Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/15/2006US7090896 Thermally treating a sol-gel product of a multifunctional carbosilane
08/15/2006US7090821 Metal oxide powder for high precision polishing and method of preparation thereof
08/15/2006US7090786 abraisive ceria particles; 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1, 3-butanediol, 2,2-dibromo-2-nitroethanol, or 2,2-dibromo-3-nitrilopropionamide; polypotassium or ammonium acrylate, ammonium citrate or ammonium dodecylbenzenesulfonate; storage stability; effective in neutral pH ranges
08/15/2006US7090784 Method for manufacturing porous structure and method for forming pattern
08/15/2006US7090781 Micro-actuator and method making the same
08/15/2006US7090750 An electrical apparatus comprising tank, chucks, shaft and drives, for electrodepositing a copper layer on a substrate, cleaning or etching, uniformity deposition from a solution
08/15/2006US7090742 Device for producing inductively coupled plasma and method thereof
08/15/2006US7090741 Semiconductor processing system
08/15/2006US7090727 Heated gas line body feedthrough for vapor and gas delivery systems and methods for employing same
08/15/2006US7090705 Electronic device, production method thereof, and plasma process apparatus
08/15/2006US7090572 Polishing pad, polishing apparatus having the same, and bonding apparatus
08/15/2006US7090570 Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
08/15/2006US7090567 Method and an element for surface polishing
08/15/2006US7090563 Polishing method
08/15/2006US7090482 Semiconductor device package manufacturing method and semiconductor device package manufactured by the method
08/15/2006US7090325 chip formed by separation of a silicon wafer, the silicon wafer having a first and a second direction that are mutually intersected; etching the wafer along a separation line parallel to the first direction of the wafer, dicing the wafer along a separation line parallel to the second direction
08/15/2006US7090222 Shaft sealing assembly for vacuum processing apparatus
08/15/2006US7089986 Laminating apparatus for optical disc
08/15/2006US7089984 Forming folded-stack packaged device using progressive folding tool
08/15/2006US7089947 Apparatus and method for cleaning a semiconductor wafer
08/15/2006US7089785 Method to assay sacrificial light absorbing materials and spin on glass materials for chemical origin of defectivity
08/15/2006US7089680 Vacuum processing apparatus and operating method therefor
08/15/2006US7089677 Method for calibrating alignment mark positions on substrates
08/15/2006CA2242634C Three-dimensional etching process
08/10/2006WO2006084250A2 A subthreshold design methodology for ultra-low power systems
08/10/2006WO2006084028A2 Interdiffusion bonded stacked die device
08/10/2006WO2006083993A2 Fabrication process for increased capacitance in an embedded dram memory
08/10/2006WO2006083919A1 Iso/nested control for soft mask processing
08/10/2006WO2006083909A2 Method of making substitutionally carbon-highly doped crystalline si-layers by cvd
08/10/2006WO2006083858A2 Plasma gate oxidation process using pulsed rf source power
08/10/2006WO2006083821A1 Selective deposition of silicon-containing films
08/10/2006WO2006083778A2 Selective plasma re-oxidation process using pulsed rf source power
08/10/2006WO2006083769A2 N2-based plasma treatment for porous low-k dielectric films
08/10/2006WO2006083693A2 Etchant treatment processes for substrate surfaces and chamber surfaces
08/10/2006WO2006083627A1 Plasma sensors for endpoint and end-of-life detection with self-diagnostic sensor
08/10/2006WO2006083592A1 Method for reducing critical dimensions using multiple masking steps
08/10/2006WO2006083546A2 In situ formed halo region in a transistor device
08/10/2006WO2006083401A2 Method of making a planar double-gated transistor
08/10/2006WO2006083380A2 Method for fabricating a semiconductor device
08/10/2006WO2006083034A1 Semiconductor storage apparatus and method for driving the same
08/10/2006WO2006082996A1 Silver particle powder and process for producing the same
08/10/2006WO2006082987A1 Silver particle powder and process for producing the same
08/10/2006WO2006082932A1 Defective particle measuring apparatus and defective particle measuring method
08/10/2006WO2006082909A1 Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method
08/10/2006WO2006082899A1 Method of working sintered diamond, cutter wheel for substrate and method of working the same
08/10/2006WO2006082867A1 Hybrid contacting/detaching system
08/10/2006WO2006082856A1 Negative resist composition and method of forming resist pattern
08/10/2006WO2006082855A1 Positive resist composition for thin-film implantation process and method for forming resist pattern
08/10/2006WO2006082848A1 Polysilazane-treating solvent and method for treating polysilazane by using such solvent
08/10/2006WO2006082796A1 Compound for resist and radiation-sensitive composition
08/10/2006WO2006082780A1 Substrate processing method, substrate processing apparatus and control program
08/10/2006WO2006082756A1 Semiconductor device, and method and apparatus for manufacturing same
08/10/2006WO2006082746A1 FILM OF SEMICONDUCTOR SINGLE CRYSTAL OF n-TYPE (100) FACE ORIENTED DIAMOND DOPED WITH PHOSPHORUS ATOM AND PROCESS FOR PRODUCING THE SAME
08/10/2006WO2006082744A1 Electric component mounting apparatus
08/10/2006WO2006082740A1 Positive-working resist composition and method for resist pattern formation
08/10/2006WO2006082738A1 Optical integrator, illumination optical device, exposure device, and exposure method
08/10/2006WO2006082730A1 Semiconductor device manufacturing method and plasma oxidation method
08/10/2006WO2006082724A1 Method for cleaning and method for plasma treatment
08/10/2006WO2006082718A1 Dielectric film and method for forming the same
08/10/2006WO2006082717A1 Apparatus for forming thin film
08/10/2006WO2006082639A1 Mark image processing method, program and device
08/10/2006WO2006082585A2 Sample preparation for micro-analysis
08/10/2006WO2006082568A2 Method of manufacturing a lateral semiconductor device
08/10/2006WO2006082469A1 Method for applying a high temperature treatment to a semimiconductor wafer
08/10/2006WO2006082468A1 Method for high-temperature annealing a multilayer wafer
08/10/2006WO2006082467A1 Substrate for crystal growing a nitride semiconductor
08/10/2006WO2006082466A1 Method for reducing the trap density in a semiconductor wafer
08/10/2006WO2006082322A1 Planar oxidation method for producing a localised buried insulator
08/10/2006WO2006082247A1 Multi-gate fet with multi-layer channel
08/10/2006WO2006082163A1 Methods of forming silicide
08/10/2006WO2006081987A1 Method for producing integrated circuits provided with silicon- germanium hetero-bipolar transistors
08/10/2006WO2006081974A1 Method for the production of integrated circuits
08/10/2006WO2006081929A1 Process for manufacturing rounded polysilicon electrodes on semiconductor components
08/10/2006WO2006066964A3 An electronic device, a chip containing method and a contacting device
08/10/2006WO2006066164A3 Improved uniformity in batch spray processing using independent cassette rotation
08/10/2006WO2006065378A3 Flip chip and wire bond semiconductor package
08/10/2006WO2006064977A3 Ceramic aggregate substrate, ceramic substrate and ceramic aggregate substrate fabrication method
08/10/2006WO2006063046A3 Charged particle implantation for transistor symmetry
08/10/2006WO2006055357A3 Trench capacitor with hybrid surface orientation substrate
08/10/2006WO2006044417A3 Cmp composition with a polymer additive for polishing noble metals
08/10/2006WO2006039632A3 Gate stacks
08/10/2006WO2006020064A3 Asymmetric hetero-doped high-voltage mosfet (ah2mos)
08/10/2006WO2006017224A3 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
08/10/2006WO2006005327A3 Method and device for the alternate contacting of two wafers
08/10/2006WO2005109095A3 Method for imprint lithography at constant temperature
08/10/2006WO2005104214A3 Composition useful for removal of bottom anti-reflection coatings from patterned ion-implanted photoresist wafers
08/10/2006WO2005050777A3 Receiver electronics proximate antenna
08/10/2006WO2005004199A3 Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers
08/10/2006US20060178282 Process for production of etching or cleaning fluids
08/10/2006US20060178095 Polishing media stabilizer
08/10/2006US20060178094 Polishing apparatus
08/10/2006US20060178089 Wafer-retaining carrier, double-side grinding device using the same, and double-side grinding method for wafer
08/10/2006US20060178020 Semiconductor device fabrication method
08/10/2006US20060178019 Low temperature deposition of silicon oxides and oxynitrides
08/10/2006US20060178018 Silicon oxynitride gate dielectric formation using multiple annealing steps
08/10/2006US20060178017 Method for forming insulating film, method for forming multilayer structure and method for manufacturing semiconductor device
08/10/2006US20060178016 Silicon carbide-based device contact and contact fabrication method
08/10/2006US20060178015 Wet chemical treatment to form a thin oxide for high k gate dielectrics
08/10/2006US20060178014 Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus
08/10/2006US20060178013 Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus