Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/20/2014US20140077263 Semiconductor device and method for manufacturing same
03/20/2014US20140077254 Semiconductor device and method of manufacturing same
03/20/2014US20140077224 Pre-Cutting a Back Side of a Silicon Substrate for Growing Better III-V Group Compound Layer on a Front Side of the Substrate
03/20/2014US20140077223 Structure for growth of nitride semiconductor layer, stacked structure, nitride-based semiconductor element, light source, and manufacturing method for same
03/20/2014US20140077222 Gallium Nitride Devices with Aluminum Nitride Alloy Intermediate Layer
03/20/2014US20140077209 Evaluation pattern, method for manufacturing semiconductor device, and semiconductor wafer
03/20/2014US20140077151 Optoelectric device with semiconductor microwires or nanowires and method for manufacturing the same
03/20/2014US20140077147 Methods For Selective Etching Of A Multi-Layer Substrate
03/20/2014US20140076867 Beam shapers, annealing systems employing the same, methods of heat treating substrates and methods of fabricating semiconductor devices
03/20/2014US20140076849 Etching apparatus and etching method
03/20/2014US20140076774 Automated Wafer Container with Equipment Interface
03/20/2014US20140076773 Front opening unified pod having inlet and outlet
03/20/2014US20140076516 Heat treatment apparatus and heat treatment method
03/20/2014US20140076515 Substrate mounting table, substrate processing apparatus and temperature control method
03/20/2014US20140076494 Processing system
03/20/2014US20140076365 Cleaning composition and method for cleaning a semiconductor device substrate after chemical mechanical polishing
03/20/2014US20140076355 Treatment apparatus, method for manufacturing treatment liquid, and method for manufacturing electronic device
03/20/2014US20140076353 Plasma mediated ashing processes
03/20/2014US20140076234 Multi chamber processing system
03/20/2014US20140075774 Semiconductor apparatus with inner wafer carrier buffer and method
03/20/2014DE202012011948U1 LED-Modul mit Flächenverguß LED module with Flächenverguß
03/20/2014DE19544328B4 Poliervorrichtung Polishing apparatus
03/20/2014DE112012002871T5 Atomlagenabscheidung von dünnen Filmen an Übergangsmetall Atomic layer deposition of thin films of transition metal
03/20/2014DE112012002700T5 Verfahren und Struktur für niederohmige Source- und Drain-Bereiche in einem Prozessablauf mit Ersatz-Metall-Gate Method and structure for low impedance source and drain regions in a process flow with replacement metal gate
03/20/2014DE112012002648T5 Lokale Zwischenverbindung mit einem niedrigen Profil und Verfahren zum Herstellen derselben Local interconnect having a low profile and methods of making the same
03/20/2014DE112012002597T5 Verfahren zur Herstellung eines Siliciumcarbidsubstrats A method for producing a silicon carbide substrate
03/20/2014DE112012002275T5 SIC-Halbleitervorrichtung und Verfahren zu deren Herstellung SiC semiconductor device and process for their preparation
03/20/2014DE112012001626T5 Lichtempfangselement und Verfahren zum Herstellen desselben Of the same light receiving element and method of manufacturing
03/20/2014DE112010002791B4 SCHALTKREISSTRUKTUR UND VERFAHREN ZUM PROGRAMMIEREN UNDUMPROGRAMMIEREN EINER ELEKTRONISCHEN SICHERUNG (eFUSE) FÜRGERINGE LEISTUNG UND MIT MEHREREN ZUSTÄNDEN CIRCUIT STRUCTURE AND METHOD FOR PROGRAMMING UNDUMPROGRAMMIEREN AN ELECTRONIC CONTROL (eFUSE) FÜRGERINGE PERFORMANCE AND MULTIPLE STATES
03/20/2014DE102013217850A1 Siliziumcarbid-Halbleitervorrichtung Silicon carbide semiconductor device
03/20/2014DE102013217808A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
03/20/2014DE102013216011A1 Halbleitervorrichtung Semiconductor device
03/20/2014DE102013110218A1 Kristallanalysevorrichtung, zusammengesetzte ladungsträger-vorrichtung und kristallanalysenverfahren Crystal analyzer, composite charge carrier-device and crystal analysis techniques
03/20/2014DE102013109654A1 Feldeffekt-Halbleiterbauelement und Verfahren zu seiner Herstellung Field-effect semiconductor device and process for its preparation
03/20/2014DE102013109095A1 Halbleitergehäusevorrichtung mit passiven energiebauteilen Semiconductor package device with passive energy ponents
03/20/2014DE102013105400A1 Bump structure e.g. ladder-bump structure, for bump-on-trace assembly, has copper pillar provided on metallurgy structure and including tapering arc-shaped profile, and metal cap mounted on pillar, where solder structure is mounted on cap
03/20/2014DE102013104232A1 Solarzelle Solar cell
03/20/2014DE102013103206A1 Durchkontaktierungsstruktur sowie Verfahren Via structure and processes
03/20/2014DE102013015724A1 Chiprandversiegelung Chip edge seal
03/20/2014DE102012216740A1 Silicon solar cell of photovoltaic module, has cleavage plane which is intersected into cutting line for dividing output solar cell, which is formed in surface of silicon wafer and is arranged parallel to outer edges of silicon wafer
03/20/2014DE102012216552A1 LED lighting device manufacturing method, involves covering LED chip with converter layer, filling matrix material in converter layer, roughening surface of LED chip, and applying adhesion promoter on surface of LED chip
03/20/2014DE102012216493A1 Mikromechanische Sensorvorrichtung mit beweglichem Gate und entsprechendes Herstellungsverfahren Micromechanical sensor device with movable gate and method of manufacture
03/20/2014DE102012216389A1 Power electronics module of power electronic system, has electrically conductive layers that are connected by short-circuit branch, and short-circuit branch that is separated by separating element for activation of electronics module
03/20/2014DE102012111698A1 Method for processing e.g. crystalline silicon wafer, involves reducing heat produced from laser beam in edge area of wafer, providing edge area with wafer edge, and placing laser beam and wafer in wafer edge according to laser trench
03/20/2014DE102008030854B4 MOS-Transistoren mit abgesenkten Drain- und Source-Bereichen und nicht-konformen Metallsilizidgebieten und Verfahren zum Herstellen der Transistoren MOS transistors with lowered drain and source regions and non-conformal metal silicide and method of manufacturing the transistors
03/20/2014DE102006062829B4 Verfahren zur Herstellung einer Halbleiteranordnung A process for producing a semiconductor device
03/20/2014DE102006035073B4 Halbleiterbauelement mit einem Dünnfilmtransistor und CMOS-Transistoren, Verfahren zur Herstellung eines solchen Bauelements sowie Verwendung eines solchen Bauelements A semiconductor device comprising a thin film transistor and CMOS transistors, methods of making such a component, as well as use of such a device
03/20/2014DE102006017101B4 Leiterplatte und elektrisches Gerät PCB and electrical equipment
03/20/2014DE102006015076B4 Halbleiterbauelement mit SOI-Transistoren und Vollsubstrattransistoren und ein Verfahren zur Herstellung A semiconductor device with SOI transistors, and bulk transistors and a process for preparing
03/19/2014EP2709173A1 Semiconductor substrate, semiconductor device, and manufacturing methods thereof
03/19/2014EP2709157A2 Heterostructure transistor with multiple gate dielectric layers
03/19/2014EP2709151A1 Electronic assembly with a three-dimensional injection-moulded electronic circuit carrier
03/19/2014EP2709148A1 Semiconductor device and manufacturing method thereof
03/19/2014EP2709147A1 Poly -amino acid and ferroelectric memory element using same
03/19/2014EP2709146A2 Integrated tool for semiconductor manufacturing
03/19/2014EP2709145A2 Inline metrology for attaining full wafer map of uniformity and surface charge
03/19/2014EP2709144A2 Matrix lid heatspreader for flip chip package
03/19/2014EP2709143A1 Moulding method for manufacturing an electronic package
03/19/2014EP2709142A1 Method for forming deep-channel super-pn junction
03/19/2014EP2709141A2 Method and apparatus for forming a graphene pattern using a delamination technique
03/19/2014EP2709140A1 Method for producing laminated substrate having insulating layer at portion of substrate
03/19/2014EP2709138A1 Chamber for physical vapor deposition
03/19/2014EP2708943A1 Array Substrate and Manufacturing Method Thereof
03/19/2014EP2707930A1 Semiconductor wafer bonding incorporating electrical and optical interconnects
03/19/2014EP2707899A1 Bonded wafer structures
03/19/2014EP2707896A1 Heat treatment by injection of a heat-transfer gas
03/19/2014EP2707895A1 Heat shield module for substrate-like metrology device
03/19/2014CN203491285U Splitting device used for solar battery
03/19/2014CN203491243U Horizontal movement driving structure for material connecting lead wire
03/19/2014CN203491242U Wafer removing disc
03/19/2014CN203491241U Electrostatic adsorption bearing disc
03/19/2014CN203491240U LED electrode support adsorption and feeding device
03/19/2014CN203491239U Device for transferring silicon chips between chip boxes
03/19/2014CN203491238U Discharging device for wafer pin electroplating system
03/19/2014CN203491237U Longitudinal movement driving structure for material connecting lead wire
03/19/2014CN203491236U Feeding device for printing ink marking processing of glass encapsulated diode
03/19/2014CN203491235U Lead wire feeding structure of wafer cutting device
03/19/2014CN203491234U Automatic chip-fetching device for die bonder
03/19/2014CN203491233U Automatic discharging and feeding device for die bonder
03/19/2014CN203491232U Graphit boat
03/19/2014CN203491231U Lead wire finished product collecting device
03/19/2014CN203491230U Distance lengthening device for stripping of high power LED and patch
03/19/2014CN203491229U Automatic feeding pin-split molding K-groove forming machine of diode
03/19/2014CN203491228U Wafer assembling system
03/19/2014CN203491227U Printing ink marking processing device for glass encapsulated diode
03/19/2014CN203491226U Device for wetly and chemically processing one surface of flat substrate
03/19/2014CN203491225U Pressing fork device of direct-insertion support die fonder
03/19/2014CN203491224U High-efficiency multi-level test device
03/19/2014CN203491223U Translation drive unit for wafer lead wire finished products
03/19/2014CN203491222U Lead wire lifting-up device of lead wire heating and dotting system
03/19/2014CN203491221U Recovery system for diode/triode appearance defective products
03/19/2014CN203490503U Detection and marking apparatus for glass encapsulated diode
03/19/2014CN203490178U Diode/triode appearance inspecting and packaging device
03/19/2014CN203486938U Acid tank cleaning device
03/19/2014CN203486513U Energy-consumption-saving glass package diode material conveying device
03/19/2014CN203484819U Die bonder welding head
03/19/2014CN103650645A Power supply apparatus for generating plasma, method for setting parameter for generating plasma
03/19/2014CN103650357A Wireless apparatus and method for manufacturing same
03/19/2014CN103650335A Piezoelectric device
03/19/2014CN103650266A Semiconductor wafer bonding incorporating electrical and optical interconnects
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