| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/06/2006 | US20060070885 Chip interconnect and packaging deposition methods and structures |
| 04/06/2006 | US20060070702 Substrate processing system for performing exposure process in gas atmosphere |
| 04/06/2006 | US20060070639 Fluid delivery ring and methods for making and implementing the same |
| 04/06/2006 | US20060070522 Desublimator for aluminum chloride |
| 04/06/2006 | US20060070494 Reoxidization of reduced fine particles is suppressed; reduced fine particles (FeO fine particles) are formed by embedding metal oxide fine particles (Fe2O3 fine particles) fixed on a p type silicon semiconductor substrate into a silicon oxidized film, and carrying out a heat treatment in a reducing gas |
| 04/06/2006 | US20060070444 Semiconductor acceleration sensor and manufacturing method thereof |
| 04/06/2006 | US20060070441 Micro-electro-mechanical structure having electrically insulated regions and manufacturing process thereof |
| 04/06/2006 | DE4230648B4 Ladungsverschiebeelement und Verfahren zu dessen Herstellung Charge transfer element and process for its preparation |
| 04/06/2006 | DE4026121B4 Leitfähigkeitsmodulations-MOSFET A conductivity modulation type MOSFET |
| 04/06/2006 | DE19964099B4 Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme A process for producing three-dimensionally arranged leading and connecting structures for volume and energy flows |
| 04/06/2006 | DE19505947B4 Halbleitervorrichtung mit verbesserter Barrierenmetallschicht in einer Elektrode oder Verdrahtungsschicht A semiconductor device with improved barrier metal layer in an electrode or wiring layer |
| 04/06/2006 | DE112004000699T5 Verfahren zur Herstellung einer Metallgatestruktur durch Abgleichen einer Austrittsarbeitsfunktion durch Siliziumeinbau A method of manufacturing a metal gate structure by adjusting a work function by silicon installation |
| 04/06/2006 | DE102005046480A1 Vertical MOS transistor manufacturing method for switching converter, involves structuring auxiliary layer to form trench having side walls and extending to substrate, and fabricating insulated gate electrode on walls and substrate |
| 04/06/2006 | DE102005046426A1 MRAM und Verfahren zu dessen Herstellung MRAM and methods for its preparation |
| 04/06/2006 | DE102005046425A1 Array resistiver Speicherzellen und Verfahren zum Erfassen von Widerstandswerten solcher Zellen Array of resistive memory cells and method for detecting resistance values of such cells |
| 04/06/2006 | DE102005043913A1 Fabrication of doped semiconductor zone in semiconductor body for forming emitter or contact of vertical power semiconductor component, comprises introducing dopant particles to side of semiconductor body, irradiation and thermal treatment |
| 04/06/2006 | DE102005005229A1 Electronic component e.g. CMOS-transistor, producing process, involves isolating dielectric layer from another layer on basis of oxide-containing material and etching former layer with etching solution from aqueous sulfuric acid |
| 04/06/2006 | DE102004063690A1 Non-volatile memory device e.g. flash memory for mobile communication system and memory card for storing music, comprises pair of conductive sidewall spacers for trapping/detrapping charges formed, on pair of sidewall spacers |
| 04/06/2006 | DE102004060669A1 Formation of wall oxide films in flash memory device by performing oxidation process in gas atmosphere comprising hydrogen and oxygen in in-situ steam generation oxidation mode |
| 04/06/2006 | DE102004050476B3 Making wiring circuit panel, employs structured masking layers to define through-contact locations, with selective use of protective layers when depositing conductor structures |
| 04/06/2006 | DE102004049246A1 Lateraler DMOS-Transistor und Verfahren zu seiner Herstellung A lateral DMOS transistor and method for its preparation |
| 04/06/2006 | DE102004048332A1 Verfahren zur Herstellung einer Halbleiteranordnung, Halbleiteranordnung und Hochfrequenzschaltung A process for producing a semiconductor device, semiconductor device and high-frequency circuit |
| 04/06/2006 | DE102004048202A1 Verfahren zur Vereinzelung von oberflächenmontierbaren Halbleiterbauteilen und zur Bestückung derselben mit Außenkontakten A process for the separation of surface mount semiconductor devices, and for fitting the same to external contacts |
| 04/06/2006 | DE102004047730A1 Ein Verfahren zum Dünnen von Halbleitersubstraten zur Herstellung von dünnen Halbleiterplättchen A process for thinning of semiconductor substrates for the production of thin semiconductor wafers |
| 04/06/2006 | DE102004047631A1 Verfahren zum Ausbilden eines Feldeffekttransistors mit einem verspannten Kanalgebiet A method of forming a field effect transistor with a strained channel region |
| 04/06/2006 | DE102004047522B3 Halbleiterchip mit einer Metallbeschichtungsstruktur und Verfahren zur Herstellung desselben The same semiconductor chip with a metal coating structure and methods for preparing |
| 04/06/2006 | DE102004047357A1 Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung Electrical arrangement and method for manufacturing an electrical assembly |
| 04/06/2006 | DE102004047305A1 Dielectric production for condenser of memory cell in ferroelectric RAM, involves depositing growing up lead zirconium titanium trioxide-layer of nucleation layer, where base area of nucleation layer has specific length and breath |
| 04/06/2006 | DE102004046697A1 Hochspannungsfestes Halbleiterbauelement mit vertikal leitenden Halbleiterkörperbereichen und einer Grabenstruktur sowie Verfahren zur Herstellung desselben Of the same high-voltage resistant semiconductor device having vertical type semiconductor areas of the body and a grave structure and methods for preparing |
| 04/06/2006 | DE102004046483A1 Laminated structure production for capacitor, involves fabricating two layers from same metallic conductive layer on dielectric layer, and converting material of one layer into dielectric material by chemical reaction of gaseous phase |
| 04/06/2006 | DE102004045956A1 Etching holder for use in etching system, has fixing unit that is adjustable, so that substrate is inserted into holder to form etching medium free area, and integrated radiation guidance beginning/ending at upper surface that limits area |
| 04/06/2006 | DE102004045768A1 Semiconductor device`s e.g. diode, edge structure producing method, involves producing phosphorus zone in edge region of semiconductor body, and etching body in edge region to produce structure, where zone produces phosphorous concentration |
| 04/06/2006 | DE102004045575A1 Ultraschalltransducer mit einem in der Lagerung angeordneten Sensor Ultrasonic transducer with a sensor disposed in the storage |
| 04/06/2006 | DE102004021633B4 Verfahren zum Verbinden eines Halbleiterchips mit einem Chipträger und Anordnung mit einem Halbleiterchip und einem Chipträger A method of connecting a semiconductor chip with a chip carrier assembly and having a semiconductor chip and a chip carrier |
| 04/06/2006 | DE10197037B4 Anordnung und Verfahren zum Anbringen eines Trägerfilms an einem Polierkopf Arrangement and method for attaching a carrier film to a polishing head |
| 04/06/2006 | DE10145686B4 Vorrichtung zum berührungslosen Fördern eines Gegenstandes aus Glas oder Glaskeramik A device for the contactless conveyance of an article of glass or glass ceramic |
| 04/06/2006 | DE10138659B4 Verfahren zur Herstellung einer Anordnung aus einem Halbleiterchip und einer damit verbundenen Leiterbahnstruktur A process for preparing an assembly of a semiconductor chip and an associated conductor track structure |
| 04/06/2006 | DE10104267B4 Elektronisches Bauteil mit mindestens einer Isolationslage Electronic component with at least one layer of insulation |
| 04/06/2006 | DE10030696B4 Integrierte Schaltungsanordnung mit zumindest einem vergrabenen Schaltungselement und einer Isolationsschicht sowie Verfahren zu deren Herstellung Integrated circuit arrangement with at least one circuit element and a buried insulating layer as well as processes for their preparation |
| 04/06/2006 | CA2581670A1 Controlling electromechanical behavior of structures within a microelectromechanical systems device |
| 04/06/2006 | CA2581626A1 Method and apparatus for growing a group (iii) metal nitride film and a group (iii) metal nitride film |
| 04/05/2006 | EP1643817A1 Etching solution, method of etching and printed wiring board |
| 04/05/2006 | EP1643566A1 Process for producing light-emitting diode element emitting white light |
| 04/05/2006 | EP1643560A1 Semiconductor device and method for manufacturing same |
| 04/05/2006 | EP1643559A2 MOS-gated semiconductor device with top drain |
| 04/05/2006 | EP1643558A1 Vertical power semiconductor device and method of making the same |
| 04/05/2006 | EP1643555A2 Ferroelectric capacitor and its manufacturing method, and ferroelectric memory device |
| 04/05/2006 | EP1643549A1 Method for producing vertical bipolar transistors and integrated circuit with vertical bipolar transistors |
| 04/05/2006 | EP1643548A2 Method of detecting un-annealed ion implants |
| 04/05/2006 | EP1643547A1 Preparation of group 12 and 13 metal compounds having low levels of oxygenated impurities |
| 04/05/2006 | EP1643546A2 Method for manufacturing a nanostructure |
| 04/05/2006 | EP1643545A1 Method of processing silicon wafer |
| 04/05/2006 | EP1643544A1 Method for producing silicon epitaxial wafer and silicon epitaxial wafer |
| 04/05/2006 | EP1643541A2 Apparatus and method for processing a substrate |
| 04/05/2006 | EP1643306A1 Resist composition, multilayer body, and method for forming resist pattern |
| 04/05/2006 | EP1643301A1 Partition-wall structure for forming a conductive pattern by ink jet printing |
| 04/05/2006 | EP1643300A1 Barrier structure for forming a conductive pattern by ink jet printing |
| 04/05/2006 | EP1643298A1 Method of manufacturing a liquid crystal display and a mask for use in same |
| 04/05/2006 | EP1643257A1 Scan test design method, scan test circuit, scan test circuit insertion cad program, large-scale integrated circuit, and mobile digital device |
| 04/05/2006 | EP1643232A1 Thin piece specimen preparing method and composite charged particle beam device |
| 04/05/2006 | EP1643004A1 Treating device using raw material gas and reactive gas |
| 04/05/2006 | EP1643000A1 Seed layer processes for MOCVD of ferroelectric thin films on high-K gate oxides |
| 04/05/2006 | EP1642949A1 Polishing composition and method of polishing with the same |
| 04/05/2006 | EP1642876A1 Aluminum nitride conjugate body and method of producing the same |
| 04/05/2006 | EP1642679A1 Polishing apparatus |
| 04/05/2006 | EP1642344A1 Back-contacted solar cells with integral conductive vias and method of making |
| 04/05/2006 | EP1642339A1 Semiconductor device |
| 04/05/2006 | EP1642336A1 Method for interconnecting active and passive components, and a resulting thin heterogeneous component |
| 04/05/2006 | EP1642335A1 Integrated coolant circuit arrangement, operating method and production method |
| 04/05/2006 | EP1642332A1 Die bonding |
| 04/05/2006 | EP1642331A1 Integrated circuit arrangement with low-resistance contacts and method for production thereof |
| 04/05/2006 | EP1642330A1 Planar magnetic tunnel junction substrate having recessed alignment marks |
| 04/05/2006 | EP1642329A1 Process for producing low-k dielectric films |
| 04/05/2006 | EP1642327A2 METHOD FOR GROWING SINGLE CRYSTAL GaN ON SILICON |
| 04/05/2006 | EP1642326A2 Method for efficiently producing removable peripheral cards |
| 04/05/2006 | EP1642325A2 Method and system for high volume transfer of dies to substrates |
| 04/05/2006 | EP1642323A2 Wafer inspection device |
| 04/05/2006 | EP1642174A2 Exposure method and apparatus, exposure mask, and device manufacturing method |
| 04/05/2006 | EP1642171A1 Exposure mask, method of designing and manufacturing the same, exposure method and apparatus, pattern forming method, and device manufacturing method |
| 04/05/2006 | EP1642162A2 Micromirrors with mechanisms for enhancing coupling of the micromirrors with electrostatic fields |
| 04/05/2006 | EP1641958A2 Methods of forming a phosphorus doped silicon dioxide layer |
| 04/05/2006 | EP1641957A2 Composite refractory metal carbide coating on a substrate and method for making thereof |
| 04/05/2006 | EP1641908A1 Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate |
| 04/05/2006 | EP1641710A2 Micromechanical apparatus and method of forming a micromechanical device layer |
| 04/05/2006 | EP1641597A1 Substrate polishing apparatus |
| 04/05/2006 | EP1641558A2 Method and apparatus for increasing bulk conductivity of a ferroelectric material |
| 04/05/2006 | EP1522090A4 Thermal processing system and configurable vertical chamber |
| 04/05/2006 | EP1502288A4 Lithography laser with beam delivery and beam pointing control |
| 04/05/2006 | EP1465636A4 Compositions and methods for enhancing corticosteriod delivery |
| 04/05/2006 | EP1410436A4 Parallel, individually addressable probes for nanolithography |
| 04/05/2006 | EP1397835B1 Method of controlling the crystal orientation of a composite structure |
| 04/05/2006 | EP1392093B1 Method for manufacturing ceramic multilayered board |
| 04/05/2006 | EP1342259A4 Semiconductor wafer processing to increase the usable planar surface area |
| 04/05/2006 | EP1218688B1 Method and apparatus for three dimensional inspection of electronic components |
| 04/05/2006 | EP0935816B1 Method of manufacturing a semiconductor device with a schottky junction |
| 04/05/2006 | EP0896734B1 All-metal, giant magnetoresistive, solid-state component |
| 04/05/2006 | CN2770286Y Halogen lamp assembly with integrated radiator |
| 04/05/2006 | CN2770096Y Semiconductor substrate structure |
| 04/05/2006 | CN2770088Y Silicon germanium/silicon three-dimensional integrated circuit active layer |
| 04/05/2006 | CN2770087Y Device with gas adsorbing function |