Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/08/2006US7087997 Copper to aluminum interlayer interconnect using stud and via liner
08/08/2006US7087996 Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
08/08/2006US7087995 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
08/08/2006US7087994 Microelectronic devices including underfill apertures
08/08/2006US7087992 Multichip wafer level packages and computing systems incorporating same
08/08/2006US7087991 Integrated circuit package and method of manufacture
08/08/2006US7087987 Tape circuit substrate and semiconductor chip package using the same
08/08/2006US7087984 Methods for protecting intermediate conductive elements of semiconductor device assemblies
08/08/2006US7087983 Manufacturing methods of semiconductor devices and a solid state image pickup device
08/08/2006US7087982 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials
08/08/2006US7087981 Metal semiconductor contact, semiconductor component, integrated circuit arrangement and method
08/08/2006US7087980 Film thickness measuring monitor wafer
08/08/2006US7087977 Semiconductor device including multiple wiring layers and circuits operating in different frequency bands
08/08/2006US7087976 Inductors for integrated circuits
08/08/2006US7087974 Semiconductor integrated circuit including anti-fuse and method for manufacturing the same
08/08/2006US7087969 Complementary field effect transistor and its manufacturing method
08/08/2006US7087967 LSI device having core and interface regions with SOI layers of different thickness
08/08/2006US7087965 Strained silicon CMOS on hybrid crystal orientations
08/08/2006US7087964 Predominantly <100> polycrystalline silicon thin film transistor
08/08/2006US7087963 Method of manufacturing thin film transistor
08/08/2006US7087962 Method for forming a MOS transistor having lightly dopped drain regions and structure thereof
08/08/2006US7087961 Semiconductor device with reduced on-state resistance
08/08/2006US7087960 Semiconductor device including impurities in substrate via MOS transistor gate electrode and gate insulation film
08/08/2006US7087958 Termination structure of DMOS device
08/08/2006US7087957 Semiconductor device and manufacturing method of the same
08/08/2006US7087956 Semiconductor device and it's manufacturing method
08/08/2006US7087955 Semiconductor device and a method of manufacturing the same
08/08/2006US7087954 In service programmable logic arrays with low tunnel barrier interpoly insulators
08/08/2006US7087951 Non-volatile memory cells utilizing substrate trenches
08/08/2006US7087950 Flash memory cell, flash memory device and manufacturing method thereof
08/08/2006US7087949 Selective hemispherical silicon grain (HSG) conversion inhibitor for use during the manufacture of a semiconductor device
08/08/2006US7087948 Forming electronic structures having dual dielectric thicknesses and the structure so formed
08/08/2006US7087947 Semiconductor device with loop line pattern structure, method and alternating phase shift mask for fabricating the same
08/08/2006US7087946 Electric device having nanoscale wires and gaps
08/08/2006US7087944 Image sensor having a charge storage region provided within an implant region
08/08/2006US7087943 Direct alignment scheme between multiple lithography layers
08/08/2006US7087942 Semiconductor integrated circuit device with reduced leakage current
08/08/2006US7087940 Structure and method of forming bipolar transistor having a self-aligned raised extrinsic base using self-aligned etch stop layer
08/08/2006US7087934 Semiconductor light emitting device, image display unit, lighting apparatus, and method of fabricating semiconductor light emitting device
08/08/2006US7087932 Semiconductor light-emitting device and semiconductor light-emitting device
08/08/2006US7087931 High luminance indium gallium aluminum nitride light emitting device and manufacture method thereof
08/08/2006US7087930 Semiconductor light emitting element and method of making same
08/08/2006US7087925 Semiconductor device having reduced capacitance to substrate and method
08/08/2006US7087919 Layered resistance variable memory device and method of fabrication
08/08/2006US7087912 Ion beam irradiation apparatus for suppressing charge up of substrate and method for the same
08/08/2006US7087911 Method for recycling gases used in a lithography tool
08/08/2006US7087857 Method of dividing a workpiece in the form of a plate having a layer and a substrate made of different materials
08/08/2006US7087844 Wiring circuit board
08/08/2006US7087774 Volatile copper(II) complexes and reducing agents for deposition of copper films by atomic layer deposition
08/08/2006US7087563 Nonmetallic salt of hydrofluoric acid (especially NH4OH), an organic solvent, a sugar alcohol, and water and having a hydrogen ion concentration of not less than 8.
08/08/2006US7087562 Post-CMP washing liquid composition
08/08/2006US7087561 Comprises water, phosphoric acid, and ascorbic acid (or citric acid); does not require hazardous waste disposal
08/08/2006US7087538 Method to fill the gap between coupled wafers
08/08/2006US7087537 Method for fabricating oxide thin films
08/08/2006US7087536 Silicon oxide gapfill deposition using liquid precursors
08/08/2006US7087535 Multilayer; overcoating substrate with dielectric; atomic layer deposition
08/08/2006US7087534 Semiconductor substrate cleaning
08/08/2006US7087533 Method for fabricating semiconductor device
08/08/2006US7087532 Formation of controlled sublithographic structures
08/08/2006US7087530 Aqueous dispersion for chemical mechanical polishing
08/08/2006US7087529 Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces
08/08/2006US7087528 Chemical-mechanical polishing (CMP) process for shallow trench isolation
08/08/2006US7087527 Extended kalman filter incorporating offline metrology
08/08/2006US7087525 Methods of forming layers over substrates
08/08/2006US7087524 Method of forming copper wiring in semiconductor device
08/08/2006US7087523 Method for producing a structure using nanoparticles
08/08/2006US7087522 Multilayer copper structure for improving adhesion property
08/08/2006US7087521 Forming an intermediate layer in interconnect joints and structures formed thereby
08/08/2006US7087520 Method for fabricating metal wiring
08/08/2006US7087519 Method for forming contact having low resistivity using porous plug and method for forming semiconductor devices using the same
08/08/2006US7087518 Method of passivating and/or removing contaminants on a low-k dielectric/copper surface
08/08/2006US7087517 Method to fabricate interconnect structures
08/08/2006US7087516 Electromigration-reliability improvement of dual damascene interconnects
08/08/2006US7087515 Method for forming flowable dielectric layer in semiconductor device
08/08/2006US7087514 Substrate having built-in semiconductor apparatus and manufacturing method thereof
08/08/2006US7087513 Method to produce low strength temporary solder joints
08/08/2006US7087512 Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
08/08/2006US7087511 Method for conducting heat in a flip-chip assembly
08/08/2006US7087510 Method of making bondable leads using positive photoresist and structures made therefrom
08/08/2006US7087509 Method of forming a gate electrode on a semiconductor device and a device incorporating same
08/08/2006US7087508 Method of improving short channel effect and gate oxide reliability by nitrogen plasma treatment before spacer deposition
08/08/2006US7087507 Implantation of deuterium in MOS and DRAM devices
08/08/2006US7087506 Method of forming freestanding semiconductor layer
08/08/2006US7087505 Semiconductor device including semiconductor thin films having different crystallinity, substrate of the same, and manufacturing method of the same, and liquid crystal display and manufacturing method of the same
08/08/2006US7087504 Method of manufacturing a semiconductor device by irradiating with a laser beam
08/08/2006US7087503 Shallow self isolated doped implanted silicon process
08/08/2006US7087502 Method for generating chip stacks
08/08/2006US7087501 Manufacture of probe unit having lead probes extending beyond edge of substrate
08/08/2006US7087500 Charge trapping memory cell
08/08/2006US7087499 Integrated antifuse structure for FINFET and CMOS devices
08/08/2006US7087498 In semiconductor silicon substrate; multilayer, antireflective layer andphotoresist overcoating substrate; forming pattern; controlling etching; determination end-points
08/08/2006US7087497 Low-thermal-budget gapfill process
08/08/2006US7087496 Seal ring for integrated circuits
08/08/2006US7087495 Method for manufacturing semiconductor device
08/08/2006US7087494 Method for manufacturing semiconductor device and semiconductor device
08/08/2006US7087492 Method for fabricating transistors of different conduction types and having different packing densities in a semiconductor substrate
08/08/2006US7087491 Method and system for vertical DMOS with slots
08/08/2006US7087490 Method and composite for decreasing charge leakage
08/08/2006US7087489 Method of fabricating trap type nonvolatile memory device
08/08/2006US7087488 Method for fabricating a mask ROM