Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2006
04/18/2006US7030013 Method for fabricating semiconductor device using high dielectric material
04/18/2006US7030012 Method for manufacturing tungsten/polysilicon word line structure in vertical DRAM
04/18/2006US7030011 Method for avoiding short-circuit of conductive wires
04/18/2006US7030010 Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures
04/18/2006US7030009 Method for forming metal interconnect in a carbon containing silicon oxide film
04/18/2006US7030008 Techniques for patterning features in semiconductor devices
04/18/2006US7030007 Via-filling material and process for fabricating semiconductor integrated circuit using the material
04/18/2006US7030006 Method for forming contact hole and spacer of semiconductor device
04/18/2006US7030005 Method of manufacturing semiconductor device
04/18/2006US7030004 Method for forming bond pad openings
04/18/2006US7030003 Compound semiconductor device, production method thereof, light-emitting device and transistor
04/18/2006US7030002 Low temperature anneal to reduce defects in hydrogen-implanted, relaxed SiGe layer
04/18/2006US7030001 Method for forming a gate electrode having a metal
04/18/2006US7030000 Method for fabricating a metallic oxide of high dielectric constant, metallic oxide of high dielectric constant, gate insulating film and semiconductor element
04/18/2006US7029999 Method for fabricating transistor with polymetal gate electrode
04/18/2006US7029998 Formation method of gate electrode in a semiconductor process
04/18/2006US7029997 Method of doping sidewall of isolation trench
04/18/2006US7029996 Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidification
04/18/2006US7029995 Methods for depositing amorphous materials and using them as templates for epitaxial films by solid phase epitaxy
04/18/2006US7029994 Strained channel on insulator device
04/18/2006US7029993 Method for treating substrates for microelectronics and substrates obtained according to said method
04/18/2006US7029992 Low oxygen content photoresist stripping process for low dielectric constant materials
04/18/2006US7029991 Method for making a SOI semiconductor substrate with thin active semiconductor layer
04/18/2006US7029990 Method of assembling elements by localized heating
04/18/2006US7029989 Semiconductor device and method of manufacturing the same
04/18/2006US7029988 Fabrication method and device structure of shallow trench insulation for silicon wafer containing silicon-germanium
04/18/2006US7029987 Method of manufacturing semiconductor device having shallow trench isolation (STI)
04/18/2006US7029986 Bonded products and methods of fabrication therefor
04/18/2006US7029985 Method of forming MIS capacitor
04/18/2006US7029984 Method for fabricating semiconductor device
04/18/2006US7029983 Methods of forming MIM type capacitors by forming upper and lower electrode layers in a recess that exposes a source/drain region of a transistor and MIM capacitors so formed
04/18/2006US7029982 Method of affecting RRAM characteristics by doping PCMO thin films
04/18/2006US7029981 Radiation hardened bipolar junction transistor
04/18/2006US7029980 Method of manufacturing SOI template layer
04/18/2006US7029979 Methods for manufacturing semiconductor devices
04/18/2006US7029978 Controlling the location of conduction breakdown in phase change memories
04/18/2006US7029977 Fabrication method of semiconductor wafer
04/18/2006US7029976 Method for SONOS EFLASH integrated circuit
04/18/2006US7029975 Method and apparatus for eliminating word line bending by source side implantation
04/18/2006US7029974 Split gate type nonvolatile semiconductor memory device, and method of fabricating the same
04/18/2006US7029973 Method of fabricating a flash memory cell
04/18/2006US7029972 Method of manufacturing a metal-insulator-metal capacitor
04/18/2006US7029971 Thin film dielectrics for capacitors and methods of making thereof
04/18/2006US7029970 Method for fabricating semiconductor device
04/18/2006US7029969 Method of manufacture of a silicon carbide MOSFET including a masking with a tapered shape and implanting ions at an angle
04/18/2006US7029968 Method of forming a PIP capacitor
04/18/2006US7029967 Silicide method for CMOS integrated circuits
04/18/2006US7029966 Process options of forming silicided metal gates for advanced CMOS devices
04/18/2006US7029965 Semiconductor device and manufacturing method thereof
04/18/2006US7029964 Method of manufacturing a strained silicon on a SiGe on SOI substrate
04/18/2006US7029963 Semiconductor damascene trench and methods thereof
04/18/2006US7029962 Methods for forming a high performance capacitor
04/18/2006US7029961 Method for optimized laser annealing smoothing
04/18/2006US7029960 Device manufacturing method
04/18/2006US7029959 Source and drain protection and stringer-free gate formation in semiconductor devices
04/18/2006US7029958 Self aligned damascene gate
04/18/2006US7029957 Method of manufacturing semiconductor device having thin film SOI structure
04/18/2006US7029956 Memory system capable of operating at high temperatures and method for fabricating the same
04/18/2006US7029955 Optically and electrically programmable silicided polysilicon fuse device
04/18/2006US7029954 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
04/18/2006US7029953 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device
04/18/2006US7029952 Method for making a semiconductor package and semiconductor package with integrated circuit chips
04/18/2006US7029951 Cooling system for a semiconductor device and method of fabricating same
04/18/2006US7029950 Thin-film semiconductor device and method of manufacturing the same
04/18/2006US7029949 Method for fabricating encapsulated semiconductor components having conductive vias
04/18/2006US7029948 Semiconductor wafer overcoated with dielectrics; multuilater; spherical electrode; encapsulation
04/18/2006US7029947 Flip chip in leaded molded package with two dies
04/18/2006US7029946 Method for manufacturing semiconductor device and semiconductor device
04/18/2006US7029945 Organic field effect transistor with an organic dielectric
04/18/2006US7029944 Methods of forming a microlens array over a substrate employing a CMP stop
04/18/2006US7029943 Photovoltaic component and module
04/18/2006US7029942 Method for fabricating complementary metal oxide semiconductor image sensor
04/18/2006US7029941 Magnetic random access memory designs with controlled magnetic switching mechanism
04/18/2006US7029940 Ammonia for use in manufacture of GaN-type compound semiconductor and method for manufacturing GaN-type compound semiconductor
04/18/2006US7029939 P-type semiconductor manufacturing method and semiconductor device
04/18/2006US7029938 Method for forming patterns on a semiconductor device using a lift off technique
04/18/2006US7029937 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
04/18/2006US7029936 Semiconductor laser, device having reduced contact resistance and manufacturing method thereof
04/18/2006US7029935 Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
04/18/2006US7029934 Method and apparatus for testing TFT array
04/18/2006US7029933 Method for monitoring ion implant doses
04/18/2006US7029932 Circuit and method for measuring contact resistance
04/18/2006US7029931 Stacked die module and techniques for forming a stacked die module
04/18/2006US7029930 Device and system for recording the motion of a wafer and a method therefrom
04/18/2006US7029929 Method of manufacturing semiconductor devices using a bond program verification system
04/18/2006US7029927 Method of repairing an integrated electronic circuit using a formed electrical isolation
04/18/2006US7029926 Double density MRAM with planar processing
04/18/2006US7029925 FeRAM capacitor stack etch
04/18/2006US7029924 Buffered-layer memory cell
04/18/2006US7029923 Method for manufacture of magneto-resistive bit structure
04/18/2006US7029827 After forming a resist film from a positive chemically amplified resist material, performing insolubilization treatment for making the surface of resist film insoluble in developer, pattern exposing, then developing the film
04/18/2006US7029826 Contacting silica dielectric film with plasma comprising at least one surface modification agent, at a concentration, and for a time period, effective to render the silica dielectric film hydrophobic
04/18/2006US7029822 Photoresists; non-aromatic cyclic olefin (homo or co )polymer
04/18/2006US7029804 Masking for projecting circuit pattern; radiation transparent substrate, dielectric layer; blocking layer over reflective layer; etching pattern; photolithography
04/18/2006US7029803 Lithography; multilayer; substrate, thin films , layer having controlled optical transmission; defect-free
04/18/2006US7029802 Embedded bi-layer structure for attenuated phase shifting mask
04/18/2006US7029801 Method of manufacturing mask for electron beam lithography and mask blank for electron beam lithography
04/18/2006US7029799 Dividing pattern into zones; drawing
04/18/2006US7029779 Overcoating semiconductor wafer; etching channels in wafer; ion exchange resins; barrier dividing channels; supplying hydrogen and oxidizer with catalyst; forming water
04/18/2006US7029753 Multi-layer hard mask structure for etching deep trench in substrate