Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2006
08/03/2006WO2006080809A1 Apparatus for processing semiconductor package
08/03/2006WO2006080796A1 Cerium oxide abrasive and slurry containing the same
08/03/2006WO2006080782A1 Method of depositing thin layer using atomic layer deposition
08/03/2006WO2006080708A1 Iii-nitride semiconductor light emitting device and method for manufacturing the same
08/03/2006WO2006080621A1 Manufacture method of vertical-type electric contactor and vertical-type electric contactor thereof
08/03/2006WO2006080586A1 METHOD FOR FORMING GaN FILM, SEMICONDUCTOR DEVICE, METHOD FOR FORMING GROUP III NITRIDE THIN FILM, AND SEMICONDUCTOR DEVICE HAVING GROUP III NITRIDE THIN FILM
08/03/2006WO2006080552A1 Semiconductor device, and method for manufacturing thereof
08/03/2006WO2006080516A1 Exposure apparatus and method for manufacturing device
08/03/2006WO2006080513A1 Laser light source control method, laser light source device, and exposure apparatus
08/03/2006WO2006080500A1 Adhesive and luminescent element
08/03/2006WO2006080474A1 Exposure system and device
08/03/2006WO2006080429A1 Method for forming resist pattern, supercritical processing liquid for lithography process and method for forming antireflection film
08/03/2006WO2006080428A1 Method of forming resist pattern
08/03/2006WO2006080427A1 Exposure method, exposure apparatus and method for manufacturing device
08/03/2006WO2006080423A1 Monitor wafer and method for monitoring wafer
08/03/2006WO2006080408A1 Light-emitting element and method for manufacturing light-emitting element
08/03/2006WO2006080376A1 Nitride semiconductor device and method of growing nitride semiconductor crystal layer
08/03/2006WO2006080337A1 Semiconductor device and method for manufacturing same, and stacked type semiconductor integrated circuit
08/03/2006WO2006080290A1 Cooling treatment device
08/03/2006WO2006080285A1 Exposure device, exposure method, and micro device manufacturing method
08/03/2006WO2006080276A1 Capacitance element manufacturing method and etching method
08/03/2006WO2006080271A1 Method of evaluating crystal defect of silicon single crystal wafer
08/03/2006WO2006080264A1 Method of selective etching and silicon single crystal substrate
08/03/2006WO2006080250A1 Immersion exposure system, and recycle method and supply method of liquid for immersion exposure
08/03/2006WO2006080226A1 Process for producing micromachine, and micromachine
08/03/2006WO2006080212A1 Projection optical system, exposure system, and exposure method
08/03/2006WO2006080205A1 CYCLIC SILOXANE COMPOUND, Si-CONTAINING FILM-FORMING MATERIAL, AND USE THEREOF
08/03/2006WO2006080178A1 Material for metallic-pattern formation, crosslinking monomer, and method of forming metallic pattern
08/03/2006WO2006080151A1 Method for forming resist pattern
08/03/2006WO2006080146A1 Probe card and method for manufacturing same
08/03/2006WO2006080109A1 Semiconductor device provided with mis structure and method for manufacturing the same
08/03/2006WO2006080081A1 Non-volatile memory and control method thereof
08/03/2006WO2006080064A1 Semiconductor device and method for manufacturing same
08/03/2006WO2006080056A1 Semiconductor device and production method therefor
08/03/2006WO2006079964A2 Method of fabricating a dual-gate fet
08/03/2006WO2006079870A1 Method of fabricating a silicon-on-insulator structure
08/03/2006WO2006079849A1 Improvements to ceramic packages for high frequency circuits
08/03/2006WO2006079758A1 Method of producing a silicon oxide-based material with a low dielectric constant
08/03/2006WO2006079742A1 Production of a tunnel oxide of a non-volatile memory transistor using flotox technology by low-temperature ion beam sputtering
08/03/2006WO2006079174A1 Modular sub-assembly of semiconductor strips
08/03/2006WO2006066202A3 Active edge grip rest pad
08/03/2006WO2006066194A3 Strained nmos transistor featuring deep carbon doped regions and raised donor doped source and drain
08/03/2006WO2006062796A3 Semiconductor device and method of making semiconductor device comprising multiple stacked hybrid orientation layers
08/03/2006WO2006059330A3 Reflective optical system
08/03/2006WO2006057745A3 Direct imprinting of etch barriers using step and flash imprint lithography
08/03/2006WO2006057645A8 Enhancement of electron and hole mobilities in 110 under biaxial compressive strain
08/03/2006WO2006055179A3 Methods and structures for electrical communication with an overlying electrode for a semiconductor element
08/03/2006WO2006054732A3 Polishing apparatus and polishing method
08/03/2006WO2006049976A3 Patterned silicon surfaces
08/03/2006WO2006049763A3 Thin film semiconductor devices and methods of making
08/03/2006WO2006048845A3 Carbon nanotube-based conductive connections for integrated circuit devices
08/03/2006WO2006044019A3 Low temperature sin deposition methods
08/03/2006WO2006041889A3 Conductive pad design modification for better wafer-pad contact
08/03/2006WO2006034808A3 Method and device for predicting surface abrasion
08/03/2006WO2006026180A3 Reduction of source and drain parasitic capacitance in cmos devices
08/03/2006WO2006020565B1 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
08/03/2006WO2006015328A3 Pulse thermal processing of functional materials using directed plasma arc
08/03/2006WO2005117071A3 Optoelectronic semiconductor component and housing base for such a component
08/03/2006WO2005109971A3 Atomic beam to protect a reticle
08/03/2006WO2005079498A3 Continuously varying offset mark and methods of determining overlay
08/03/2006WO2004112096A3 Method and system for high volume transfer of dies to substrates
08/03/2006WO2004093128A3 Lead frame structure with aperture or groove for flip chip in a leaded molded package
08/03/2006US20060174257 Antenna designs for radio frequency identification tags
08/03/2006US20060173129 Crosslinkable fluorinated aromatic prepolymer and its uses
08/03/2006US20060172666 Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips
08/03/2006US20060172664 Methods for reducing delamination during chemical mechanical polishing
08/03/2006US20060172663 Surface polishing method and apparatus thereof
08/03/2006US20060172556 Semiconductor device having a high carbon content strain inducing film and a method of manufacture therefor
08/03/2006US20060172555 Method to make silicon nanoparticle from silicon rich-oxide by DC reactive sputtering for electroluminescence application
08/03/2006US20060172554 Method of forming gate dielectric layer
08/03/2006US20060172553 Method of retaining a substrate to a wafer chuck
08/03/2006US20060172552 N2 based plasma treatment for enhanced sidewall smoothing and pore sealing porous low-k dielectric films
08/03/2006US20060172551 Plasma gate oxidation process using pulsed RF source power
08/03/2006US20060172550 Selective plasma re-oxidation process using pulsed RF source power
08/03/2006US20060172549 Method of separating a mold from a solidified layer disposed on a substrate
08/03/2006US20060172548 Method of cleaning wafer and method of manufacturing gate structure
08/03/2006US20060172547 Implantation of gate regions in semiconductor device fabrication
08/03/2006US20060172546 Dry-etching method
08/03/2006US20060172545 Purge process conducted in the presence of a purge plasma
08/03/2006US20060172544 Member for plasma etching device and method for manufacture thereof
08/03/2006US20060172543 Graded junction termination extensions for electronic devices
08/03/2006US20060172542 Method and apparatus to confine plasma and to enhance flow conductance
08/03/2006US20060172541 Method of fabricating micro-needle array
08/03/2006US20060172540 Reduction of feature critical dimensions using multiple masks
08/03/2006US20060172539 Method of treating a structured surface
08/03/2006US20060172538 Wet etching the edge and bevel of a silicon wafer
08/03/2006US20060172537 Method of forming thin film and method of fabricating OLED
08/03/2006US20060172536 Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece
08/03/2006US20060172535 Etch process for improving yield of dielectric contacts on nickel silicides
08/03/2006US20060172534 Atomic layer deposition methods
08/03/2006US20060172533 Method of fabricating printed circuit board
08/03/2006US20060172532 Method of manufacturing a magnetic head
08/03/2006US20060172531 Sealing pores of low-k dielectrics using CxHy
08/03/2006US20060172530 CxHy sacrificial layer for cu/low-k interconnects
08/03/2006US20060172529 Uniform passivation method for conductive features
08/03/2006US20060172528 Methods of manufacturing semiconductor devices
08/03/2006US20060172527 Method for forming a defined recess in a damascene structure using a CMP process and a damascene structure
08/03/2006US20060172526 Method for preventing edge peeling defect
08/03/2006US20060172525 Technique for enhancing process flexibility during the formation of vias and trenches in low-k interlayer dielectrics
08/03/2006US20060172524 Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles