Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2005
12/01/2005US20050263799 Switching circuit and semiconductor device
12/01/2005US20050263797 Self-aligned isolation double-gate get
12/01/2005US20050263796 Semiconductor device
12/01/2005US20050263795 Semiconductor device having a channel layer and method of manufacturing the same
12/01/2005US20050263794 Integrated circuitry
12/01/2005US20050263793 Wire bonding method and apparatus for integrated circuit
12/01/2005US20050263792 Semiconductor device
12/01/2005US20050263789 Field effect transistor
12/01/2005US20050263788 Heterojunction field effect semiconductor device
12/01/2005US20050263778 Nitride-based semiconductor element and method of forming nitride-based semiconductor
12/01/2005US20050263776 Semiconductor light-emitting device and method for forming the same
12/01/2005US20050263774 Polycrystalline Si thin film structure and fabrication method thereof and method of fabricating TFT using the same
12/01/2005US20050263773 Liquid crystal display device having polycrystalline TFT and fabricating method thereof
12/01/2005US20050263772 Thin film display transistor array substrate for a liquid crystal display having repair lines
12/01/2005US20050263771 Semiconductor device, and manufacturing method thereof
12/01/2005US20050263770 Semiconductor device
12/01/2005US20050263769 Liquid crystal display device and fabricating method thereof
12/01/2005US20050263768 Liquid crystal display device and fabricating method thereof
12/01/2005US20050263767 Semiconductor device and method for manufacturing the same
12/01/2005US20050263765 Thin film transistor and display device, method for manufacturing the same, and television system
12/01/2005US20050263763 Methods of forming devices, constructions and systems comprising thyristors
12/01/2005US20050263761 Thin film transistor, flat panel display having the same and a method of fabricating each
12/01/2005US20050263760 Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
12/01/2005US20050263759 Semiconductor devices and method for manufacturing the same, semiconductor device modules, circuit substrates and electronic apparatuses
12/01/2005US20050263756 Organic field effect transistor and method of manufacturing the same
12/01/2005US20050263754 Substrates for growth of chemical compound semiconductors, chemical compound semiconductors using the substrates and processes for producing thereof
12/01/2005US20050263753 Semiconductor substrate layer configured for inducement of compressive or expansive force
12/01/2005US20050263743 Etching with organic ammonium compound and/or oxoammonium compound, water, and solvent
12/01/2005US20050263722 Method for reducing proximity effects in electron beam lithography
12/01/2005US20050263720 Method and apparatus for recycling gases used in a lithography tool
12/01/2005US20050263719 Ultraviolet ray generator, ultraviolet ray irradiation processing apparatus, and semiconductor manufacturing system
12/01/2005US20050263702 Defect inspection and charged particle beam apparatus
12/01/2005US20050263701 Substrate inspection method, method of manufacturing semiconductor device, and substrate inspection apparatus
12/01/2005US20050263605 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
12/01/2005US20050263517 Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
12/01/2005US20050263516 Heating device
12/01/2005US20050263490 Method of passivating chemical mechanical polishing compositions for copper film planarization processes
12/01/2005US20050263489 Ruthenium silicide wet etch
12/01/2005US20050263488 Etching system and method for treating the etching solution thereof
12/01/2005US20050263487 Method of high selectivity SAC etching
12/01/2005US20050263486 Forming of oblique trenches
12/01/2005US20050263485 Method and apparatus for process control in time division multiplexed (TDM) etch processes
12/01/2005US20050263484 Adjustable shielding plate for adjusting an etching area of a semiconductor wafer and related apparatus and methods
12/01/2005US20050263483 Modifying the viscosity of etchants
12/01/2005US20050263482 Method of manufacturing circuit device
12/01/2005US20050263407 Electrochemical-mechanical polishing composition and method for using the same
12/01/2005US20050263406 Polishing pad for electrochemical mechanical polishing
12/01/2005US20050263400 Method of applying cladding material on conductive lines of MRAM devices
12/01/2005US20050263390 A tantalum nitride/Ta barrier is first sputter deposited with high target power and wafer bias, argon etching is performed with even higher wafer bias. a flash step is applied with reduced target power and wafer bias; different magnetic field distributions
12/01/2005US20050263312 Moisture-resistant electronic device package and methods of assembly
12/01/2005US20050263249 Substrate support system
12/01/2005US20050263247 Plasma processing apparatus and plasma processing method
12/01/2005US20050263238 Placing a resin sheet in a surface recess or inner void in ceramic green sheets; laminating the sheets with the resin sheet in place; and firing the laminate, which decomposes the resin sheet; deformation and delamination in the recess or void site area is prevented
12/01/2005US20050263217 High purity niobium and products containing the same, and methods of making the same
12/01/2005US20050263184 System and method for supplying chemicals
12/01/2005US20050263170 Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants
12/01/2005US20050263078 Drive mechanism for a vacuum treatment apparatus
12/01/2005US20050263077 Adaptive shape substrate support method
12/01/2005US20050263076 Atomic layer deposition apparatus having improved reactor and sample holder
12/01/2005US20050263073 Furnace for heating a wafer and chemical vapor deposition apparatus having the same
12/01/2005US20050263071 Apparatus and system for manufacturing a semiconductor
12/01/2005US20050263068 Lithographic apparatus
12/01/2005US20050263067 Film forming apparatus, manufacturing management system and method of manufacturing semiconductor devices
12/01/2005US20050263066 Apparatus for electroless deposition of metals onto semiconductor substrates
12/01/2005US20050263065 Vapor assisted growth of gallium nitride
12/01/2005US20050263025 Micro-contact printing method
12/01/2005US20050262966 Generating an aerosol including a liquid comprising a nickel precursor and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy
12/01/2005US20050262716 Method and device for controlling position of cassette in semiconductor manufacturing equipment
12/01/2005DE20321016U1 Probe station for measuring ultra-low current in integrated circuit, has cable in which additional layer is arranged between outer dielectric and shield conductor to reduce existing triboelectric current generation
12/01/2005DE19902908B4 Verfahren zur Herstellung von Chalkogenidschichten durch chemische Umsetzung von Schichten aus Metallen oder Metallverbindungen im niederenergetischen Chalkogen-Ionenstrahl A process for preparing chalcogenide layers by chemical reaction of layers of metals or metal compounds in the low energy ion beam chalcogen
12/01/2005DE19860829B4 Verfahren zur Herstellung eines Halbleiterbausteins A process for producing a semiconductor device
12/01/2005DE19820319B4 Halbleiterbaustein Semiconductor device
12/01/2005DE10340131B4 Halbleiterleistungsbauteil mit Ladungskompensationsstruktur und monolithisch integrierter Schaltung, sowie Verfahren zu dessen Herstellung The semiconductor power component having charge compensation structure and a monolithically integrated circuit, and to processes for the preparation thereof
12/01/2005DE10204222B4 Verfahren zur Seitenwandpassivierung beim Plasmaätzen A method for sidewall passivation during plasma etching
12/01/2005DE10202257B4 Verfahren zum Fixieren von Chipträgern A method of fixing of chip carriers
12/01/2005DE102005028167A1 Process and assembly to treat semiconductor wafer in liquid etching bath with inner wall and outer wall
12/01/2005DE102005019357A1 Halbleitervorrichtung, beinhaltend ein Halbleiterspeicherelement und Verfahren zum Herstellen derselben A semiconductor device including a semiconductor memory element and method of manufacturing the same
12/01/2005DE102005018319A1 Nitridhalbleitervorrichtung und deren Herstellungsverfahren Nitride semiconductor and their method of preparation
12/01/2005DE102005018318A1 Nitridhalbleitervorrichtung und deren Herstellungsverfahren Nitride semiconductor and their method of preparation
12/01/2005DE102005013802A1 Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung A light emitting device and lighting device
12/01/2005DE102005009976A1 Transistor mit Dotierstoff tragendem Metall im Source- und Drainbereich Transistor with dopant wearing metal in the source and drain regions
12/01/2005DE102005007333A1 Multichip housing has housing substrate with two semiconductor shapes configured to be serially connected through a high speed communications protocol
12/01/2005DE102005001259A1 Polierverfahren für ein Halbleitersubstrat sowie dabei verwendete Polier-Spanneinrichtung A polishing method for a semiconductor substrate, and used therein polishing jig
12/01/2005DE102004063691A1 Semiconductor device ion implanting method, involves nonuniformly implanting dose of implanted ions in central portion and edge portions of semiconductor substrate with different scanning speed in different directions
12/01/2005DE102004063404A1 Fabrication of nonvolatile memory by sequentially forming first and second insulation layers on substrate, forming hard mask, depositing silicon, forming quantum dots, removing hard mask, forming third insulation layer, and forming gate
12/01/2005DE102004054567A1 Process for simultaneous two sided removal of material from semiconductor wafers has wafer between rotary working discs and direction reversal at reduced force
12/01/2005DE102004054565A1 Production of a semiconductor wafer comprises not turning the wafer during inspection of the front and rear sides
12/01/2005DE102004034397A1 Bildsensormodul und Verfahren zum Herstellen eines Waferebenenpakets Image sensor module and method of manufacturing a wafer-level package
12/01/2005DE102004022781A1 SOI-Scheiben mit MEMS-Strukturen und verfüllten Isolationsgräben definierten Querschnitts SOI wafers with MEMS structures and isolation trenches backfilled defined cross-section
12/01/2005DE102004022328A1 Controlling the temperature of a semiconductor chip, especially a DRAM, by provision of a heating resistance, temperature sensor and temperature regulation element
12/01/2005DE102004022178A1 Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn A method of fabricating a wiring on a substrate and the component to a conductor track manufactured in such a way
12/01/2005DE102004022177A1 Verfahren zur Herstellung eines Koplanarleitungssystem auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement zur Übertragung von elektromagnetischen Wellen A method for producing a Koplanarleitungssystem on a substrate and produced by such a process component for transmitting electromagnetic waves
12/01/2005DE102004022176A1 Verfahren zur Herstellung von passiven Bauelementen auf einem Substrat und mittels eines derartigen Verfahren hergestelltes Bauteil A process for the production of passive components on a substrate and by means of such process produced component
12/01/2005DE102004022139A1 Verfahren zur Herstellung einer Spiralinduktivität auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement A method of manufacturing a spiral inductor on a substrate and produced by such a process component
12/01/2005DE102004021927A1 Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul A process for the inner electrical insulation of a substrate for a power semiconductor module
12/01/2005DE102004021633A1 Verfahren zum Verbinden eines Halbleiterchips mit einem Chipträger und Anordnung mit einem Halbleiterchip und einem Chipträger A method of connecting a semiconductor chip with a chip carrier assembly and having a semiconductor chip and a chip carrier
12/01/2005DE102004021392A1 Hotplate for processing semiconductor wafers has means to heat the chamber surface above the wafer to prevent condensation of evaporated material
12/01/2005DE102004020877A1 Chipmodul und Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
12/01/2005DE102004011858A1 EEPROM-Speicherzelle für hohe Temperaturen EEPROM memory cell for high temperatures
12/01/2005DE102004009901B4 Vorrichtung zum Singulieren und Bonden von Halbleiterchips und Verfahren zum Singulieren und Bonden Apparatus for singulating and bonding semiconductor chips and method for singulating and bonding
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