Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2005
11/29/2005US6969650 Methods of forming gate structures in nonvolatile memory devices having curved side walls formed using oxygen pathways
11/29/2005US6969649 Method of manufacturing semiconductor integrated circuit devices having a memory device with a reduced bit line stray capacity and such semiconductor integrated circuit devices
11/29/2005US6969648 Method for forming buried plate of trench capacitor
11/29/2005US6969647 Method of making single layer capacitor
11/29/2005US6969646 Method of activating polysilicon gate structure dopants after offset spacer deposition
11/29/2005US6969645 Method of manufacturing a semiconductor device comprising a non-volatile memory with memory cells
11/29/2005US6969644 Versatile system for triple-gated transistors with engineered corners
11/29/2005US6969643 Thin film transistor array panel used for a liquid crystal display and a manufacturing method thereof
11/29/2005US6969642 Method of controlling implantation dosages during coding of read-only memory devices
11/29/2005US6969641 Method and system for integrated circuit packaging
11/29/2005US6969640 Air pocket resistant semiconductor package system
11/29/2005US6969639 Wafer level hermetic sealing method
11/29/2005US6969638 Low cost substrate for an integrated circuit device with bondpads free of plated gold
11/29/2005US6969634 Semiconductor layers with roughness patterning
11/29/2005US6969632 Method for fabricating image sensor semiconductor package
11/29/2005US6969631 Method of forming photodiode with self-aligned implants for high quantum efficiency
11/29/2005US6969629 Method for manufacturing micro-structural unit
11/29/2005US6969626 Method for forming LED by a substrate removal process
11/29/2005US6969625 CMP assisted liftoff micropatterning
11/29/2005US6969624 Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate
11/29/2005US6969623 Semiconductor device and method for manufacturing the same
11/29/2005US6969622 Anisotropically conductive connector, its manufacture method and probe member
11/29/2005US6969621 Contamination distribution apparatus and method
11/29/2005US6969620 Semiconductor device inspection system
11/29/2005US6969619 Full spectrum endpoint detection
11/29/2005US6969618 SOI device having increased reliability and reduced free floating body effects
11/29/2005US6969617 Method for manufacturing NAND type nonvolatile ferroelectric memory cell
11/29/2005US6969580 Method of manufacturing semiconductor device
11/29/2005US6969577 Adaptable for exposure to far ultraviolet radiation using ArF and KrF as light sources in the of manufacturing semiconductor devices and has various performance, resolution, mask linearity of CD, scum free, reduced thinning of resist film
11/29/2005US6969572 Developing method and apparatus
11/29/2005US6969568 etched by a plasma containing one of a nitrogen augmented hydro-fluorocarbon oxygen mixture and a nitrogen augmented fluorocarbon oxygen mixture
11/29/2005US6969539 Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide
11/29/2005US6969538 controlling the substrate temperature after coating the resist film,in baking steps, to maintain the substrate temperature uniform when the temperature of the substrate reaches the reaction temperature, leads to uniform coating
11/29/2005US6969502 Method and device for growing large-volume oriented monocrystals
11/29/2005US6969470 Method for fabricating ESI device using smile and delayed LOCOS techniques
11/29/2005US6969456 Method of using vertically configured chamber used for multiple processes
11/29/2005US6969448 Method for forming a metallization structure in an integrated circuit
11/29/2005US6969436 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
11/29/2005US6969425 Methods for reducing the curvature in boron-doped silicon micromachined structures
11/29/2005US6969308 Method and apparatus for chemical and mechanical polishing
11/29/2005US6969304 Method of polishing semiconductor wafer
11/29/2005US6969302 Semiconductor wafer grinding method
11/29/2005US6969301 Filling plugs through chemical mechanical polish
11/29/2005US6969297 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
11/29/2005US6969227 Wafer transport apparatus
11/29/2005US6969224 Workpiece levitating device
11/29/2005US6968938 Convey device for a plate-like workpiece
11/29/2005US6968753 Vibration-dampening base for ball-type lead screw of load port transfer system
11/29/2005US6968630 Vacuum processing apparatus and operating method therefor
11/29/2005CA2493503C Group iii nitride photonic devices on silicon carbide substrates with conductive buffer interlayer structure
11/29/2005CA2438581C Organic light emitting diode display having shield electrodes
11/29/2005CA2413726C Absorbing compounds for spin-on glass anti-reflective coatings for photolithography
11/29/2005CA2305203C Group iii nitride photonic devices on silicon carbide substrates with conductive buffer interlayer structure
11/24/2005WO2005112537A1 Part feeding head device and part mounting head device
11/24/2005WO2005112535A1 Plate storing body for supplying component and component supplying apparatus
11/24/2005WO2005112262A1 Method and apparatus for detecting the position of light which is incident to a semiconductor die
11/24/2005WO2005112132A1 Transparent contact and method for the production thereof
11/24/2005WO2005112129A1 Semiconductor device and process for fabricating same, and process for producing semiconductor substrate
11/24/2005WO2005112128A2 Trench mosfet including buried source electrode and method of fabricating the same
11/24/2005WO2005112127A1 SEMICONDUCTOR DEVICE BASED ON Si-Ge WITH HIGH STRESS LINER FOR ENHANCED CHANNEL CARRIER MOBILITY
11/24/2005WO2005112124A2 Isolation trench
11/24/2005WO2005112123A2 Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
11/24/2005WO2005112120A1 Methods and apparatus for wordline protection in flash memory devices
11/24/2005WO2005112119A1 Nrom device
11/24/2005WO2005112116A1 Semiconductor device with a protected active die region and method therefor
11/24/2005WO2005112115A1 Single row bond pad arrangement of an integrated circuit chip
11/24/2005WO2005112113A2 Mounting with auxiliary bumps
11/24/2005WO2005112111A1 Pressure contact type rectifier
11/24/2005WO2005112110A1 A method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
11/24/2005WO2005112109A1 Soi disks comprising mems structures and filled isolating trenches having a defined cross-section
11/24/2005WO2005112108A1 Substrate processing apparatus and method of manufacturing semiconductor device
11/24/2005WO2005112107A1 Substrate storage container and method of positioning the container
11/24/2005WO2005112106A1 Wafer storage container
11/24/2005WO2005112105A1 Method for forming suspended transmission line structures in back end of line processing
11/24/2005WO2005112104A2 Cmos transistor using high stress liner layer
11/24/2005WO2005112103A2 Microfabricated miniature grids
11/24/2005WO2005112102A2 Chemical-enhanced package singulation process
11/24/2005WO2005112101A2 Organometallic precursor compounds
11/24/2005WO2005112100A2 Stacked module systems and methods
11/24/2005WO2005112099A2 Method of semiconductor fabrication in corporating disposable spacer into elevated source/drain processing
11/24/2005WO2005112098A2 Blood drawing device with flash detection
11/24/2005WO2005112097A1 Semiconductor device and method for fabricating the same, semiconductor substrate and method for producing the same
11/24/2005WO2005112096A1 Electrode pad on conductive semiconductor substrate
11/24/2005WO2005112095A1 An improved method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
11/24/2005WO2005112094A2 Method for making a semiconductor structure using silicon germanium
11/24/2005WO2005112093A2 Gas distribution system having fast gas switching capabilities
11/24/2005WO2005112092A2 CARBON-DOPED-Si OXIDE ETCH USING H2 ADDITIVE IN FLUOROCARBON ETCH CHEMISTRY
11/24/2005WO2005112091A1 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
11/24/2005WO2005112090A2 Adhesion of a metal layer to a substrate and related structures
11/24/2005WO2005112089A1 Semiconductor device and method for manufacturing same
11/24/2005WO2005112088A1 Semiconductor device manufacturing method and manufacturing apparatus
11/24/2005WO2005112087A1 Implanted counted dopant ions
11/24/2005WO2005112086A1 Manganese doped magnetic semiconductors
11/24/2005WO2005112085A1 Copper doped magnetic semiconductors
11/24/2005WO2005112084A1 Method for forming organic light-emitting layer
11/24/2005WO2005112083A1 Cyclic pulsed plasma atomic layer deposition method
11/24/2005WO2005112082A1 Cyclic pulsed two-level plasma atomic layer deposition apparatus and method
11/24/2005WO2005112081A1 Vaporizer with integral diaphragm
11/24/2005WO2005112080A1 Iii nitride semiconductor crystal and manufacturing method thereof, iii nitride semiconductor device and manufacturing method thereof, and light emitting device
11/24/2005WO2005112079A1 Gallium oxide single crystal composite, process for producing the same, and process for producing nitride semiconductor film utilizing gallium oxide single crystal composite
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