| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/06/2006 | WO2006035591A1 Method for forming copper wiring |
| 04/06/2006 | WO2006035541A1 Semiconductor device |
| 04/06/2006 | WO2006035411A2 Reduction of sheet resistance of phosphorus implanted poly-silicon |
| 04/06/2006 | WO2006035387A1 Deep trench electrically isolated medium voltage cmos devices and method for making the same |
| 04/06/2006 | WO2006035377A2 Integrated sicr metal thin film resistors for sige rf-bicmos technology |
| 04/06/2006 | WO2006035281A1 Precursor for film formation and method for forming ruthenium-containing film |
| 04/06/2006 | WO2006035134A1 Composite material for producing high-thermally conductive ribs for heat exchangers |
| 04/06/2006 | WO2006035031A1 New structure for microelectronics and microsystem and manufacturing process |
| 04/06/2006 | WO2006035017A1 Electronic device with a multi-layered ceramic substrate and a heat-removal body |
| 04/06/2006 | WO2006034970A1 Semiconductor assembly comprising a tunnel contact and method for producing said assembly |
| 04/06/2006 | WO2006034854A2 Semiconductor memory device having charge-trapping memory cells |
| 04/06/2006 | WO2006034767A1 Electrical assembly and method for the production of an electrical assembly |
| 04/06/2006 | WO2006034680A1 Semiconductor chip comprising a metal coating structure and associated production method |
| 04/06/2006 | WO2006034679A2 Method for producing a strained layer on a substrate and layered structure |
| 04/06/2006 | WO2006034672A2 Method for treating semiconductor substrates that are annealed by means of intensive light pulses |
| 04/06/2006 | WO2006034664A1 Conductor frame for an electronic component and method for the production thereof |
| 04/06/2006 | WO2006019670A3 Vibratable die attachment tool |
| 04/06/2006 | WO2006014249A3 Use of a chalcogen plasma to form chalcogenide switching materials for nanoscale electronic devices |
| 04/06/2006 | WO2006013508A3 Wafer with improved conductive loops in the dicing lines |
| 04/06/2006 | WO2006013137A3 Method for etching a layer on a substrate |
| 04/06/2006 | WO2006009444A3 Method and apparatus for inspecting a specimen surface and use of fluorescent materials |
| 04/06/2006 | WO2006002138A3 Etch and deposition control for plasma implantation |
| 04/06/2006 | WO2006001915A3 Semiconductor device with multiple semiconductor layers |
| 04/06/2006 | WO2005124849A3 System and method for forming multi-component dielectric films |
| 04/06/2006 | WO2005123988B1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
| 04/06/2006 | WO2005117121A3 Memory arrays; methods of forming memory arrays; and methods of forming contacts to bitlines |
| 04/06/2006 | WO2005104147A3 Cmos-compatible light emitting aperiodic photonic structures |
| 04/06/2006 | WO2005098977A3 Reflector packages and methods for packaging of a semiconductor light emitting device |
| 04/06/2006 | WO2005079293A3 Integrated iii-nitride power devices |
| 04/06/2006 | WO2005067657A3 Method of packaging an optical sensor |
| 04/06/2006 | WO2005065436A3 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 04/06/2006 | WO2005065385A3 Power semiconductor devices and methods of manufacture |
| 04/06/2006 | WO2005062998A8 Metal interconnect system and method for direct die attachment |
| 04/06/2006 | WO2005003668A3 Microchannel heat exchangers and methods of manufacturing the same |
| 04/06/2006 | WO2005001519A3 Embedded waveguide detectors |
| 04/06/2006 | WO2004083901A3 Detection of macro-defects using micro-inspection inputs |
| 04/06/2006 | WO2004027110A3 Additives to prevent degradation of alkyl-hydrogen siloxanes |
| 04/06/2006 | US20060074510 Network-based photomask data entry interface and instruction generator for manufacturing photomasks |
| 04/06/2006 | US20060074507 Information providing method and system |
| 04/06/2006 | US20060074150 molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; |
| 04/06/2006 | US20060073998 Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal |
| 04/06/2006 | US20060073769 Polishing method |
| 04/06/2006 | US20060073731 Multiple function wall cover plate |
| 04/06/2006 | US20060073708 Strained silicon on insulator from film transfer and relaxation by hydrogen implantation |
| 04/06/2006 | US20060073707 Low 1c screw dislocation 3 inch silicon carbide wafer |
| 04/06/2006 | US20060073706 Etching silicon nitride from conductive oxide material (In2O3, RuO2) by adding an oxidant CO, NO, NO2, CO2) to chlorine or fluorine etching gas to improve selectivity resulting in silicon nitride spacers on the step structure suited for ferroelectric random access memory memory transistor fabrication |
| 04/06/2006 | US20060073705 Method for dividing semiconductor wafer along streets |
| 04/06/2006 | US20060073704 Method of forming bump that may reduce possibility of losing contact pad material |
| 04/06/2006 | US20060073703 Dynamic edge bead removal |
| 04/06/2006 | US20060073702 Memory structure and manufacturing as well as programming method thereof |
| 04/06/2006 | US20060073701 Method of manufacturing a substrate with through electrodes |
| 04/06/2006 | US20060073700 Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece |
| 04/06/2006 | US20060073699 Method for fabricating semiconductor device |
| 04/06/2006 | US20060073698 Plasma enhanced nitride layer |
| 04/06/2006 | US20060073697 Method for improving low-K dielectrics by supercritical fluid treatments |
| 04/06/2006 | US20060073696 Semiconductor device and manufacturing method thereof |
| 04/06/2006 | US20060073695 Gas dielectric structure forming methods |
| 04/06/2006 | US20060073694 Method for isolating semiconductor device structures and structures thereof |
| 04/06/2006 | US20060073693 Redistribution layer of wafer and the fabricating method thereof |
| 04/06/2006 | US20060073692 Method for forming an electrode |
| 04/06/2006 | US20060073691 Methods of manufacturing a semiconductor device |
| 04/06/2006 | US20060073690 Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece |
| 04/06/2006 | US20060073689 Method for fabricating doped polysilicon lines |
| 04/06/2006 | US20060073688 Gate stacks |
| 04/06/2006 | US20060073687 Method for maskless fabrication of self-aligned structures comprising a metal oxide |
| 04/06/2006 | US20060073686 Method and system for reducing the impact of across-wafer variations on critical dimension measurements |
| 04/06/2006 | US20060073685 Method for implanting dopants within a substrate by tilting the substrate relative to the implant source |
| 04/06/2006 | US20060073684 Method for fabricating a doped zone in a semiconductor body |
| 04/06/2006 | US20060073683 Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage |
| 04/06/2006 | US20060073682 Low-k dielectric material based upon carbon nanotubes and methods of forming such low-k dielectric materials |
| 04/06/2006 | US20060073681 Nanoheteroepitaxy of Ge on Si as a foundation for group III-V and II-VI integration |
| 04/06/2006 | US20060073680 Epitaxial growth of aligned algainn nanowires by metal-organic chemical vapor deposition |
| 04/06/2006 | US20060073679 CVD doped structures |
| 04/06/2006 | US20060073678 System and method for hydrogen exfoliation gettering |
| 04/06/2006 | US20060073677 Wafer dividing method and dividing apparatus |
| 04/06/2006 | US20060073676 Pre-process before cutting a wafer and method of cutting a wafer |
| 04/06/2006 | US20060073675 Semiconductor device and method of manufacturing thereof |
| 04/06/2006 | US20060073674 Strained gettering layers for semiconductor processes |
| 04/06/2006 | US20060073673 Ammonium hydroxide treatments for semiconductor substrates |
| 04/06/2006 | US20060073672 Integrated BiCMOS semiconductor circuit |
| 04/06/2006 | US20060073671 Method of producing element separation structure |
| 04/06/2006 | US20060073670 Method of manufacturing a semiconductor device |
| 04/06/2006 | US20060073669 Method of manufacturing a semiconductor device |
| 04/06/2006 | US20060073668 Production method for electric double-layer capacitor |
| 04/06/2006 | US20060073667 Stabilized silver nanoparticles and their use |
| 04/06/2006 | US20060073666 Non-volatile memory device with conductive sidewall spacer and method for fabricating the same |
| 04/06/2006 | US20060073665 Source/drain extensions having highly activated and extremely abrupt junctions |
| 04/06/2006 | US20060073664 Semiconductor device and manufacturing method of the same |
| 04/06/2006 | US20060073663 Method of manufacturing semiconductor device |
| 04/06/2006 | US20060073662 Method of manufacturing multi-channel transistor device and multi-channel transistor device manufactured using the method |
| 04/06/2006 | US20060073661 Method for forming wall oxide layer and isolation layer in flash memory device |
| 04/06/2006 | US20060073660 Method of manufacturing flash memory device |
| 04/06/2006 | US20060073659 Method for fabricating a storage capacitor |
| 04/06/2006 | US20060073658 Method for making a ferroelectric memory cell in a ferroelectric memory device, and a ferroelectric memory device |
| 04/06/2006 | US20060073657 Junction diode comprising varying semiconductor compositions |
| 04/06/2006 | US20060073656 Method and system for improved nickel silicide |
| 04/06/2006 | US20060073655 Phase change memory with a select device having a breakdown layer |
| 04/06/2006 | US20060073654 Maintenance system, substrate processing device, remote operation device, and communication method |
| 04/06/2006 | US20060073653 Methods of fabricating flash memory devices with floating gates that have reduced seams |
| 04/06/2006 | US20060073652 Phase change memory with ovonic threshold switch |