| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/13/2006 | WO2006004224A9 Plasma treatment method and plasma etching method |
| 04/13/2006 | WO2005119739A3 Electronic component for preventing undesired switching between monitoring modes |
| 04/13/2006 | WO2005117031A3 Method and apparatus for administering passivator to a conductor |
| 04/13/2006 | WO2005115072A3 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 04/13/2006 | WO2005101522A3 Process and device for cleaning and etching a substrate with a transparent conductive oxide layer |
| 04/13/2006 | WO2005101490A3 Component that is situated on a cooling fin |
| 04/13/2006 | WO2005101459A3 Method for machining a workpiece on a workpiece support |
| 04/13/2006 | WO2005093790A3 Method of, and apparatus for manufacturing semiconductor elements |
| 04/13/2006 | WO2005090638A3 Remote chamber methods for removing surface deposits |
| 04/13/2006 | WO2005057664A3 Power mosfet and methods of making same |
| 04/13/2006 | WO2005022622A9 Dry etching process and method for manufacturing magnetic memory device |
| 04/13/2006 | WO2005020297A3 Technique for evaluating a fabrication of a semiconductor component and wafer |
| 04/13/2006 | WO2005006400A3 Substrate support having dynamic temperature control |
| 04/13/2006 | US20060080055 Automatic quality control method for production line and apparatus therefor as well as automatic quality control program |
| 04/13/2006 | US20060079985 Inline connection setting method and device and substrate processing devices and substrate processing system |
| 04/13/2006 | US20060079628 Over-coating agent for forming fine patterns and a method of forming fine patterns using such agent |
| 04/13/2006 | US20060079100 High density plasma grown silicon nitride |
| 04/13/2006 | US20060079099 Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality |
| 04/13/2006 | US20060079098 Method and system for sealing a substrate |
| 04/13/2006 | US20060079097 Method of forming dielectric layer in semiconductor device |
| 04/13/2006 | US20060079096 Substrate processing method and substrate processing apparatus |
| 04/13/2006 | US20060079095 Method of removing a polymer coating from an etched trench |
| 04/13/2006 | US20060079094 Method for microstructuring flat glass substrates |
| 04/13/2006 | US20060079093 Method for fabricating semiconductor device using tungsten as sacrificial hard mask |
| 04/13/2006 | US20060079092 Polishing method |
| 04/13/2006 | US20060079091 Mask, method of producing the same, and method of producing semiconductor device |
| 04/13/2006 | US20060079090 Method for depositing nanolaminate thin films on sensitive surfaces |
| 04/13/2006 | US20060079089 Coated semiconductor wafer, and process and apparatus for producing the semiconductor wafer |
| 04/13/2006 | US20060079088 Methods of forming a contact opening in a semiconductor assembly using a disposable hard mask |
| 04/13/2006 | US20060079087 Method of producing semiconductor device |
| 04/13/2006 | US20060079086 Apparatus and method of forming silicide in a localized manner |
| 04/13/2006 | US20060079085 Method for applying metal features onto metallized layers using electrochemical deposition |
| 04/13/2006 | US20060079084 Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment |
| 04/13/2006 | US20060079083 Method for applying metal features onto metallized layers using electrochemical deposition using acid treatment |
| 04/13/2006 | US20060079082 Trench cut light emitting diodes and methods of fabricating same |
| 04/13/2006 | US20060079081 Method for fabricating electrical connection structure of circuit board |
| 04/13/2006 | US20060079080 Method of providing contact via to a surface |
| 04/13/2006 | US20060079079 Method of manufacturing of thin based substrate |
| 04/13/2006 | US20060079078 Method of producing a semiconductor device having an oxide film |
| 04/13/2006 | US20060079077 Semiconductor device manufacturing method |
| 04/13/2006 | US20060079076 Methods of forming field effect transistors having t-shaped gate electrodes using carbon-based etching masks |
| 04/13/2006 | US20060079075 Gate structures with silicide sidewall barriers and methods of manufacturing the same |
| 04/13/2006 | US20060079074 Method of forming relatively continuous silicide layers for semiconductor devices |
| 04/13/2006 | US20060079073 Fabrication method of nitride semiconductors and nitride semiconductor structure fabricated thereby |
| 04/13/2006 | US20060079072 Method for precision integrated circuit die singulation using differential etch rates |
| 04/13/2006 | US20060079071 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate |
| 04/13/2006 | US20060079070 Substrate for stressed systems and method of making same |
| 04/13/2006 | US20060079069 Silicon wafer laser processing method and laser beam processing machine |
| 04/13/2006 | US20060079068 Narrow width effect improvement with photoresist plug process and STI corner ion implantation |
| 04/13/2006 | US20060079067 Methods for aligning patterns on a substrate based on optical properties of a mask layer and related devices |
| 04/13/2006 | US20060079066 Semiconductor device and method for fabricating the same |
| 04/13/2006 | US20060079065 Capacitor having reaction preventing layer and methods of forming the same |
| 04/13/2006 | US20060079064 Fabrication method for a trench capacitor having an insulation collar which on one side is electrically connected to a substrate via a buried contact, in particular for a semiconductor memory cell, and corresponding trench capacitor |
| 04/13/2006 | US20060079063 Semiconductor device and method for manufacturing the same |
| 04/13/2006 | US20060079062 Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate |
| 04/13/2006 | US20060079061 Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film |
| 04/13/2006 | US20060079060 Semiconductor device having elevated source/drain and method of fabricating the same |
| 04/13/2006 | US20060079059 Transistor having high dielectric constant gate insulating layer and source and drain forming schottky contact with substrate |
| 04/13/2006 | US20060079058 Method for inspecting semiconductor device |
| 04/13/2006 | US20060079057 Field effect transistor and method of fabricating the same |
| 04/13/2006 | US20060079056 Semiconductor structures having a strained silicon layer on a silicon-germanium layer and related fabrication methods |
| 04/13/2006 | US20060079055 Method of forming a split programming virtual ground SONOS memory |
| 04/13/2006 | US20060079054 Non-volatile memory device and methods of forming the same |
| 04/13/2006 | US20060079053 NROM device and method of making same |
| 04/13/2006 | US20060079052 Semiconductor memory device and manufacturing method thereof |
| 04/13/2006 | US20060079051 Method for forming a multi-bit non-volatile memory device |
| 04/13/2006 | US20060079050 Capacitor structure |
| 04/13/2006 | US20060079049 Method for fabricating a capacitor |
| 04/13/2006 | US20060079048 Method of making prestructure for MEMS systems |
| 04/13/2006 | US20060079047 Integration of multiple gate dielectrics by surface protection |
| 04/13/2006 | US20060079046 Method and structure for improving cmos device reliability using combinations of insulating materials |
| 04/13/2006 | US20060079045 Electrically erasable programmable read-only memory (EEPROM) device and methods of fabricating the same |
| 04/13/2006 | US20060079044 Method for fabricating electronic device |
| 04/13/2006 | US20060079043 Method of manufacturing semiconductor integrated circuit device |
| 04/13/2006 | US20060079042 Thin film transistor and manufacturing method thereof |
| 04/13/2006 | US20060079041 Manufacturing method for a semiconductor device |
| 04/13/2006 | US20060079040 Laser processing unit, laser processing method, and method for manufacturing semiconductor device |
| 04/13/2006 | US20060079039 Semiconductor device and manufacturing method thereof |
| 04/13/2006 | US20060079038 Method of fabricating an electronic device |
| 04/13/2006 | US20060079037 Thin-film transistor and methods |
| 04/13/2006 | US20060079036 Method of manufacturing gate, thin film transistor and pixel |
| 04/13/2006 | US20060079035 Method of manufacturing thin film semiconductor device, thin film semiconductor device, electro-optical device, and electronic apparatus |
| 04/13/2006 | US20060079034 Method to form a passivation layer |
| 04/13/2006 | US20060079033 Method for making thin-film semiconductor device |
| 04/13/2006 | US20060079032 Method of manufacturing thin film transistor |
| 04/13/2006 | US20060079031 Semiconductor device and manufacturing method thereof |
| 04/13/2006 | US20060079030 Method of fabricating T-type gate |
| 04/13/2006 | US20060079029 Flexible circuit board processing method |
| 04/13/2006 | US20060079028 Manufacturing method of a semiconductor device |
| 04/13/2006 | US20060079027 Semiconductor device and its manufacturing method |
| 04/13/2006 | US20060079026 Method of the film substrate, a method of the semiconductor device using the same, a method of the display device using the same, and a method of the electric device using the same |
| 04/13/2006 | US20060079025 Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices |
| 04/13/2006 | US20060079024 Methods relating to singulating semiconductor wafers and wafer scale assemblies |
| 04/13/2006 | US20060079023 Semiconductor device and manufacturing method for the same |
| 04/13/2006 | US20060079022 Frame attaching process |
| 04/13/2006 | US20060079021 Method for flip chip package and structure thereof |
| 04/13/2006 | US20060079020 Semiconductor device and a method of assembling a semiconductor device |
| 04/13/2006 | US20060079019 Method for manufacturing wafer level chip scale package using redistribution substrate |
| 04/13/2006 | US20060079018 Method for producing an optical or electronic module provided with a plastic package |
| 04/13/2006 | US20060079017 Method for manufacturing a microlens |