Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2005
12/08/2005US20050269613 Ferroelectric transistor gate stack with resistance-modified conductive oxide
12/08/2005US20050269611 Ferroelectric device and method of manufacturing such a device
12/08/2005US20050269609 Solid state image sensors
12/08/2005US20050269605 CMOS image sensor device and method
12/08/2005US20050269602 Semiconductor device and method of manufacturing the same
12/08/2005US20050269601 Semiconductor device
12/08/2005US20050269600 Integrated field-effect transistor comprising two control regions, use of said field-effect transistor and method for producing the same
12/08/2005US20050269598 Silicon barrier capacitor device structure
12/08/2005US20050269597 Complementary analog bipolar transistors with trench-constrained isolation diffusion
12/08/2005US20050269596 Bipolar transistor, oscillation circuit, and voltage controlled oscillator
12/08/2005US20050269595 Semiconductor device and method for manufacturing the same
12/08/2005US20050269594 Transistors amd methods for making the same
12/08/2005US20050269593 Group III-nitride layers with patterned surfaces
12/08/2005US20050269588 Flip chip type nitride semiconductor light-emitting diode
12/08/2005US20050269587 Power light emitting die package with reflecting lens and the method of making the same
12/08/2005US20050269577 Surface treatment method and surface treatment device
12/08/2005US20050269575 Vertical semiconductor devices or chips and method of mass production of the same
12/08/2005US20050269574 Uniform contact
12/08/2005US20050269573 Method and device with durable contact on silicon carbide
12/08/2005US20050269572 Thin film transistor device and method of manufacturing the same
12/08/2005US20050269571 Method of forming thin-film transistor devices with electro-static discharge protection
12/08/2005US20050269570 Method of fabrication of printed transistors
12/08/2005US20050269569 Semiconductor device and method of fabricating the same
12/08/2005US20050269568 Organic thin film transistor and flat panel display comprising the same
12/08/2005US20050269567 Test key for monitoring gate conductor to deep trench misalignment
12/08/2005US20050269566 Programmable structure, an array including the structure, and methods of forming the same
12/08/2005US20050269564 Light dependent polymeric field effect transistor
12/08/2005US20050269562 Thin film transistor (TFT) and flat display panel having the thin film transistor (TFT)
12/08/2005US20050269561 Strained Si on multiple materials for bulk or SOI substrates
12/08/2005US20050269527 Method of implanting a substrate and an ion implanter for performing the method
12/08/2005US20050269525 Lithographic apparatus and device manufacturing method
12/08/2005US20050269520 Icon implantation ion source, system and method
12/08/2005US20050269512 Semiconductor device including vanadium oxide sensor element with restricted current density
12/08/2005US20050269511 Probe driving method, and probe apparatus
12/08/2005US20050269483 Imaging apparatus and device
12/08/2005US20050269385 Soldering method and solder joints formed therein
12/08/2005US20050269334 Variable seal pressure slit valve doors for semiconductor manufacturing equipment
12/08/2005US20050269300 Laser thin film poly-silicon annealing optical system
12/08/2005US20050269298 Light irradiator and light irradiating method
12/08/2005US20050269295 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
12/08/2005US20050269294 Etching method
12/08/2005US20050269292 Plasma processing apparatus and method, and electrode plate for plasma processing apparatus
12/08/2005US20050269291 Method of operating a processing system for treating a substrate
12/08/2005US20050269290 Etch-resistant film, forming method thereof, surface-modified resist pattern, forming method thereof, semiconductor device and manufacturing method thereof
12/08/2005US20050269286 Method of fabricating a nano-wire
12/08/2005US20050269242 Stackable tray for integrated circuit chips
12/08/2005US20050269241 Integrated circuit wafer packaging system and method
12/08/2005US20050269240 Semiconductor inspection apparatus and tray for inspection parts used thereof
12/08/2005US20050269212 Method of making rolling electrical contact to wafer front surface
12/08/2005US20050269128 Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
12/08/2005US20050269031 Plasma treatment system
12/08/2005US20050269030 Processing system and method for treating a substrate
12/08/2005US20050269023 Method of cutting laminate with laser and laminate
12/08/2005US20050269012 Method of producing ceramic multilayer board
12/08/2005US20050268963 Process for manufacturing photovoltaic cells
12/08/2005US20050268958 Solar cell module connector and method of producing solar cell module panel
12/08/2005US20050268944 Method and apparatus for cleaning containers
12/08/2005US20050268939 Wet cleaning apparatus and methods
12/08/2005US20050268938 Method and system for supplying carbon dioxide to a semiconductor tool having variable flow requirement
12/08/2005US20050268937 Scrubber with sonic nozzle
12/08/2005US20050268857 Uniformly compressed process chamber gate seal for semiconductor processing chamber
12/08/2005US20050268855 Evaporative deposition with enhanced film uniformity and stoichiometry
12/08/2005US20050268853 Vapor phase deposition apparatus, method for depositing thin film and method for manufacturing semiconductor device
12/08/2005US20050268851 Method for processing interior of vapor phase deposition apparatus, method for depositing thin film and method for manufacturing semiconductor device
12/08/2005US20050268850 Plasma processing system
12/08/2005US20050268849 Film forming apparatus and film forming method
12/08/2005US20050268847 Selective deposition system and method for initiating deposition at a defined starting surface
12/08/2005US20050268844 Discharge device and discharge method
12/08/2005US20050268842 AlGaInN Single-Crystal Wafer
12/08/2005US20050268804 Lithographic method for small line printing
12/08/2005US20050268801 Method and stencil for extruding material on a substrate
12/08/2005US20050268763 Method and apparatus for cutting semiconductor wafers
12/08/2005US20050268698 High-resolution gas gauge proximity sensor
12/08/2005US20050268581 Chemical filter arrangement for a semiconductor manufacturing apparatus
12/08/2005US20050268580 Air-purifying device for a front-opening unified pod
12/08/2005US20050268457 Apparatus and method for mounting electronic components
12/08/2005US20050268408 Cleaning system
12/08/2005DE20320829U1 Insulation trench for separating two monocrystalline silicon regions on oxide layer has walls slightly sloping away from bottom of trench formed by oxide layer
12/08/2005DE20221269U1 Gaszuführvorrichtung zur Abscheidung atomarer Schichten The gas supply apparatus for atomic layer deposition
12/08/2005DE19853617B4 Verfahren zum Herstellen eines Metallkontakt-Teils A method of producing a metal contact portion
12/08/2005DE19730762B4 Flash-Speicherzelle und Verfahren zu deren Herstellung Flash memory cell and method for producing them
12/08/2005DE19727264B4 Halbleitervorrichtung mit einer t-förmigen Feldoxidschicht und Verfahren zu deren Herstellung A semiconductor device comprising a T-shaped field oxide film and methods for their preparation
12/08/2005DE102005022574A1 Halbleiterspeicherbauelement mit Isolationsgrabenstruktur und zugehöriges Herstellungsverfahren The semiconductor memory device with grave isolation structure and associated production method
12/08/2005DE102005019997A1 Thin silicon plates washing method, involves clamping plates on two front sides lying opposite to each other during washing of plates, and feeding washing fluid between plates into upper area of plates
12/08/2005DE102005006086A1 Verfahren zur Erkennung von Chipfehlpositionen Method for detecting faulty chip positions
12/08/2005DE102004062472A1 Fabrication of metal interconnection line in semiconductor device by nitriding the metal layer to form a barrier metal layer, and forming metal interconnection line on barrier metal layer by burying the contact openings
12/08/2005DE102004060421A1 NAND Flashspeicherbauelement und Verfahren zur Bildung eines Reservoirs eines NAND Flashspeicherbauelements NAND flash memory device and method for forming a reservoir of a NAND flash memory device
12/08/2005DE102004056654A1 Capacitative element is formed by producing a substrate, forming a structured cover layer on top with at least one trough, applying etch resistant material and precipitating electrode layers
12/08/2005DE102004052634A1 Verfahren zur Herstellung von Wärme-Flussmesselementen A process for producing heat-flow-measuring elements
12/08/2005DE102004051842A1 Bemassung eines ausgedehnten Defekts Dimensioning of an extended defect
12/08/2005DE102004035556B3 Verfahren und Einrichtung, insbesondere probecard, zum Kalibrieren eines Halbleiter-Baulement-Test-Systems, insbesondere eines Halbleiter-Bauelement-Testgeräts Method and apparatus, in particular probe card, for calibrating a semiconductor element Baule-test system, especially a semiconductor device testing apparatus
12/08/2005DE102004030138A1 Atomic layer deposition unit comprises a reactor chamber with a substrate holder, a heater, a pump and a carrier gas source
12/08/2005DE102004024552B3 Speicherzellenanordnung mit einer Doppel-Speicherzelle Memory cell arrangement having a double memory cell
12/08/2005DE102004023987A1 Elektrische Prüfeinrichtung Electrical test equipment
12/08/2005DE102004023985A1 Electronic storage component, formed by producing a crystalline silicon wall and a polysilicon wall on a substrate, covering the walls, forming troughs, and applying an insulating layer
12/08/2005DE102004023835A1 Wafer and/or chip testing method, involves including reference data record that contains one result of electrical measurement of wafer and/or chip manufactured with production process, whose results characterize process
12/08/2005DE102004023805A1 Herstellungsverfahren für eine Halbleiterstruktur mit integrierten Kondensatoren und entsprechende Halbleiterstruktur Manufacturing method of a semiconductor structure with integrated capacitors and corresponding semiconductor structure
12/08/2005DE102004022604A1 Sublithographic contact structure is formed by producing primary and secondary contacts and providing sublithographic dimensions by chemical reaction
12/08/2005DE102004021541A1 Passivierung von Brennstrecken Passivation of focal distances
12/08/2005DE102004005255B4 Verfahren zum Anordnen einer Leitungsstruktur mit Nanoröhren auf einem Substrat A method of disposing a line structure with nanotubes on a substrate
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