Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/19/2014CN103646900A Test method and test system for LED wafer
03/19/2014CN103646899A Wafer defect detection method
03/19/2014CN103646898A Method for detecting defects of wafer with the use of electron beam
03/19/2014CN103646897A Method for monitoring whisker defects in aluminum film process
03/19/2014CN103646896A Method for judging stability and matching performance of dry photoresist stripping process
03/19/2014CN103646895A A method for detecting the sensitivity of a defect scanning program
03/19/2014CN103646894A A defect scanning method based on deadly defect correction
03/19/2014CN103646893A A wafer defect detecting method
03/19/2014CN103646892A A method for monitoring an ion implantation angle
03/19/2014CN103646891A A wafer allocating method
03/19/2014CN103646890A A method for determining the stability and the compatibility of dry process technology
03/19/2014CN103646889A A method for detecting wafer defects
03/19/2014CN103646888A A wafer acceptance testing system and method
03/19/2014CN103646887A Defect?inspection?method?of?automatic?noise?reduction
03/19/2014CN103646886A A wafer working method for monitoring defect conditions of multi-cavity devices
03/19/2014CN103646885A A method for reducing errors in the observation of wafers by an electron microscope
03/19/2014CN103646884A Method for detecting metal-wire corrosion by production environment
03/19/2014CN103646883A An aluminum pad producing method
03/19/2014CN103646882A Eutectic bonding material-series structure used for wafer-level encapsulation
03/19/2014CN103646881A Wafer packaging method
03/19/2014CN103646880A Packaging technology based on board-level functional substrate and packaging structure
03/19/2014CN103646879A Manufacturing method of SiP packaging structure capable of being assembled and disassembled
03/19/2014CN103646878A Method for eliminating defects in lighting layer of film electric lighting device through electric field
03/19/2014CN103646877A A method for manufacturing a dual stress liner
03/19/2014CN103646876A SiC etching method of steep smooth side wall morphology
03/19/2014CN103646875A Silicon chip silicon dioxide edge removal method with low cost and high production capacity
03/19/2014CN103646874A Silicon dioxide SAB removing method
03/19/2014CN103646873A A method for removing photoresist
03/19/2014CN103646872A Photoresist removing apparatus
03/19/2014CN103646871A Method for improving uniformity of oxide layer on surface of amorphous silicon
03/19/2014CN103646870A Preparation method of film window
03/19/2014CN103646869A Wafer cleaning method
03/19/2014CN103646868A Method for preparing porous silicon by adopting hydrothermal-vapor etching
03/19/2014CN103646867A A method for improving a wafer peeling defect
03/19/2014CN103646866A A chemical-mechanical polishing apparatus and a chemical-mechanical polishing method
03/19/2014CN103646865A Method for preparing ultra-thin germanium oxide interface repairing layer on Ge substrate
03/19/2014CN103646864A Method for improving thickness uniformity of grid side wall spacing layer
03/19/2014CN103646863A Method for making polycrystalline silicon gate
03/19/2014CN103646862A A manufacturing method of a CMOS device gate oxide layer
03/19/2014CN103646861A A semiconductor manufacturing method for eliminating a furnace tube load effect
03/19/2014CN103646860A Polysilicon gate etching method
03/19/2014CN103646859A Manufacturing method of source-drain in flash memory
03/19/2014CN103646858A Method for using SiGeC buffer layer to grow GaN on Si substrate
03/19/2014CN103646857A Semiconductor structure and method of forming same
03/19/2014CN103646856A Method for improving strain-layer boundary defects
03/19/2014CN103646855A Manufacturing method of graphene device
03/19/2014CN103646854A Method for improving Cr mask based etching technology
03/19/2014CN103646853A Production method for thin film structure containing germanium on insulator
03/19/2014CN103646852A Manufacturing method of substrate
03/19/2014CN103646851A Polishing technology of reducing monocrystal silicon wafer scratches
03/19/2014CN103646850A Method for marking atomic force probe (AFP) sample by FIB to realize positioning
03/19/2014CN103646849A Novel process for reducing hillock-shaped defects produced on aluminum film
03/19/2014CN103646848A Methods and devices for fabricating and assembling printable semiconductor elements
03/19/2014CN103645602A Porection thin film set for photolithography
03/19/2014CN103645589A Display device, array substrate and manufacturing method of array substrate
03/19/2014CN103645381A Square resistance measuring device and sucker
03/19/2014CN103645197A Chip defect detection method
03/19/2014CN103642386A Product of polysiloxane condensation
03/19/2014CN103639886A Mechanical machine grinding device and method for W-CMP
03/19/2014CN103639155A Lead frame online plasma surface processing device
03/19/2014CN103011066B Chip
03/19/2014CN102712997B Divided sputtering target and method for producing same
03/19/2014CN102598208B Bonding method, bonding apparatus, and bonding system
03/19/2014CN102569145B Method for correcting wafer position during quick annealing treatment
03/19/2014CN102569049B Manufacture method of metal grid electrode
03/19/2014CN102543872B Method for manufacturing semiconductor device
03/19/2014CN102496602B Chip cutting method
03/19/2014CN102487035B Deposition method of ILD with ultra low k (ULK) and porous structure
03/19/2014CN102487029B Electrostatic chuck and plasma device therewith
03/19/2014CN102479695B Method for raising chemical mechanical planarization technology uniformity of metal gate
03/19/2014CN102456550B Double patterning technology using single-patterning-spacer-technique
03/19/2014CN102446702B Wet processing method and pull back method
03/19/2014CN102437064B Manufacturing method of silicon Nano-wire (SiNW)
03/19/2014CN102420250B Semiconductor device with super junction and manufacturing method of semiconductor device
03/19/2014CN102412174B Pollution control method and device in semiconductor chip manufacture
03/19/2014CN102403250B Pressure balance equipment of transmission module
03/19/2014CN102386125B Method for preparing semiconductor structure for detection by transmission electron microscope, and semiconductor structure
03/19/2014CN102386078B Method for manufacturing polycrystalline gate structure
03/19/2014CN102386051B Slice absorbing platform device
03/19/2014CN102376737B Integrated circuit embedded into MRAM(Magnetic Random Access Memory) and preparation method of integrated circuit
03/19/2014CN102376646B Method for improving surface morphology of dual-stress nitride
03/19/2014CN102376625B Semiconductor device and manufacturing method thereof
03/19/2014CN102365735B Interconnect structure for a semiconductor device with a resilient stress absorber and related method of manufacture
03/19/2014CN102362344B A transistor with an embedded strain inducing material having a gradually shaped configuration
03/19/2014CN102347280B Method for forming semiconductor device structure
03/19/2014CN102347262B Electronic component conveying device and mounting machine
03/19/2014CN102347207B System for plasma process
03/19/2014CN102339753B Tunneling transistor structure and manufacturing method thereof
03/19/2014CN102332424B Method for overcoming residue defect in shallow trench isolation (STI) process
03/19/2014CN102301453B Techniques for improving extracted ion beam quality using high transparency electrodes
03/19/2014CN102299090B Thimble and plasma etching device with thimble
03/19/2014CN102280451B Semiconductor device and manufacturing method thereof
03/19/2014CN102272917B Semiconductor integrated circuit
03/19/2014CN102263040B Method for encapsulating semiconductor electronic component
03/19/2014CN102246280B Carrier head membrane
03/19/2014CN102237277B Semiconductor device and method for forming same
03/19/2014CN102236179B Thin film transistor-liquid crystal display (TFT-LCD) array substrate and manufacturing method thereof
03/19/2014CN102224573B Method and apparatus for trench and via profile modification
03/19/2014CN102214691B Groove metal oxide semiconductor field effect tube (MOSFET) and manufacturing method thereof
03/19/2014CN102201369B Method for manufacturing complementary metal oxide semiconductor (CMOS) device with stress layer
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