/2005US6972246 Method for manufacturing an oriented crystalline semiconductor using a pulsed laser
12/06/2005US6972245 Method for co-fabricating strained and relaxed crystalline and poly-crystalline structures
12/06/2005US6972244 Marking semiconductor devices through a mount tape
12/06/2005US6972242 Methods to fabricate semiconductor devices
12/06/2005US6972241 Method of forming an STI feature to avoid electrical charge leakage
12/06/2005US6972240 Forming of close thin trenches
12/06/2005US6972239 Low temperature MOCVD processes for fabrication of PrXCa1-xMnO3 thin films
12/06/2005US6972237 Lateral heterojunction bipolar transistor and method of manufacture using selective epitaxial growth
12/06/2005US6972236 Semiconductor device layout and channeling implant process
12/06/2005US6972235 Method for processing semiconductor substrate
12/06/2005US6972234 High voltage MOS devices with high gated-diode breakdown voltage and punch-through voltage
12/06/2005US6972233 Field effect transistor fabrication including formation of a channel in a pore
12/06/2005US6972232 Method of manufacturing a semiconductor device
12/06/2005US6972231 Rad Hard MOSFET with graded body diode junction and reduced on resistance
12/06/2005US6972230 Method for fabricating a floating gate memory device
12/06/2005US6972229 Method of manufacturing self-aligned non-volatile memory device
12/06/2005US6972228 Method of forming an element of a microelectronic circuit
12/06/2005US6972227 Semiconductor processing methods, and methods of forming a dynamic random access memory (DRAM) storage capacitor
12/06/2005US6972226 Charge-trapping memory cell array and method for production
12/06/2005US6972225 integrating n-type and P-type metal gate transistors
12/06/2005US6972224 Method for fabricating dual-metal gate device
12/06/2005US6972223 Use of atomic oxygen process for improved barrier layer
12/06/2005US6972222 Temporary self-aligned stop layer is applied on silicon sidewall
12/06/2005US6972221 Thin film semiconductor device and method for manufacturing same
12/06/2005US6972220 Structures and methods of anti-fuse formation in SOI
12/06/2005US6972219 Thin film transistor self-aligned to a light-shield layer
12/06/2005US6972218 Semiconductor device and fabricating method thereof
12/06/2005US6972217 Low k polymer E-beam printable mechanical support
12/06/2005US6972215 Thin-film semiconductor device and method of manufacturing the same
12/06/2005US6972209 Stacked via-stud with improved reliability in copper metallurgy
12/06/2005US6972208 Method for manufacturing a light emitting diode having a transparent substrate
12/06/2005US6972206 Nitride semiconductor, semiconductor device, and method of manufacturing the same
12/06/2005US6972204 Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
12/06/2005US6972202 Method of manufacturing and testing a semiconductor device
12/06/2005US6972201 Using scatterometry to detect and control undercut for ARC with developable BARCs
12/06/2005US6972165 Electron beam exposure mask and electron beam exposure method using the same
12/06/2005US6972096 Chemical-mechanical polishing process
12/06/2005US6972071 High-speed symmetrical plasma treatment system
12/06/2005US6972069 Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
12/06/2005US6972051 Bulk single crystal gallium nitride and method of making same
12/06/2005US6972050 Method for depositing in particular crystalline layers, and device for carrying out the method
12/06/2005US6971950 Polishing silicon wafers
12/06/2005US6971945 Multi-step polishing solution for chemical mechanical planarization
12/06/2005US6971863 Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent
12/06/2005US6971832 Magnetically coupled linear delivery system transferring wafers between a cassette and a processing reactor
12/06/2005US6971735 Ink-jet printhead board, ink-jet printhead, and ink-jet printing apparatus
12/06/2005US6971580 Automated method of and system for dimensioning objects over a conveyor belt structure by applying contouring tracing, vertice detection, corner point detection, and corner point reduction methods to two-dimensional range data maps of the space above the conveyor belt captured by an amplitude modulated laser scanning beam
12/06/2005US6971500 Conveyorized storage and transportation system
12/06/2005US6971432 Sample processing system
12/06/2005US6971163 used for attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulation
12/06/2005US6971151 Methods of treating physical vapor deposition targets
12/01/2005WO2005115072A2 Support with solder globule elements and a method for assembly of substrates with globule contacts
12/01/2005WO2005114746A1 Novel structures of silicon carbide metal semiconductor field effect transistors for high voltage and high power applications
12/01/2005WO2005114745A1 Semiconductor device of high breakdown voltage and manufacturing method thereof
12/01/2005WO2005114742A2 Silicon on insulator read-write non-volatile memory comprising lateral thyristor and trapping layer
12/01/2005WO2005114741A2 Semiconductor device having a spacer layer doped with slower diffusing atoms than substrate
12/01/2005WO2005114739A2 Manufacturing method of composite sheet material using ultra-fast laser pulses
12/01/2005WO2005114738A1 Tuneable semiconductor device
12/01/2005WO2005114734A1 Bitline implant utilizing dual poly
12/01/2005WO2005114731A2 Double density method for wirebond interconnect
12/01/2005WO2005114730A1 Process for producing semiconductor device and semiconductor device
12/01/2005WO2005114728A1 Semiconductor device, wiring board and manufacturing method thereof
12/01/2005WO2005114727A2 Semiconductor die attachment for high vaccum tubes
12/01/2005WO2005114725A1 Semiconductor resistance element and manufacturing method thereof, and semiconductor device using semiconductor resistance element
12/01/2005WO2005114724A1 Laminated body and semiconductor device
12/01/2005WO2005114723A1 Determining the position of a semiconductor substrate on a rotation device
12/01/2005WO2005114722A1 Test apparatus
12/01/2005WO2005114721A1 Encapsulation method and device which is intended, for example, for micromechanical devices
12/01/2005WO2005114720A2 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
12/01/2005WO2005114719A2 Method of forming a recessed structure employing a reverse tone process
12/01/2005WO2005114718A1 Semiconductor process and integrated circuit having dual metal oxide gate dielectric with single metal gate electrode
12/01/2005WO2005114717A2 Implant optimization scheme
12/01/2005WO2005114716A2 Process for metallic contamination reduction in silicon wafers
12/01/2005WO2005114715A1 Method for cleaning substrate surface
12/01/2005WO2005114714A1 Wafer expanding apparatus, component supplying apparatus and wafer sheet expanding method
12/01/2005WO2005114713A1 Impurity introducing method and electronic element using it
12/01/2005WO2005114712A1 Planar avalanche photodiode
12/01/2005WO2005114711A1 Liquid for immersion exposure and immersion exposure method
12/01/2005WO2005114710A1 Semiconductor product quality control method and quality control system thereof
12/01/2005WO2005114709A2 Inter-process sensing of wafer outcome
12/01/2005WO2005114708A2 Carbon nanotube-silicon composite structures and methods for making same
12/01/2005WO2005114707A2 Materials suitable for shallow trench isolation
12/01/2005WO2005114498A1 Lsi layout apparatus, and method and program thereof
12/01/2005WO2005114332A1 Electronic beam recording board
12/01/2005WO2005114331A1 Resist compound and resist composition
12/01/2005WO2005114307A1 Laterally implanted electroabsorption modulated laser
12/01/2005WO2005114228A1 Laminated board and probe card
12/01/2005WO2005114074A1 Capacitance sensing for substrate cooling
12/01/2005WO2005113696A1 Adhesive film and method for manufacturing semiconductor device using same
12/01/2005WO2005113375A1 Substrate reception container, substrate reception body, and substrate conveyance device
12/01/2005WO2005113134A1 Method for oxidizing substance and oxidation apparatus therefor
12/01/2005WO2005112583A2 Integrated ball and via package and formation process
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