Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2006
03/30/2006US20060066324 Method for measuring impurity metal concentration
03/30/2006US20060066006 Fabrication of 3d photopolymeric devices
03/30/2006US20060065984 Package stress management
03/30/2006US20060065980 Semiconductor device
03/30/2006US20060065978 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
03/30/2006US20060065971 Electronic circuit packages
03/30/2006US20060065967 Apparatus for singulating and bonding semiconductor chips, and method for the same
03/30/2006US20060065963 Electronic device
03/30/2006US20060065955 Method for forming wiring pattern, wiring pattern, and electronic apparatus
03/30/2006US20060065954 High-performance CMOS SOI devices on hybrid crystal-oriented substrates
03/30/2006US20060065945 Chemical sensor using chemically induced electron-hole production at a Schottky barrier
03/30/2006US20060065941 Encapsulation component for integrated micro electromechanical systems and fabrication process of the component
03/30/2006US20060065939 Metal gate electrode semiconductor device
03/30/2006US20060065938 Method and system for forming a feature in a high-k layer
03/30/2006US20060065937 Short channel effect of MOS devices by retrograde well engineering using tilted dopant implantation into recessed source/drain regions
03/30/2006US20060065936 Multiple doping level bipolar junctions transistors and method for forming
03/30/2006US20060065935 Patterned backside stress engineering for transistor performance optimization
03/30/2006US20060065924 Semiconductor device containing dielectrically isolated PN junction for enhanced breakdown characteristics
03/30/2006US20060065922 Semiconductor memory with vertical charge-trapping memory cells and fabrication
03/30/2006US20060065920 Semiconductor memory device and method for producing the same
03/30/2006US20060065918 Semiconductor device and method of fabricating the same
03/30/2006US20060065913 Semiconductor device with double barrier film
03/30/2006US20060065910 Method of forming vias in silicon carbide and resulting devices and circuits
03/30/2006US20060065909 Selective delamination of thin-films by interface adhesion energy contrasts and thin film transistor devices formed thereby
03/30/2006US20060065906 Method for manufacturing and semiconductor light emitting device
03/30/2006US20060065894 Thin film transistor array panel and manufacturing method thereof
03/30/2006US20060065893 Method of forming gate by using layer-growing process and gate structure manufactured thereby
03/30/2006US20060065888 Organic semiconductor diode
03/30/2006US20060065856 Wave interrogated near field arrays system and method for detection of subwavelength scale anomalies
03/30/2006US20060065701 Method for manufacturing laminate, and method for manufacturing ink jet-head
03/30/2006US20060065633 Semiconductor substrate polishing methods and equipment
03/30/2006US20060065630 Plasma processing method and apparatus, and storage medium
03/30/2006US20060065629 Method for treating a substrate
03/30/2006US20060065625 Periodic patterns and technique to control misalignment between two layers
03/30/2006US20060065624 Irradiating the photoresist layer through a mask to generate a photoacid in the resist, heating to evaporate water from the resist; heating to deprotects the resist; immersion lithography for lowering the water variation in a resist
03/30/2006US20060065623 Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage
03/30/2006US20060065622 Method and system for xenon fluoride etching with enhanced efficiency
03/30/2006US20060065537 Electrolytic copper plating solutions
03/30/2006US20060065372 Bonding apparatus
03/30/2006US20060065368 Gas delivery device for improved deposition of dielectric material
03/30/2006US20060065367 Plasma processing system for treating a substrate
03/30/2006US20060065366 Portable etch chamber
03/30/2006US20060065294 Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products
03/30/2006US20060065262 Group encapsulated dicing chuck
03/30/2006US20060065196 Susceptor
03/30/2006US20060065195 Microwave plasma generating device
03/30/2006US20060065194 Diffuser and semiconductor device manufacturing equipment having the same
03/30/2006US20060065186 Process for producing crystalline thin film
03/30/2006US20060065185 Crystallization apparatus, crystallization method, and phase shifter
03/30/2006DE4417819B4 Verfahren zur Herstellung von CMOS-Transistoren A process for fabricating CMOS transistors
03/30/2006DE19956565B4 Verfahren zum Herstellen einer Wärmesenke für elektrische Bauelemente A method for manufacturing a heat sink for electrical components
03/30/2006DE19704351B4 Leiterrahmen und Montagevorbereitungsverfahren für einen Leiterrahmen Ladder frame and mounting method for preparing a lead frame
03/30/2006DE19704149B4 Verfahren zum Herstellen einer Metallverdrahtung an einem Halbleiterbauteil sowie nach diesem Verfahren hergestellte Metallverdrahtung A method of manufacturing a metal wiring of a semiconductor component produced by this process as well as metal wiring
03/30/2006DE19649447B4 Vinyl-4-t-butoxycarbonyloxybenzal-vinylalkohol-vinylacetat-Copolymer, Vinyl-4-t-butoxycarbonyloxybenzal-vinyl-4- hydroxybenzal-vinylalkohol-vinylacetat und deren Herstellungsverfahren Vinyl 4-t-butoxycarbonyloxybenzal-vinyl alcohol-vinyl acetate copolymer, vinyl 4-t-butoxycarbonyloxybenzal-vinyl-4-hydroxybenzal-vinyl alcohol-vinyl acetate and their method of preparation
03/30/2006DE19619921B4 Verfahren zum Herstellen einer Halbleitervorrichtung mit Funktionselement und Schutzkappe A method of manufacturing a semiconductor device having a functional element and cap
03/30/2006DE19539340B4 Elektronische Eingangs- oder Ausgangspuffer-Schaltung mit MOS-Transistor mit mehreren schleifenförmigen Zellen Electronic input or output buffer circuit with MOS transistor with multiple loop-shaped cells
03/30/2006DE112004000768T5 Verfahren und Vorrichtung zum Trennen eines plattenartigen Elements Method and apparatus for separating a plate-like member
03/30/2006DE112004000495T5 Superjunction-Bauelement und diesbezügliche Herstellungsmethode Superjunction device and related method of manufacture
03/30/2006DE112004000383T5 Galliumnitrid-Einkristallsubstrat und Verfahren zur Herstellung desselben Of the same gallium nitride single crystal substrate and method for producing
03/30/2006DE10394171T5 Verkappen von integrierten Schaltkreisen Capping of integrated circuits
03/30/2006DE10313517B4 Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens Solution for etching copper, method for pretreating a layer of copper as well as application of the method
03/30/2006DE102005046188A1 Mask for irradiating with electron beams in a lithographic process for producing semiconductor components has opening sections for correcting a proximity effect
03/30/2006DE102005045697A1 Semiconductor memory has pad power lines arranged below lower pads in direction crossing pad structures to interconnect pad structures transmitting same level of electrical power
03/30/2006DE102005045661A1 Mikroelektronischer Bauelementchip und Herstellungsverfahren, Packung und LCD-Vorrichtung Microelectronic component chip and manufacturing process, pack and LCD device
03/30/2006DE102005043550A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
03/30/2006DE102005010926A1 Deckel für optoelektronische Wafermaßstabsgehäuse Cover for optoelectronic wafer-scale housing
03/30/2006DE102004060446A1 Verfahren zum Bilden einer Gate-Elektrode in einem nicht volatilen Speicherbauelement A method of forming a gate electrode in a non-volatile memory device
03/30/2006DE102004056497A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
03/30/2006DE102004047313B3 Halbleiteranordnung mit einem Tunnelkontakt und Verfahren zu deren Herstellung A semiconductor device with a tunnel junction, and processes for their preparation
03/30/2006DE102004045447A1 Mobile electrostatic substrate holder used in making thin electronic chips, includes ring seal and nearby drainage channels to remove any fluid ingress to drain
03/30/2006DE102004044619A1 Kondensatorstruktur in Grabenstrukturen von Halbleiterbauteilen und Halbleiterbauteile mit derartigen Kondensatorstrukturen und Verfahren zur Herstellung derselben Capacitor structure in grave structures of semiconductor components and semiconductor devices having such a capacitor structures and methods of manufacturing the same
03/30/2006DE102004044083A1 Verfahren zur Strukturierung eines Substrats und Vorrichtung hierzu A process for patterning a substrate and device for this purpose
03/30/2006DE102004043857B3 DRAM-Zellenpaar und DRAM-Speicherzellenfeld mit Stack- und Trench-Speicherzellen sowie Verfahren zur Herstellung eines DRAM-Speicherzellenfeldes DRAM cell pair and DRAM memory cell array with a stack and trench memory cells and method of manufacturing a DRAM memory cell array
03/30/2006DE102004043856A1 Verfahren zur Herstellung einer Speicherzellenanordnung und Speicherzellenanordnung A method for fabricating a memory cell array and memory cell arrangement
03/30/2006DE102004041961B3 Integrierte Halbleiterschaltung mit integrierter Kapazität zwischen Kontaktanscluss und Substrat und Verfahren zu ihrer Herstellung A semiconductor integrated circuit with an integrated capacitance between Kontaktanscluss and substrate and methods for their preparation
03/30/2006DE102004040046A1 Herstellungsverfahren für einen Grabenkondensator mit einem Isolationskragen, der über einen vergrabenen Kontakt einseitig mit einem Substrat elektrisch verbunden ist, insbesondere für eine Halbleiterspeicherzelle und entsprechender Grabenkondensator Manufacturing method for a grave capacitor with an insulation collar, which is electrically connected through a buried contact on one side with a substrate, in particular for a semiconductor memory cell and corresponding capacitor grave
03/30/2006DE10118409B4 Verfahren zur Strukturierung eines Resists Method for structuring a resist
03/30/2006DE10066053B4 Halbleiterbauelement mit erhöhter Durchbruchspannung A semiconductor device with an increased breakdown voltage
03/29/2006EP1641051A2 Growth of III-nitride light-emitting devices on textured substrates
03/29/2006EP1641046A2 MOSFET and method for fabricating the same
03/29/2006EP1641045A2 Grounded gate and isolation techniques for reducing dark current in CMOS image sensors
03/29/2006EP1641042A2 Integrated Bicmos semiconductor circuit
03/29/2006EP1641040A2 Thermally conductive sheet and method for producing the same
03/29/2006EP1641039A1 Semiconductor device manufacturing method
03/29/2006EP1641038A1 Method for chip singulation
03/29/2006EP1641037A1 Method and device to hold and transport workpieces having flat surfaces
03/29/2006EP1641036A1 Joining method and joining device
03/29/2006EP1641035A1 Mounting method of electronic power components on printed circuit boards
03/29/2006EP1641034A2 Pattern film repair using a gas assisted focused particle beam system
03/29/2006EP1641033A2 Dielectric films from organhydridosiloxane resins
03/29/2006EP1641032A1 Substrate processing method and substrate processing device
03/29/2006EP1641031A2 Deposition of TiN films in a batch reactor
03/29/2006EP1641030A2 Method of manufacturing semiconductor device
03/29/2006EP1641029A1 Process for manufacturing a Schottky contact on a semiconductor substrate
03/29/2006EP1641027A2 Portable etch chamber
03/29/2006EP1641026A2 Method and system for xenon fluoride etching with enhanced efficiency
03/29/2006EP1641025A2 Film sticking method and film sticking device
03/29/2006EP1641020A2 Corrector for the correction of first-order colour aberrations, first grade
03/29/2006EP1640806A2 Composition for stripping photoresist and method for manufacturing thin film transistor array panel using the same
03/29/2006EP1640712A1 Time resolution measurement device and position detection electron multiplier