Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2006
04/18/2006US7029747 nonporous uniform transparent polymer elastic support layer and a semitransparent polishing layer that has a higher hardness than the support layer; both made of compatible materials so that a structural border between the layers does not exist; open pores defined by the embedded liquid microelements
04/18/2006US7029727 thin film transistor; molybdenum nitride film and a reflective pixel electrode film laminated on a photosensitive resin having contact holes and smooth concave and convex portions on an upper surface; high product yield and reliability and improved adhesion
04/18/2006US7029723 Forming chemical vapor depositable low dielectric constant layers
04/18/2006US7029644 Method for producing a polycrystalline silicon, polycrystalline silicon and solar cell
04/18/2006US7029605 Borazine skeletal molecules in an inorganic or organic material molecule
04/18/2006US7029596 Computer integrated manufacturing control system for oxide chemical mechanical polishing
04/18/2006US7029595 Selective etch for uniform metal trace exposure and milling using focused ion beam system
04/18/2006US7029594 Plasma processing method
04/18/2006US7029593 Method for controlling CD during an etch process
04/18/2006US7029591 Planarization with reduced dishing
04/18/2006US7029567 Electrochemical edge and bevel cleaning process and system
04/18/2006US7029550 Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
04/18/2006US7029548 Method for cutting a block of material and forming a thin film
04/18/2006US7029539 Angular spin, rinse, and dry module and methods for making and implementing the same
04/18/2006US7029538 Single wafer type substrate cleaning method and apparatus
04/18/2006US7029536 Processing system and method for treating a substrate
04/18/2006US7029529 Method and apparatus for metallization of large area substrates
04/18/2006US7029509 Performance; efficiency
04/18/2006US7029508 Catalyst attached to solid and used to promote free radical formation in CMP formulations
04/18/2006US7029507 Polishing using multi-metal oxide nanopowders
04/18/2006US7029505 Sheet type heat treating apparatus and method for processing semiconductors
04/18/2006US7029383 Polishing head of chemical mechanical polishing apparatus
04/18/2006US7029382 Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
04/18/2006US7029381 Apparatus and method for chemical mechanical polishing of substrates
04/18/2006US7029380 Double-side polishing method and apparatus
04/18/2006US7029379 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
04/18/2006US7029374 Method for cleaning semiconductor wafers
04/18/2006US7029373 Chemical mechanical polishing compositions for metal and associated materials and method of using same
04/18/2006US7029372 Method of forming an electrode equipped in an apparatus for manufacturing an array substrate of a liquid crystal display device
04/18/2006US7029368 Apparatus for controlling wafer temperature in chemical mechanical polishing
04/18/2006US7029365 Pad assembly for electrochemical mechanical processing
04/18/2006US7029257 Apparatus and method for molding simultaneously a plurality of semiconductor devices
04/18/2006US7029256 Leadframe and method for removing cleaning compound flash from mold vents
04/18/2006US7029224 Method and apparatus for transferring a thin plate
04/18/2006US7029013 Seal member, and substrate storage container using the same
04/18/2006US7028879 System for depositing connection sites on micro C-4 semiconductor die
04/18/2006US7028698 Pressure processing apparatus with improved heating and closure system
04/18/2006US7028565 Method and arrangement for transporting and inspecting semiconductor substrates
04/18/2006US7028550 Implantable pressure sensors
04/18/2006US7028433 Aseismatic device
04/18/2006US7028399 Electrically interconnecting each metal wiring interconnects with one another such that each is electrically short-circuited relative to one another; reinforcing conductor starting layer by electrodepositing and separating interconnections between each metal wiring interconnects to avoid short-circuiting
04/18/2006US7028398 Contactor, a method of manufacturing the contactor and a device and method of testing electronic component using the contactor
04/18/2006US7028397 Method of attaching a semiconductor chip to a chip mounting substrate
04/18/2006US7028396 Semiconductor chip pick and place process and equipment
04/18/2006CA2431064C System and method for electrically induced breakdown of nanostructures
04/18/2006CA2245511C Ultrasonic sputtering target testing method
04/13/2006WO2006039715A1 Semiconductor devices having bonded interfaces and methods for making the same
04/13/2006WO2006039677A2 Semiconductor doping using substrate tilting
04/13/2006WO2006039641A2 Improving short channel effect of mos devices by retrograde well engineering using tilted dopant implantation into recessed source/drain regions
04/13/2006WO2006039633A2 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
04/13/2006WO2006039632A2 Gate stacks
04/13/2006WO2006039600A1 Independently accessed double-gate and tri-gate transistors in same process flow
04/13/2006WO2006039597A2 Metal gate transistors with epitaxial source and drain regions
04/13/2006WO2006039438A2 Split thin film capacitor for multiple voltages
04/13/2006WO2006039436A2 Pad design for electrochemical mechanical polishing
04/13/2006WO2006039321A1 Method and system for injecting chemistry into a supercritical fluid
04/13/2006WO2006039293A2 Localized control of thermal properties on microdevices and applications thereof
04/13/2006WO2006039209A1 Low-voltage memory having flexible gate charging element
04/13/2006WO2006039038A2 Method for forming a semiconductor device having a strained channel and a heterojunction source/drain
04/13/2006WO2006039028A1 Plasma enhanced nitride layer
04/13/2006WO2006039026A1 A method for supercritical carbon dioxide processing of fluoro-carbon films
04/13/2006WO2006038990A2 Method for treating a substrate
04/13/2006WO2006038976A2 Plasma processing system for treating a substrate
04/13/2006WO2006038974A2 A method and system for forming a feature in a high-k layer
04/13/2006WO2006038914A2 Laser-induced fabrication of metallic interlayers and patterns in polyimide films
04/13/2006WO2006038713A1 Production method for semiconductor device
04/13/2006WO2006038699A1 Method for dividing semiconductor wafer and manufacturing method for semiconductor devices
04/13/2006WO2006038672A1 Microwave plasma processing apparatus
04/13/2006WO2006038659A1 Substrate treating apparatus and semiconductor device manufacturing method
04/13/2006WO2006038644A1 High withstand voltage semiconductor device covered with resin and process for producing the same
04/13/2006WO2006038635A1 Positive resist composition and method of forming resist pattern
04/13/2006WO2006038623A1 Plasma film forming method and plasma film forming device
04/13/2006WO2006038610A1 Electronic component pickup method, electronic component mounting method and electronic component mounting apparatus
04/13/2006WO2006038609A1 Electronic component pickup method, electronic component mounting method and electronic component mounting apparatus
04/13/2006WO2006038584A1 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
04/13/2006WO2006038567A1 METHOD FOR PRODUCING P-TYPE Ga2O3 FILM AND METHOD FOR PRODUCING PN JUNCTION-TYPE Ga2O3 FILM
04/13/2006WO2006038566A1 Semiconductor storage device and method for manufacturing the same
04/13/2006WO2006038563A1 Linear motor, stage apparatus and exposure apparatus
04/13/2006WO2006038541A1 Container for conveying substrate, inner wall structure of the container, and bottom raising member used for the container
04/13/2006WO2006038477A1 Polymer compound, positive resist composition and method for forming resist pattern
04/13/2006WO2006038472A1 Substrate treatment apparatus and substrate treatment method
04/13/2006WO2006038387A1 Polymer, positive resist composition, and method of forming resist pattern
04/13/2006WO2006038385A1 Adhesive film tape storing cassette replacing device, adhesive film tape storing cassette and adhesive film adhering device
04/13/2006WO2006038384A1 Adhesive film adhering device and adhesive film tape feeding mechanism
04/13/2006WO2006038164A1 Semiconductor device having substrate comprising layer with different thicknesses and method of manufacturing the same
04/13/2006WO2006038152A1 Method for laser dicing of a substrate
04/13/2006WO2006038030A2 Equipment for wafer bonding
04/13/2006WO2006037933A2 Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized
04/13/2006WO2006037927A1 Gate structure and method for making same
04/13/2006WO2006037844A2 Cvd doped structures
04/13/2006WO2006037783A1 Method for transferring a thin film comprising a controlled disturbance of a crystal structure
04/13/2006WO2006037584A1 Electropolishing electrolyte and method for planarizing a metal layer using the same
04/13/2006WO2006037526A2 Lateral dmos-transistor and method for the production thereof
04/13/2006WO2006037317A2 Two-step oxidation process for semiconductor wafers
04/13/2006WO2006028705A3 Mask material conversion
04/13/2006WO2006023437A3 Sioc:h coated substrates and methods for their preparation
04/13/2006WO2006020828A3 Top electrode for a dram capacitor
04/13/2006WO2006017016A3 Devices and methods of making the same
04/13/2006WO2006009613A3 Sti formation in semiconductor device including soi and bulk silicon regions
04/13/2006WO2006008337A8 Pressure testing apparatus and method for pressure testing