Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/08/2006US7087487 Method for fabricating nonvolatile memory device and method for fabricating semiconductor device
08/08/2006US7087486 Method for scalable, low-cost polysilicon capacitor in a planar DRAM
08/08/2006US7087485 Method of fabricating an oxide collar for a trench capacitor
08/08/2006US7087484 Method for fabricating trench capacitors for integrated semiconductor memories
08/08/2006US7087483 Single transistor RAM cell and method of manufacture
08/08/2006US7087482 Method of forming material using atomic layer deposition and method of forming capacitor of semiconductor device using the same
08/08/2006US7087481 Systems and methods for forming metal oxides using metal compounds containing aminosilane ligands
08/08/2006US7087480 Process to make high-k transistor dielectrics
08/08/2006US7087479 Method of forming integrated circuit contacts
08/08/2006US7087478 Methods of forming semiconductor constructions
08/08/2006US7087477 FinFET SRAM cell using low mobility plane for cell stability and method for forming
08/08/2006US7087476 Using different gate dielectrics with NMOS and PMOS transistors of a complementary metal oxide semiconductor integrated circuit
08/08/2006US7087475 Semiconductor device having a plurality of gate electrodes and manufacturing method thereof
08/08/2006US7087474 Semiconductor device and a method of manufacturing the same
08/08/2006US7087473 Method of forming conventional complementary MOS transistors and complementary heterojunction MOS transistors on common substrate
08/08/2006US7087472 Method of making a vertical compound semiconductor field effect transistor device
08/08/2006US7087471 Locally thinned fins
08/08/2006US7087470 Dual gate dielectric thickness devices
08/08/2006US7087469 Method of controlling a capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor
08/08/2006US7087468 Method for forming conductors in semiconductor devices
08/08/2006US7087467 Lead frame and production process thereof and production process of thermally conductive substrate
08/08/2006US7087466 Method of making a semiconductor chip assembly with a solder-attached ground plane
08/08/2006US7087465 Method of packaging a semiconductor light emitting device
08/08/2006US7087464 Method and structure for a wafer level packaging
08/08/2006US7087463 Laser separation of encapsulated submount
08/08/2006US7087462 Method for forming leadless semiconductor packages
08/08/2006US7087461 Process and lead frame for making leadless semiconductor packages
08/08/2006US7087460 Methods for assembly and packaging of flip chip configured dice with interposer
08/08/2006US7087459 Method for packaging a multi-chip module of a semiconductor device
08/08/2006US7087458 Method for fabricating a flip chip package with pillar bump and no flow underfill
08/08/2006US7087457 Die bonding method and apparatus
08/08/2006US7087456 Stiction resistant release process
08/08/2006US7087455 Semiconductor device and manufacturing method for the same
08/08/2006US7087454 Fabrication of single polarity programmable resistance structure
08/08/2006US7087453 Method and device for the production of a semiconducting and/or electroluminescence-displaying organic layered structure
08/08/2006US7087452 Edge arrangements for integrated circuit chips
08/08/2006US7087451 Microfabricated hot wire vacuum sensor
08/08/2006US7087450 Fabricating method for a fluxgate sensor integrated in printed circuit board
08/08/2006US7087449 Oxygen-doped Al-containing current blocking layers in active semiconductor devices
08/08/2006US7087448 Single frequency laser
08/08/2006US7087447 Method for fabricating zig-zag slabs for solid state lasers
08/08/2006US7087446 Method of mounting optoelectronic devices on an optical element and article
08/08/2006US7087445 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
08/08/2006US7087444 Method for integration of microelectronic components with microfluidic devices
08/08/2006US7087443 Optimized temperature controller for cold mass introduction
08/08/2006US7087442 Process for the formation of a spatial chip arrangement and spatial chip arrangement
08/08/2006US7087441 Method of making a circuitized substrate having a plurality of solder connection sites thereon
08/08/2006US7087440 Monitoring of nitrided oxide gate dielectrics by determination of a wet etch
08/08/2006US7087439 Method and apparatus for thermally assisted testing of integrated circuits
08/08/2006US7087438 Encapsulation of conductive lines of semiconductor devices
08/08/2006US7087363 Method of forming a top gate thin film transistor
08/08/2006US7087352 Measurement by adjustment lithography exposure of light; detection of interference pattern; spectral curves stored in library
08/08/2006US7087315 Method for forming plating film
08/08/2006US7087311 three-dimensional polyimide formed from a tetra[amino(phenyl)]adamantane and tetracarboxylic acid monomers; excellent mechanical strength and heat resistance compared to films with linear polyimides
08/08/2006US7087304 Polysulfide-based toughening agents, compositions containing same and methods for the use thereof
08/08/2006US7087271 Silicon oxycarbide; vapor deposition
08/08/2006US7087198 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
08/08/2006US7087188 Abrasives for chemical mechanical polishing
08/08/2006US7087182 Process of forming an electrically erasable programmable read only memory with an oxide layer exposed to hydrogen and nitrogen
08/08/2006US7087143 Plating system for semiconductor materials
08/08/2006US7087133 Methods for application of adhesive tape to semiconductor devices
08/08/2006US7087122 Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
08/08/2006US7087119 Atomic layer deposition with point of use generated reactive gas species
08/08/2006US7087118 Coating film forming apparatus and coating unit
08/08/2006US7087117 Substrate processing apparatus and substrate processing method
08/08/2006US7087116 Apparatus for modifying the configuration of an exposed surface of a viscous fluid
08/08/2006US7087114 Single crystal GaN substrate, method of growing single crystal GaN and method of producing single crystal GaN substrate
08/08/2006US7087111 Method of forming a refractory metal silicide
08/08/2006US7087102 Process for purification of germane
08/08/2006US7086929 Endpoint detection with multiple light beams
08/08/2006US7086919 Detection and repair system and method thereof
08/08/2006US7086822 Scalar type robot for carrying flat plate-like object, and flat plate-like object processing system
08/08/2006US7086638 Methods and apparatus for sealing an opening of a processing chamber
08/08/2006US7086562 Methods and apparatus for retaining a tray stack having a plurality of trays for carrying microelectronic devices
08/08/2006US7086540 Storage cassette with positionable stoppers and method for operating the same
08/08/2006US7086410 Substrate processing apparatus and substrate processing method
08/08/2006US7086347 Apparatus and methods for minimizing arcing in a plasma processing chamber
08/08/2006US7086291 Overstress indication
08/08/2006US7086175 Method of manufacturing liquid crystal panel and gap adjusting apparatus therefor
08/08/2006US7086149 Method of making a contact structure with a distinctly formed tip structure
08/08/2006US7086147 Method of accommodating in volume expansion during solder reflow
08/03/2006WO2006081470A1 Method and composition for polishing a substrate
08/03/2006WO2006081446A1 Method and composition for polishing a substrate
08/03/2006WO2006081406A1 Compositions for processing of semiconductor substrates
08/03/2006WO2006081398A2 Mold cavity identification markings for ic packages
08/03/2006WO2006081352A2 System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition process
08/03/2006WO2006081315A2 Method of eliminating curl for devices on thin flexible substrates, and devices made thereby
08/03/2006WO2006081290A2 Apparatus for electroless deposition of metals onto semiconductor substrates
08/03/2006WO2006081285A2 Electroprocessing profile control
08/03/2006WO2006081211A2 Scribing tool and method
08/03/2006WO2006081149A2 Novel polishing slurries and abrasive-free solutions having a multifunctional activator
08/03/2006WO2006081106A1 Ribbon bonding tool and process
08/03/2006WO2006081104A2 Semiconductor wafer boat for a vertical furnace
08/03/2006WO2006081012A1 Dual silicide process to improve device performance
08/03/2006WO2006081005A2 Semiconductor device having nitridated oxide layer and method therefor
08/03/2006WO2006081003A2 Metal gate transistor for cmos process and method for making
08/03/2006WO2006080999A2 Non-volatile nanocrystal memory and method therefor
08/03/2006WO2006080980A1 Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow
08/03/2006WO2006080960A1 Method to form a thin film resistor
08/03/2006WO2006080815A1 Apparatus and method for manufacturing absorption pad