Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2006
03/29/2006EP1640711A1 Time-resolved measurement apparatus
03/29/2006EP1640645A1 Shaft sealing apparatus
03/29/2006EP1640475A2 Precursor compounds for deposition of ceramic and metal films and preparation methods thereof
03/29/2006EP1640474A1 Thin film forming device and thin film forming method
03/29/2006EP1640424A1 Polishing composition and process for producing wiring structure using it
03/29/2006EP1640423A1 Coating composition, porous siliceous film, method for preparing porous siliceous film, and semiconductor device
03/29/2006EP1640342A1 Silane polymer and method for forming silicon film
03/29/2006EP1640340A1 High purity phosphoric acid and method for production thereof
03/29/2006EP1640295A1 Ball transfer unit and ball table
03/29/2006EP1639873A2 A method of forming an integrated circuit substrate
03/29/2006EP1639652A2 Nonplanar device with stress incorporation layer and method of fabrication
03/29/2006EP1639649A1 Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication
03/29/2006EP1639648A2 Integrated circuit having pairs of parallel complementary finfets
03/29/2006EP1639646A2 Apparatus and method for split transistor memory having improved endurance
03/29/2006EP1639643A1 Optimized multi-application assembly
03/29/2006EP1639642A2 Economical high-frequency package
03/29/2006EP1639641A1 Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe
03/29/2006EP1639638A2 One transistor flash memory cell
03/29/2006EP1639637A1 High-performance cmos soi device on hybrid crystal-oriented substrates
03/29/2006EP1639636A1 Pmos transistor strain optimization with raised junction regions
03/29/2006EP1639635A1 Interconnect structures in integrated circuit devices
03/29/2006EP1639634A1 Electronic device, assembly and methods of manufacturing an electronic device
03/29/2006EP1639633A2 Improved annealing method for stabilisation
03/29/2006EP1639632A2 A process system health index and method of using the same
03/29/2006EP1639631A1 Method and apparatus for removing a residual organic layer from a substrate using reactive gases
03/29/2006EP1639630A1 Polishing apparatus and polishing method
03/29/2006EP1639629A1 Method and apparatus for thin-layer chemical processing of semiconductor wafers
03/29/2006EP1639626A1 Storage system for wafers
03/29/2006EP1639412A2 Developer composition for resists and method for formation of resist pattern
03/29/2006EP1639156A1 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
03/29/2006EP1639148A1 Mask retaining device
03/29/2006EP1639053A1 Cmp of noble metals
03/29/2006EP1638864A2 Wafer box with radially pivoting latch elements
03/29/2006EP1638734A1 Apparatus and method for controlling the film thickness on a polishing pad
03/29/2006EP1638732A2 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes
03/29/2006EP1518150B1 Method of reticle fabrication using an amorphous carbon layer
03/29/2006EP1488670A4 Method and apparatus for encapsulating semiconductor device
03/29/2006EP1438772A4 Line selected f 2? two chamber laser system
03/29/2006EP1433743B1 Method for preparing cobalt-protein complex
03/29/2006EP1432843B1 Method for making carbon doped oxide film
03/29/2006EP1395394B1 Polishing apparatus and polishing pad
03/29/2006EP1353792B1 Catalytic reactive pad for metal cmp
03/29/2006EP1348048B1 Process for preparing single crystal silicon having improved gate oxide integrity
03/29/2006EP1346417B1 Trench schottky barrier rectifier and method of making the same
03/29/2006EP1269479B1 Bi-directional capable bucket brigade circuit
03/29/2006EP1214739B1 Copper deposit process
03/29/2006EP1208521B1 Unitary package identification and dimensioning system employing ladar-based scanning methods
03/29/2006EP1205964B1 Plasma process device, electrode structure thereof, and stage structure
03/29/2006EP1153419B1 Multiple chip module with integrated rf capabilities
03/29/2006EP1152861B1 Method for producing building components, use thereof, airbearing workpiece and vacuum treatment chamber
03/29/2006EP1151211B1 Method and device for vibration control
03/29/2006EP1116011B1 Tuning a substrate temperature measurement system
03/29/2006EP1070677B1 Microcap wafer-level package
03/29/2006EP1015931B1 Projection light facility for microlithography
03/29/2006EP0953204B1 Capacitively coupled rf-plasma reactor and method for manufacturing workpieces
03/29/2006EP0844663B1 Method for manufacturing a circuit member for a semiconductor device
03/29/2006EP0809798B1 Method for polishing a wafer and method for manufacturing an integrated circuit
03/29/2006CN2768205Y Plane helix inductance with metal wire width and metal distance gradual change
03/29/2006CN2768200Y Substrate supporting assembly
03/29/2006CN2767710Y 真空泵浦系统 Vacuum pump system
03/29/2006CN1754409A Plasma processing system
03/29/2006CN1754271A Methods of forming thin film transistors and related systems
03/29/2006CN1754264A Gallium arsenide hbt having increased performance and method for its fabrication
03/29/2006CN1754262A Thin-film capacitative element and electronic circuit or electronic equipment including the same
03/29/2006CN1754261A Thin-film capacitative element and electronic circuit or electronic equipment including the same
03/29/2006CN1754259A Semiconductor integrated circuit device and its power supply wiring method
03/29/2006CN1754258A Integrated electronic component having specifically produced nanotubes in vertical structures
03/29/2006CN1754257A Layered hard mask and dielectric materials and methods therefor
03/29/2006CN1754256A Semiconductor component with trench insulation and corresponding production method
03/29/2006CN1754255A Self-supporting contacting structures that are directly produced on components without housings
03/29/2006CN1754254A Semiconductor device and radiation detector employing it
03/29/2006CN1754253A Crystallization apparatus and method of amorphous silicon
03/29/2006CN1754252A Method for producing hydrogenated silicon oxycarbide films
03/29/2006CN1754251A Method of improving interlayer adhesion
03/29/2006CN1754250A Exposure apparatus, exposure method, and method for producing device
03/29/2006CN1754249A Neutral particle beam lithography
03/29/2006CN1754248A Electronic part mounting apparatus
03/29/2006CN1754247A Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems
03/29/2006CN1754129A Exposure apparatus for liquid crystal panel and exposure apparatus
03/29/2006CN1754120A Liquid crystal display
03/29/2006CN1754101A Method and apparatus for detecting an unused state in a semiconductor circuit
03/29/2006CN1754087A Method for determining the temperature of a semiconductor wafer in a rapid thermal processing system
03/29/2006CN1754007A Method for depositing silicon
03/29/2006CN1753962A Modular barrier removal polishing slurry
03/29/2006CN1753961A Cmp composition comprising a sulfonic acid and a method for polishing noble metals
03/29/2006CN1753775A Method for producing flexible metal foil-polyimide laminate
03/29/2006CN1753603A Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
03/29/2006CN1753600A Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus
03/29/2006CN1753202A Organic thin film transistor and flat panel display including the same
03/29/2006CN1753189A Nonvolatile memory devices with trenched side-wall transistors and method of fabricating the same
03/29/2006CN1753188A Semiconductor structure and forming method thereof
03/29/2006CN1753185A Memory cell and mfg. method
03/29/2006CN1753183A Semiconductor device and method of manufacturing a semiconductor device
03/29/2006CN1753179A External pin lens semiconductor packaging structure and its manufacturing method
03/29/2006CN1753178A Packaging structure of contact type sensor and its manufacturing method
03/29/2006CN1753177A Power semiconductor module and method of manufacturing the same
03/29/2006CN1753176A Inversion packaging structure, semiconductor chip having convex block and its manufacturing method
03/29/2006CN1753175A Semiconductor packaging structure and its manufacturing method
03/29/2006CN1753169A Electronic device and method for fabricating the same
03/29/2006CN1753168A Levelling method of multilayer laminated polycrystalline silicon grid for flash storage