Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/10/2006DE102005004365A1 Conducting structure manufacturing method for integrated circuit arrangement, involves superimposing nucleation layer at base surface or cover surface before or after creation of through-hole, and depositing structure material in hole
08/10/2006DE102005004355A1 Power semiconductor device e.g. high voltage diode, has p-type transition doping region in transition region, where doping in transient doping region of device or part of device is compensated while doping in region near device surface
08/10/2006DE102004055040B4 Verfahren zum Schneiden eines Laminats mit einem Laser und Laminat A method of cutting a laminate with a laser and laminate
08/10/2006DE102004047767B3 Method of siliconizing silicon boundary surface e.g. for semiconductor wafer manufacture, involves positioning semiconductor wafer on wafer chuck with wafer thermally decoupled from heated chuck
08/10/2006DE102004028026B4 Zweischichtige Metallhartmasken zur Verwendung in Dual-Damascene-Ätzschemata und Verfahren zur Bereitstellung der Metallhartmasken Two-layer metal hard mask for use in dual-damascene Ätzschemata and method for providing the metal hard mask
08/10/2006DE102004014179B4 Polierkissen mit Überwachungsfunktionalität Polishing pad with monitoring functionality
08/10/2006DE10138510B4 Grabenisolation mit selbstjustierender Oberflächenversiegelung und Verfahren zur Herstellung einer solchen Grabenisolation Grave insulation with self-aligning surface coating and method for producing such a grave insulation
08/10/2006DE10131627B4 Verfahren zum Herstellen einer Halbleiterspeichereinrichtung A method of manufacturing a semiconductor memory device
08/09/2006WO2006093078A1 Surface acoustic wave device
08/09/2006WO2006024979A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
08/09/2006EP1689006A2 Multi-bit magnetic memory device using spin-polarized current and methods of manufacturing and operating the same
08/09/2006EP1689002A2 Nonvolatile memory device and method of manufacturing the same
08/09/2006EP1689001A2 High-voltage semiconductor devices
08/09/2006EP1689000A1 Semiconductor element
08/09/2006EP1688993A2 Standardized bonding location process and apparatus
08/09/2006EP1688992A1 Column suction head and column mounting method
08/09/2006EP1688991A2 SOI wafer production method
08/09/2006EP1688990A2 Method for manufacturing SOI substrate
08/09/2006EP1688989A1 Method of manufacturing integrated circuits comprising at least one silicon germanium heterobipolar transistor
08/09/2006EP1688988A1 Stage drive method, stage apparatus, and exposure apparatus
08/09/2006EP1688793A1 Thick film or ultrathick film responsive chemical amplification type photosensitive resin composition
08/09/2006EP1688789A2 Half-tone stacked film, photomask-blank, photomask and fabrication method thereof
08/09/2006EP1688712A1 Integrated multisensor
08/09/2006EP1688477A1 Cleaning agent
08/09/2006EP1688421A2 Method for producing borazine compound
08/09/2006EP1688218A1 Polishing apparatus
08/09/2006EP1687877A2 Laser thin film poly-silicon annealing system
08/09/2006EP1687866A1 Fabrication of ltcc t/r modules wih multiple cavities and an integrated ceramic ring frame
08/09/2006EP1687850A2 Crack stop for low k dielectrics
08/09/2006EP1687849A1 Production of semiconductor substrates with buried layers by joining (bonding) semiconductor wafers
08/09/2006EP1687848A2 METHOD FOR FABRICATING SiGe-ON-INSULATOR (SGOI) AND Ge-ON-INSULATOR (GOI) SUBSTRATES
08/09/2006EP1687847A1 Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium
08/09/2006EP1687846A1 Method for galvanising and forming a contact boss
08/09/2006EP1687845A2 Device having compliant electrical interconnects and compliant sealing element
08/09/2006EP1687844A2 Method of forming a low voltage gate oxide layer and tunnel oxide layer in an eeprom cell
08/09/2006EP1687843A1 Method for the production of a nanoscale semiconductor structure and vertical semiconductor components based on said semiconductor structure
08/09/2006EP1687842A1 Radical generating method, etching method and apparatus for use in these methods
08/09/2006EP1687841A1 Formation of lattice-tuning semiconductor substrates
08/09/2006EP1687840A1 Mim capacitor structure and method of fabrication
08/09/2006EP1687839A1 Electronic device and method for its fabrication
08/09/2006EP1687838A2 A high temperature memory device
08/09/2006EP1687837A2 High temperature electronic devices
08/09/2006EP1687670A2 A method to contact patterned electrodes on porous substrates and devices thereby
08/09/2006EP1687457A2 Metal carbide gate structure and method of fabrication
08/09/2006EP1687387A1 Polishing composition comprising phosphate esters and polishing method
08/09/2006EP1687130A1 Method of embossing cured silicone resin substrates
08/09/2006EP1687114A1 Vertical removal of excess solder from a circuit substrate
08/09/2006EP1590644B1 Micromechanical sensor and method for production thereof
08/09/2006EP1588453A4 Varactor apparatuses and methods
08/09/2006EP1543565A4 Heterojunction field effect transistors using silicon-germanium and silicon-carbon alloys
08/09/2006EP1509922B1 Mram-cell and array-architecture with maximum read-out signal and reduced electromagnetic interference
08/09/2006EP1468445B1 Optimized method of transfer of a thin layer of silicon carbide to a receiving substrate
08/09/2006EP1407478B1 Device for performing surface treatment on semiconductor wafers
08/09/2006EP1393131A4 Thick film photoresists and methods for use thereof
08/09/2006EP1370993A4 Block based design methodology with programmable components
08/09/2006EP1292974B1 Method for making an electronic component with self-aligned drain and gate, in damascene architecture
08/09/2006EP1292398B1 Process and system for determining acceptability of a fluid dispense
08/09/2006EP1249035B1 Silicon/germanium bipolar transistor with an optimized germanium profile
08/09/2006EP1175624B1 Integrated circuit with test interface
08/09/2006EP1149184B1 Method and system for producing semiconductor crystals using temperature management
08/09/2006EP1141867B1 Method and arrangement for verifying the layout of an integrated circuit with the aid of a computer and use thereof in the production of an integrated circuit
08/09/2006EP1095410B1 Semiconductor arrangement with ohmic contact and a method for contacting a semiconductor arrangement
08/09/2006EP0982320B1 Light-absorbing polymers and application thereof to antireflection film
08/09/2006EP0977797B1 Organohydridosiloxane resins with high organic content
08/09/2006EP0965141B1 Method of providing a gettering scheme in the manufacture of silicon-on-insulator (soi) integrated circuits
08/09/2006EP0951739B1 High density electrical connectors
08/09/2006CN2805096Y Semiconductor elements
08/09/2006CN2805094Y No-bed course, multiple-chip piling-up package structure
08/09/2006CN1817071A Reflow soldering method using pb-free solder alloy and hybrid packaging method and structure
08/09/2006CN1816968A Nonvolatile flip-flop circuit, and method for driving the same
08/09/2006CN1816952A Nitride semiconductor light-emitting device and method for manufacturing same
08/09/2006CN1816913A Nonvolatile semiconductor storage device
08/09/2006CN1816910A SiGe lattice engineering using a combination of oxidation, thinning and epitaxial regrowth
08/09/2006CN1816909A Electrostatic chuck for substrate stage, electrode used for same, and processing system having the chuck and electrode
08/09/2006CN1816908A Die bonding
08/09/2006CN1816907A Carrying apparatus and carrying control method for sheet-like substrate
08/09/2006CN1816906A Method and apparatus for performing metrology dispatching based upon fault detection
08/09/2006CN1816905A Feedforward, feedback wafer to wafer control method for an etch process
08/09/2006CN1816904A Mold compound cap in a flip chip multi-matrix array package and process of making same
08/09/2006CN1816903A Precursor solution, method of preparation thereof and use thereof
08/09/2006CN1816902A Process for producing low-k dielectric films
08/09/2006CN1816901A Processing method of silicon wafer
08/09/2006CN1816900A Manufacturing method of silicon wafer
08/09/2006CN1816899A Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
08/09/2006CN1816898A Substrate processing system
08/09/2006CN1816897A Substrate assembly for stressed systems
08/09/2006CN1816896A Storage system for wafers
08/09/2006CN1816895A Wafer inspection device
08/09/2006CN1816892A Beam uniformity and angular distribution measurement system
08/09/2006CN1816883A Nonvolatile memory and method of making same
08/09/2006CN1816817A Flexible semiconductor device and identification label
08/09/2006CN1816777A Method providing an improved bi-layer photoresist pattern
08/09/2006CN1816776A Resist composition, multilayer body, and method for forming resist pattern
08/09/2006CN1816773A Methods of etching photoresist on substrates
08/09/2006CN1816765A Micromirrors with mechanisms for enhancing coupling of the micromirrors with electrostatic fields
08/09/2006CN1816748A Probe card and semiconductor testing device using probe sheet or probe card semiconductor device producing method
08/09/2006CN1816650A Electrochemical processing cell
08/09/2006CN1816425A Conversion valve device
08/09/2006CN1816256A Film pattern forming method and application of the same
08/09/2006CN1816255A Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus