Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2014
03/20/2014US20140080291 Method for producing a graphene nano-ribbon
03/20/2014US20140080290 Method of selective growth without catalyst on a semiconducting structure
03/20/2014US20140080289 Method of forming gettering layer
03/20/2014US20140080288 Laser processing method
03/20/2014US20140080287 Method for singulating a component composite assembly
03/20/2014US20140080286 Method for producing a semiconductor body
03/20/2014US20140080285 Method and apparatus for forming shallow trench isolation structures having rounded corners
03/20/2014US20140080284 High Temperature ALD Process of Metal Oxide for DRAM Applications
03/20/2014US20140080283 Interfacial materials for use in semiconductor structures and related methods
03/20/2014US20140080282 Leakage reduction in DRAM MIM capacitors
03/20/2014US20140080281 Method of Fabricating Isolated Capacitors and Structure Thereof
03/20/2014US20140080275 Multigate FinFETs with Epitaxially-Grown Merged Source/Drains
03/20/2014US20140080274 Method of forming channel layer of electric device and method of manufacturing electric device using the same
03/20/2014US20140080269 Fabricating photonics devices fully integrated into a cmos manufacturing process
03/20/2014US20140080268 Fabricating photonics devices fully integrated into a cmos manufacturing process
03/20/2014US20140080267 Method of making a thin film transistor device
03/20/2014US20140080266 Semiconductor package and method of manufacturing the same
03/20/2014US20140080265 Fabrication method of carrier-free semiconductor package
03/20/2014US20140080264 Method for fabricating leadframe-based semiconductor package
03/20/2014US20140080263 Semiconductor Packaging Method Using Connecting Plate for Internal Connection
03/20/2014US20140080260 Method of manufacturing semiconductor device
03/20/2014US20140080259 Manufacturing method for layered chip packages
03/20/2014US20140080253 Manufacturing method of semiconductor device
03/20/2014US20140080249 Heat treatment by injection of a heat-transfer gas
03/20/2014US20140080247 Method of producing semiconductor epitaxial wafer, semiconductor epitaxial wafer, and method of producing solid-state image sensing device
03/20/2014US20140080238 Liquid crystal display device and method for manufacturing the same, and liquid crystal television receiver
03/20/2014US20140080233 Combinatorial optimization of interlayer parameters
03/20/2014US20140080232 Peak-based endpointing for chemical mechanical polishing
03/20/2014US20140080231 Method for manufacturing light emitting elements and device for manufacturing light emitting elements
03/20/2014US20140080230 Apparatus and method for evaluating optical properties of led and method for manufacturing led device
03/20/2014US20140080229 Adaptive semiconductor processing using feedback from measurement devices
03/20/2014US20140080068 Method of forming patterns
03/20/2014US20140079946 Laminated structure, member for semiconductor manufacturing apparatus, and method for producing laminated structure
03/20/2014US20140079526 Spacer, spacer transferring method, processing method and processing apparatus
03/20/2014US20140079514 Load lock chamber designs for high-throughput processing system
03/20/2014US20140079376 Thermal reactor with improved gas flow distribution
03/20/2014US20140078832 Non-volatile memory having discrete isolation structure and sonos memory cell, method of operating the same, and method of manufacturing the same
03/20/2014US20140078826 Methods of Making Word Lines and Select Lines in NAND Flash Memory
03/20/2014US20140078817 Integrated circuits with sram cells having additional read stacks and methods for their fabrication
03/20/2014US20140078497 Apparatus for inspecting film
03/20/2014US20140078495 Inline metrology for attaining full wafer map of uniformity and surface charge
03/20/2014US20140077667 Wafer handling station including cassette members with lateral wafer confining brackets and associated methods
03/20/2014US20140077431 System and Method for 2D Workpiece Alignment
03/20/2014US20140077394 Wafer Level Embedded Heat Spreader
03/20/2014US20140077392 Semiconductor device and method for fabricating the same
03/20/2014US20140077389 Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
03/20/2014US20140077388 Semiconductor device and method of manufacturing the same
03/20/2014US20140077387 Semiconductor package and fabrication method thereof
03/20/2014US20140077386 3D IC and 3D CIS Structure
03/20/2014US20140077384 Bit cell with triple patterned metal layer structures
03/20/2014US20140077383 Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop
03/20/2014US20140077381 Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants
03/20/2014US20140077380 Bit cell with double patterned metal layer structures
03/20/2014US20140077379 Semiconductor structure and method for making same
03/20/2014US20140077377 Semiconductor device and manufacturing method of semiconductor device
03/20/2014US20140077376 Semiconductor chip, method for producing a semiconductor chip and method for soldering a semiconductor chip to a carrier
03/20/2014US20140077374 Through Via Structure and Method
03/20/2014US20140077372 Semiconductor device and method for manufacturing the same
03/20/2014US20140077370 Semiconductor device and method for manufacturing the same
03/20/2014US20140077369 Packaging Devices and Methods
03/20/2014US20140077366 Wafer Level Fan-Out Package With a Fiducial Die
03/20/2014US20140077365 Metal Bump and Method of Manufacturing Same
03/20/2014US20140077364 Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP
03/20/2014US20140077363 Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in Fo-WLCSP
03/20/2014US20140077362 Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP
03/20/2014US20140077361 Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over Carrier for Testing at Interim Stages
03/20/2014US20140077359 Ladder Bump Structures and Methods of Making Same
03/20/2014US20140077357 Circuit substrate and process for fabricating the same
03/20/2014US20140077355 Three-dimensional semiconductor package device having enhanced security
03/20/2014US20140077352 Matrix Lid Heatspreader for Flip Chip Package
03/20/2014US20140077351 Microelectronic packages with nanoparticle joining
03/20/2014US20140077350 Semiconductor device, method for manufacturing semiconductor device, and electronic device
03/20/2014US20140077349 Thermally Enhanced Package with Lid Heat Spreader
03/20/2014US20140077347 Semiconductor device and method for manufacturing thereof
03/20/2014US20140077346 Method and system for pre-migration of metal ions in a semiconductor package
03/20/2014US20140077345 Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package
03/20/2014US20140077343 Dummy wafer structure and method of forming the same
03/20/2014US20140077340 Device substrate and fabrication method thereof
03/20/2014US20140077339 DELTA DOPING AT Si-Ge INTERFACE
03/20/2014US20140077338 Si-Ge-Sn ON REO TEMPLATE
03/20/2014US20140077335 Semiconductor device having a fuse element
03/20/2014US20140077334 Electronic Fuse Vias in Interconnect Structures
03/20/2014US20140077333 Semiconductor devices using air spaces to separate conductive structures and methods of manufacturing the same
03/20/2014US20140077320 Scribe Lines in Wafers
03/20/2014US20140077318 Storage Element for STT MRAM Applications
03/20/2014US20140077317 Microelectromechanical system (mems) device and fabrication method thereof
03/20/2014US20140077315 Electronic sensor apparatus for detecting chemical or biological species, microfluidic apparatus comprising such a sensor apparatus, and method for producing the sensor apparatus and method for producing the microfluidic apparatus
03/20/2014US20140077313 Transistor device and fabrication method
03/20/2014US20140077312 Electronic devices and systems, and methods for making and using the same
03/20/2014US20140077310 Method of manufacturing semiconductor device and semiconductor device
03/20/2014US20140077305 Gate contact structure over active gate and method to fabricate same
03/20/2014US20140077304 Airgap structure and method of manufacturing thereof
03/20/2014US20140077296 Method and structure for finfet with finely controlled device width
03/20/2014US20140077290 Trench metal oxide semiconductor field effect transistor with embedded schottky rectifier using reduced masks process
03/20/2014US20140077289 Semiconductor device having super junction structure and method for manufacturing the same
03/20/2014US20140077279 Semiconductor device and manufacturing method therefor
03/20/2014US20140077276 Middle-of-line borderless contact structure and method of forming
03/20/2014US20140077275 Semiconductor Device and Method With Greater Epitaxial Growth on 110 Crystal Plane
03/20/2014US20140077274 Integrated circuits with improved gate uniformity and methods for fabricating same
03/20/2014US20140077268 Distributed Heating Transistor Devices Providing Reduced Self-Heating
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