Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2005
12/13/2005US6974739 Fabrication of dielectric on a gate surface to insulate the gate from another element of an integrated circuit
12/13/2005US6974738 Nonplanar device with stress incorporation layer and method of fabrication
12/13/2005US6974736 Method of forming FET silicide gate structures incorporating inner spacers
12/13/2005US6974735 Dual layer Semiconductor Devices
12/13/2005US6974734 Process for manufacturing a memory device, in particular a phase change memory, including a silicidation step
12/13/2005US6974733 Double-gate transistor with enhanced carrier mobility
12/13/2005US6974732 Semiconductor device method of manufacturing
12/13/2005US6974731 Laser apparatus, laser annealing method, and manufacturing method of a semiconductor device
12/13/2005US6974730 Method for fabricating a recessed channel field effect transistor (FET) device
12/13/2005US6974729 Integrated semiconductor fin device and a method for manufacturing such device
12/13/2005US6974728 Encapsulant mixture having a polymer bound catalyst
12/13/2005US6974727 Method of manufacturing a hybrid integrated circuit device
12/13/2005US6974726 Silicon wafer with soluble protective coating
12/13/2005US6974724 Shielded laminated structure with embedded chips
12/13/2005US6974721 Method for manufacturing thin semiconductor chip
12/13/2005US6974720 Methods of forming power semiconductor devices using boule-grown silicon carbide drift layers and power semiconductor devices formed thereby
12/13/2005US6974717 Solid state image device and including an optical lens and a microlens
12/13/2005US6974716 Method for fabricating a titanium nitride sensing membrane on an EGFET
12/13/2005US6974715 Method for manufacturing CMOS image sensor using spacer etching barrier film
12/13/2005US6974713 Micromirrors with mechanisms for enhancing coupling of the micromirrors with electrostatic fields
12/13/2005US6974712 Method of fabricating a surface-type optical apparatus
12/13/2005US6974711 Method of manufacturing a display panel
12/13/2005US6974710 Fabrication method of semiconductor integrated circuit device and testing method
12/13/2005US6974709 Method and device for providing a semiconductor etching end point and for detecting the end point
12/13/2005US6974708 Oxidation structure/method to fabricate a high-performance magnetic tunneling junction MRAM
12/13/2005US6974659 Protecting a semiconductor process wafer surface from contacting thermally degraded photoresist comprising the steps of: providing a semiconductor process wafer having a process surface; forming protective layer over selected areas
12/13/2005US6974658 Used in manufacturing a semiconductor device
12/13/2005US6974651 Method of making a photomask
12/13/2005US6974649 Support frames; stress relieving membrane; reducing defects; scattering layer pattern
12/13/2005US6974635 Package for electronic component, lid material for package lid, and production method for lid material
12/13/2005US6974604 Method of self-latching for adhesion during self-assembly of electronic or optical components
12/13/2005US6974600 Changing fluid photosensitive material into a photosensitive material having a band form, having length longer than width, applying such material to the first surface to stabilize photosensitive material
12/13/2005US6974558 A substrate made of an aluminum/silicon carbide composite alloy comprises aluminum-silicon carbide alloy parts and non alloy silicon carbide parat dispersed therin; oxygen freesintering aluminum and silcon carbide powder compact
12/13/2005US6974550 Apparatus and method for controlling the voltage applied to an electrostatic shield used in a plasma generator
12/13/2005US6974525 Method and apparatus for electrochemical planarization of a workpiece
12/13/2005US6974521 Method for separating a film and a substrate
12/13/2005US6974505 Tool for cleaning substrates
12/13/2005US6974330 Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating same
12/13/2005US6974168 System and method for performing simultaneous precision die bond of photonic components onto a single substrate
12/13/2005US6974094 Anti-corrosion shower head used in dry etching process and method of manufacturing the same
12/13/2005US6974069 Solder ball attaching system and method
12/13/2005US6973934 Method for removing particles on semiconductor wafers
12/13/2005US6973719 Method of making a thermal management for a circuit board panel
12/08/2005WO2005117510A1 Multilayer printed wiring board
12/08/2005WO2005117262A1 Optically rearrangeable logic circuit
12/08/2005WO2005117151A1 Positive electrode structure and gallium nitride-based compound semiconductor light-emitting device
12/08/2005WO2005117147A1 Method for producing an area having reduced electrical conductivity within a semiconductor layer and optoelectronic semiconductor element
12/08/2005WO2005117144A2 Gate driver output stage with bias circuit for high and wide operating voltage range
12/08/2005WO2005117138A1 Semiconductor substrate for solar cell, method for manufacturing the same, and solar cell
12/08/2005WO2005117132A1 Planar dual gate semiconductor device
12/08/2005WO2005117131A1 Electric device with vertical component
12/08/2005WO2005117130A2 Stepped tip junction with spacer layer
12/08/2005WO2005117129A1 Improved dielectric passivation for semiconductor devices
12/08/2005WO2005117126A1 Method for forming fine particle array on substrate and semiconductor element
12/08/2005WO2005117125A2 Yield improvement in silicon-germanium epitaxial growth
12/08/2005WO2005117123A1 Soi substrate and method for producing same
12/08/2005WO2005117122A1 Process for producing simox substrate and simox substrate produced by the process
12/08/2005WO2005117121A2 Memory arrays; methods of forming memory arrays; and methods of forming contacts to bitlines
12/08/2005WO2005117120A1 Semiconductor device and process for fabricating the same
12/08/2005WO2005117119A1 Semiconductor device and its fabricating process
12/08/2005WO2005117117A1 Method and system for stacking integrated circuits
12/08/2005WO2005117116A1 Semiconductor device
12/08/2005WO2005117111A2 Adhesive/spacer island structure for multiple die package
12/08/2005WO2005117110A1 Packaged integrated circuit with mlp leadframe and method of making same
12/08/2005WO2005117104A1 Semiconductor device and method of manufacturing such a device
12/08/2005WO2005117103A1 Semiconductor device and process for fabricating the same
12/08/2005WO2005117102A2 Low-voltage single-layer polysilicon eeprom memory cell
12/08/2005WO2005117101A2 Method for making a semiconductor structure using silicon germanium
12/08/2005WO2005117100A1 Support bar for substrate cassette
12/08/2005WO2005117099A1 Tape adhering apparatus and tape adhering method
12/08/2005WO2005117098A1 Tape bonder, tape bonding method, and process for manufacturing electronic component
12/08/2005WO2005117097A1 Lift pin with roller glide for reducing friction
12/08/2005WO2005117096A1 Circuit module manufacturing method and circuit module manufactured by the method
12/08/2005WO2005117095A1 Method and device for ultrasonic bonding
12/08/2005WO2005117094A1 Plasma processing method and method for fabricating electronic component module using the same
12/08/2005WO2005117093A1 Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same
12/08/2005WO2005117092A2 Stacked semiconductor package having adhesive/spacer structure and insulation
12/08/2005WO2005117091A1 Method for fabricating semiconductor devices having a substrate which includes group iii-nitride material
12/08/2005WO2005117090A1 Integrated circuit with impurity barrier
12/08/2005WO2005117089A2 Decoupled complementary mask patterning transfer method
12/08/2005WO2005117088A1 Microcontamination abatement in semiconductor processing
12/08/2005WO2005117087A1 Formation of a silicon oxynitride layer on a high-k dielectric material
12/08/2005WO2005117086A1 Stabilization of high-k dielectric materials
12/08/2005WO2005117085A2 Gap-type conductive interconnect structures in semiconductor device
12/08/2005WO2005117084A1 Reactive fluid systems for removing deposition materials and methods for using same
12/08/2005WO2005117083A1 Substrate processing apparatus
12/08/2005WO2005117082A1 Dry etching gases and method of dry etching
12/08/2005WO2005117081A1 Liquid treatment system and liquid treatment method
12/08/2005WO2005117080A1 Plasma generator, plasma processing apparatus using same and electronic device
12/08/2005WO2005117079A1 Silicon layer production method and solar cell production method
12/08/2005WO2005117078A1 Gallium nitride-based semiconductor stacked structure, production method thereof, and compound semiconductor and light-emitting device each using the stacked structure
12/08/2005WO2005117077A1 Method for producing solid element plasma and its plasma source
12/08/2005WO2005117076A1 Compound semiconductor epitaxial substrate and process for producing the same
12/08/2005WO2005117075A1 Correcting method, predicting method, exposuring method, reflectance correcting method, reflectance measuring method, exposure apparatus, and device manufacturing method
12/08/2005WO2005117074A1 Immersion liquid for immersion exposure process and method for forming resist pattern using such immersion liquid
12/08/2005WO2005117073A2 Semiconductor device and method for manufacture
12/08/2005WO2005117072A1 Method and device for detaching a component which is attached to a flexible film
12/08/2005WO2005117071A2 Optoelectronic semiconductor component and housing base for such a component
12/08/2005WO2005117070A2 Surface-emitting semiconductor laser component featuring emission in a vertical direction
12/08/2005WO2005117059A1 Charge neutralization device