| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/13/2006 | US20060075967 Magnetic-field concentration in inductively coupled plasma reactors |
| 04/13/2006 | US20060075966 Apparatus and method for plasma assisted deposition |
| 04/13/2006 | US20060075960 Method for the preparation of a semiconductor substrate with a non-uniform distribution of stabilized oxygen precipitates |
| 04/13/2006 | US20060075957 Annealed wafer and anneald wafer manufacturing method |
| 04/13/2006 | US20060075688 Polishing composition and method of polishing with the same |
| 04/13/2006 | DE60203032T2 Integrierte Halbleiterschaltung A semiconductor integrated circuit |
| 04/13/2006 | DE4339190B4 Halbleiter-Beschleunigungsmesser Semiconductor accelerometer |
| 04/13/2006 | DE19958144B4 Programmierbare Zwischenverbindungszelle zum wahlweisen Verbinden von Schaltkreisknoten in einem integrierten Schaltkreis und Anordnung programmierbarer Zwischenverbindungszellen Programmable interconnect cell for selectively connecting circuit nodes in an integrated circuit and array of programmable interconnect cells |
| 04/13/2006 | DE19957034B4 Verfahren zur Behandlung von Oberflächen von Substraten und Vorrichtung A process for the surface treatment of substrates and device |
| 04/13/2006 | DE19955537B4 Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein A process for producing a support element for an IC module |
| 04/13/2006 | DE19951317B4 Dichtmechanismus zum Abdichten einer Vakkumkammer Sealing mechanism for sealing a Vakkumkammer |
| 04/13/2006 | DE19925670B4 Verfahren zum Herstellen von elektronischen Keramikbauteilen A method of manufacturing ceramic electronic components |
| 04/13/2006 | DE19922802B4 Verfahren zur Herstellung eines vertikal doppelt diffundierter MOSFETS A method for producing a vertical double diffused MOSFETS |
| 04/13/2006 | DE19914718B4 Verfahren zum gleichzeitigen Herstellen einer Mehrzahl von Leuchtdiodenelementen mit integrierten Kontakten A method for simultaneously producing a plurality of light emitting diodes elements with built-in contacts |
| 04/13/2006 | DE19739684B4 Verfahren zur Herstellung von Chipstapeln Process for the preparation of chip stacks |
| 04/13/2006 | DE19719181B4 Programmierbare Sicherungsschaltung und Verwendung derselben Programmable fuse circuit and using the same |
| 04/13/2006 | DE19615005B4 Gehäuse zur Aufnahme elektronischer Bauelemente und zugehöriges Herstellungsverfahren Housing for accommodating electronic components and associated production method |
| 04/13/2006 | DE19600780B4 Verfahren zum Kontaktieren von Bereichen mit verschiedener Dotierung in einem Halbleiterbauelement und Halbleiterbauelement Method of contacting of regions of different doping within a semiconductor device and semiconductor device |
| 04/13/2006 | DE19525745B4 Verfahren zur Bildung eines Abdeckungsmusters A method for forming a resist pattern |
| 04/13/2006 | DE19503964B4 Datenausgabepuffer einer Halbleitervorrichtung Data output buffer of a semiconductor device |
| 04/13/2006 | DE112004001023T5 Strukturierung eines magnetischen Tunnelübergangs unter Verwendung von SiC oder SiN Structuring a magnetic tunnel junction using SiC or SiN |
| 04/13/2006 | DE10355728B4 Verbinden von Halbleiterscheiben gleichen Durchmessers zum Erhalt einer gebondeten Scheibenanordnung Joining of semiconductor wafers of the same diameter to obtain a bonded disk assembly |
| 04/13/2006 | DE10314152B4 Herstellung von dielektrischen Zwischenschichtfilmen mit einem niedrigen K-Wert unter Verwendung von Si-haltigen Resists Production of interlayer dielectric films with a low K value using Si-containing resist |
| 04/13/2006 | DE10297714T5 Prüfgerät für elektronische Bauelemente An electronic component tester |
| 04/13/2006 | DE10211922B4 Waferuntersuchungssystem zur Untersuchung von Halbleiterwafern Wafer inspection system for the study of semiconductor wafers |
| 04/13/2006 | DE102005042096A1 Polierzusammensetzung und Polierverfahren unter Verwendung derselben Polishing composition and polishing method using the same |
| 04/13/2006 | DE102004063578A1 Fabrication of dual gate electrodes for metal oxide semiconductor field effect transistor devices, involves depositing thin layer with high dielectric constant or pure oxide layer on one region and thick oxide layer on the other region |
| 04/13/2006 | DE102004060692A1 Verfahren zum Bilden einer dielektrischen Schicht in einem Halbleiterbauelement A method of forming a dielectric layer in a semiconductor device |
| 04/13/2006 | DE102004059281B3 Thermode device for contacting first semiconductor building blocks and substrate has elongated base body and removable heater on movable guide member |
| 04/13/2006 | DE102004058877A1 Semiconductor chip comprises a front section with a semiconductor functional element, and a rear section |
| 04/13/2006 | DE102004048745A1 Bit conducting structure of DRAM comprises a number of parallel bit conductors in a storage element, which a arranged on different levels |
| 04/13/2006 | DE102004048626B3 Oxidationsverfahren von Siliziumscheiben zur Reduzierung von mechanischen Spannungen Oxidation method of silicon wafers to reduce mechanical stresses |
| 04/13/2006 | DE102004048607A1 Halbleiterbauelement Semiconductor device |
| 04/13/2006 | DE102004048201A1 Schicht zwischen Grenzflächen unterschiedlicher Komponenten in Halbleiterbauteilen, sowie Verfahren zu deren Herstellung Layer between interfaces of different components in semiconductor devices, as well as processes for their preparation |
| 04/13/2006 | DE102004047749A1 Halbleiterbauteil sowie dafür geeignetes Herstellungsverfahren Semiconductor device and manufacturing method suitable therefor |
| 04/13/2006 | DE102004047660A1 Bauteil mit integrierter Kapazitätsstruktur Component with integrated capacitance structure |
| 04/13/2006 | DE102004047630A1 Verfahren zur Herstellung eines CBRAM-Halbleiterspeichers A method for producing a semiconductor memory CBRAM |
| 04/13/2006 | DE102004047510A1 Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten Semiconductor device having embedded in plastic housing compound semiconductor device components |
| 04/13/2006 | DE102004047307A1 Wafer`s structured sample upper surface testing method for Dynamic RAM production, involves finding distance of surface area from flying time of ions from surface to verification device, and receiving result indicating surface portion |
| 04/13/2006 | DE102004046699A1 Contact surfaces e.g. cooling unit, connecting device, has contact surfaces connected by solidifying liquid e.g. melted solder, such that section of one of two surface edges exhibits structuring in area of edges |
| 04/13/2006 | DE102004046174A1 Integrierter BiCMOS-Halbleiterschaltkreis Integrated BiCMOS semiconductor circuit |
| 04/13/2006 | DE102004028851B4 Verfahren und Vorrichtung zum Vermessen eines Oberflächenprofils einer Probe Method and apparatus for measuring a surface profile of a sample |
| 04/13/2006 | DE102004024661B4 Trench transistor manufacturing method, by back-forming layer in upper trench region, and semiconductor material on side walls of trench before forming new semiconductor material on side walls |
| 04/13/2006 | DE10160174B4 Chemisch/mechanische Polieraufschlämmung und chemisch/mechanischer Polierprozeß und Seichtgraben-Isolationsprozeß unter Verwendung des Polierprozesses Chemical / mechanical polishing slurry and chemical / mechanical polishing process and shallow trench isolation process using the polishing process |
| 04/13/2006 | DE10142340B4 Feldeffekttransistor mit einem Kontakt zu einem seiner Dotiergebiete und Verfahren zu seiner Herstellung Field effect transistor having a contact to one of its doping regions and process for its preparation |
| 04/13/2006 | DE10065896B4 Elektronisches Bauteil mit Abschirmung und Verfahren zu seiner Herstellung Electronic component with screen and method for its preparation |
| 04/13/2006 | DE10062199B4 Substratprozessvorrichtung und Verfahren zum Prozessieren eines Wafers Substrate processing apparatus and method for processing a wafer |
| 04/13/2006 | DE10052484B4 Zappingschaltung und Zappingverfahren Zapping Zapping circuit and method |
| 04/13/2006 | DE10042661B4 Verfahren und Vorrichtungen für die Montage von Halbleiterchips Methods and devices for the mounting of semiconductor chips |
| 04/13/2006 | DE10036867B4 Substrat-Bearbeitungsverfahren und -vorrichtung Substrate processing method and apparatus |
| 04/12/2006 | EP1646091A2 Etching liquid composition |
| 04/12/2006 | EP1646084A1 A method in the fabrication of an integrated injection logic circuit |
| 04/12/2006 | EP1646083A1 Alternative dual damascene patterning approach |
| 04/12/2006 | EP1646082A1 Storage box for wafer shipping box |
| 04/12/2006 | EP1646081A1 Packaging method and system of electric component |
| 04/12/2006 | EP1646080A1 Etching of structures with high topography |
| 04/12/2006 | EP1646079A1 Device and method for surface treatment such as plasma treatment |
| 04/12/2006 | EP1646078A1 Epitaxial growth process |
| 04/12/2006 | EP1646077A1 Nitride semiconductor element and method for manufacturing thereof |
| 04/12/2006 | EP1646076A1 Manufacturing method of a thin film transistor array panel |
| 04/12/2006 | EP1646073A1 Illuminating method, exposing method, and device for therefor |
| 04/12/2006 | EP1646072A2 Capacitor structure |
| 04/12/2006 | EP1645606A1 Metal CMP slurry compositions that favor mechanical removal of metal oxides with reduced susceptibility to micro-scratching |
| 04/12/2006 | EP1645342A1 Method and apparatus for controlled transient cavitation |
| 04/12/2006 | EP1644988A2 High-density finfet integration scheme |
| 04/12/2006 | EP1644984A1 Semiconductor device including band-engineered superlattice |
| 04/12/2006 | EP1644983A1 Semiconductor device including mosfet having band-engineered superlattice |
| 04/12/2006 | EP1644982A1 Method for making semiconductor device including band-engineered superlattice |
| 04/12/2006 | EP1644981A2 Semiconductor device including band-engineered superlattice |
| 04/12/2006 | EP1644977A2 Method for forming a high-voltage / high-power die package |
| 04/12/2006 | EP1644974A2 Pecvd silicon-rich oxide layer for reduced uv charging in an eeprom |
| 04/12/2006 | EP1644973A2 Bipolar transistor and method of making same |
| 04/12/2006 | EP1644971A1 Precursor solution, method of preparation thereof and use thereof |
| 04/12/2006 | EP1644969A1 Method for implantation through an irregular surface |
| 04/12/2006 | EP1644968A2 Method of forming freestanding semiconductor layer |
| 04/12/2006 | EP1644967A2 Substrate assembly for stressed systems |
| 04/12/2006 | EP1644965A2 Automated process and apparatus for planarization of topographical surfaces |
| 04/12/2006 | EP1644962A2 Substrate support having dynamic temperature control |
| 04/12/2006 | EP1644960A1 Device and method for wet treating disc-like substrates |
| 04/12/2006 | EP1644959A1 Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components |
| 04/12/2006 | EP1644954A2 Method for anisotropically etching a recess in a silicon substrate and use of a plasma etching system |
| 04/12/2006 | EP1644953A2 Filling vias with thick film paste using contact printing |
| 04/12/2006 | EP1644874A1 Flexible semiconductor device and identification label |
| 04/12/2006 | EP1644862A2 Non-oriented optical character recognition of a wafer mark |
| 04/12/2006 | EP1644783A1 Semiconductor device with high-breakdown-voltage regulator |
| 04/12/2006 | EP1644776A2 Methods of removing photoresist from substrates |
| 04/12/2006 | EP1644557A1 Electrochemical processing cell |
| 04/12/2006 | EP1644426A1 Positive photoresist composition and method of forming resist pattern |
| 04/12/2006 | EP1570363A4 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection |
| 04/12/2006 | EP1502335A4 Automatic gas control system for a gas discharge laser |
| 04/12/2006 | EP1479025A4 Methods and apparatus for semiconductor testing |
| 04/12/2006 | EP1476903B1 A method of calibrating and using a semiconductor processing system |
| 04/12/2006 | EP1461296A4 Recycle for supercritical carbon dioxide |
| 04/12/2006 | EP1364392B1 Method of manufacturing optical devices and related improvements |
| 04/12/2006 | EP1285221B1 In-situ mirror characterization |
| 04/12/2006 | EP1204853A4 Inorganic permeation layer for micro-electric device |
| 04/12/2006 | EP1141128B1 A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom |
| 04/12/2006 | EP1075187A4 Method and apparatus for controlling the radial temperature gradient of a wafer while ramping the wafer temperature |
| 04/12/2006 | EP1064674B1 A method of manufacturing an electronic device comprising two layers of organic-containing material |
| 04/12/2006 | EP1046958B1 Use of a composition for bottom reflection preventive film |