H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2006
11/09/2006	US20060252195 Fabrication of local interconnect lines
11/09/2006	US20060252194 Composite stress spacer
11/09/2006	US20060252193 Method of forming polysilicon layers in a transistor
11/09/2006	US20060252192 Semiconductor device and method for fabricating the same
11/09/2006	US20060252191 Methodology for deposition of doped SEG for raised source/drain regions
11/09/2006	US20060252190 Method of manufacturing spacer
11/09/2006	US20060252189 Method and apparatus for crystallizing semiconductor with laser beams
11/09/2006	US20060252188 Semiconductor device and fabrication method
11/09/2006	US20060252187 Method of forming a pseudo SOI substrate and semiconductor devices
11/09/2006	US20060252186 Method of manufacturing semiconductor device having conductive thin films
11/09/2006	US20060252185 Inkjet printing system and driving method thereof
11/09/2006	US20060252184 Semiconductor integrated circuit and electronic equipment
11/09/2006	US20060252183 Semiconductor device and method for the fabrication thereof
11/09/2006	US20060252182 Method and apparatus for creating RFID devices
11/09/2006	US20060252181 Method of forming a stack of packaged memory dice
11/09/2006	US20060252180 Method for a low profile multi-IC chip package connector
11/09/2006	US20060252179 Integrated circuit packaging structure and method of making the same
11/09/2006	US20060252178 Method of fabricating wafer level package
11/09/2006	US20060252177 Semiconductor package with selective underfill and fabrication method therfor
11/09/2006	US20060252176 Memory element and its method of formation
11/09/2006	US20060252175 Solid-state imaging device and method of manufacturing said solid-state imaging device
11/09/2006	US20060252174 Solid-state imaging device and method of manufacturing said solid-state imaging device
11/09/2006	US20060252173 Method for manufacturing photoelectric package having control chip
11/09/2006	US20060252172 Method of fabricating semiconductor probe with resistive tip
11/09/2006	US20060252171 Method of manufacturing silicon optoelectronic device, silicon optoelectronic device manufactured by the method, and image input and/or output apparatus using the silicon optoelectronic device
11/09/2006	US20060252170 Optical wavelength switch having planar lightwave circuit structure
11/09/2006	US20060252169 Transparent member, optical device using transparent member and method of manufacturing optical device
11/09/2006	US20060252168 Thin film transistor array panel for display and manufacturing method thereof
11/09/2006	US20060252167 Silicon optical package with 45 degree turning mirror
11/09/2006	US20060252166 Nitride semiconductor thin film and method for growing the same
11/09/2006	US20060252165 Electrode structure, semiconductor light-emitting device having the same and method of manufacturing the same
11/09/2006	US20060252164 Process for producing gan substrate
11/09/2006	US20060252163 Peelable photoresist for carbon nanotube cathode
11/09/2006	US20060252162 Method and apparatus for electronically aligning capacitively coupled mini-bars
11/09/2006	US20060252161 Ferroelectric polymer memory structure and method therefor
11/09/2006	US20060252160 Electron beam exposure device and exposure method
11/09/2006	US20060252044 Biochip and biochip kit, and method of producing the same and method of using the same
11/09/2006	US20060251972 Flexible photomask for photolithography, method of manufacturing the same, and micropatterning method using the same
11/09/2006	US20060251971 Photo-Mask with variable transmission by ion implantation
11/09/2006	US20060251907 Surface protection film and method for producing the same
11/09/2006	US20060251871 laminating a porous film made of polytetrafluoroethylene with elasticity suitable for elastic recovery and used as a base film, adhering conductive metal by electroless plating at plural positions of the base film; use in the burn-in test of semiconductor devices
11/09/2006	US20060251856 For dissipation of heat generated in electronic devices
11/09/2006	US20060251828 Plasma film-forming method and plasma film-forming apparatus
11/09/2006	US20060251825 Low dielectric constant insulating film and method of forming the same
11/09/2006	US20060251812 Methods for forming atomic layers and thin films including a tantalum amine derivative and devices including the same
11/09/2006	US20060251809 Method of manufacturing mask blank
11/09/2006	US20060251564 Carbon nanomaterial purification method
11/09/2006	US20060251499 Linear substrate delivery system with intermediate carousel
11/09/2006	US20060251391 Optical disc, recording apparatus, and computer-readable recording medium
11/09/2006	US20060251355 Photoelectric chip array package structure
11/09/2006	US20060250876 Semiconductor device
11/09/2006	US20060250849 Semiconductor integrated circuit device
11/09/2006	US20060250749 Layer capacitor element and production process as well as electronic device
11/09/2006	US20060250748 Integrated capacitor assembly
11/09/2006	US20060250607 Optical property measuring apparatus and optical property measuring method, exposure apparatus and exposure method , and device manufacturing method
11/09/2006	US20060250602 Substrate carrying apparatus, exposure apparatus, and device manufacturing method
11/09/2006	US20060250600 Illumination apparatus, exposure apparatus and device manufacturing method
11/09/2006	US20060250599 Lithographic projection apparatus, reflector assembly for use therein, and device manufacturing method
11/09/2006	US20060250593 Exposure apparatus and device fabricating method
11/09/2006	US20060250558 Transistor-controlled display devices
11/09/2006	US20060250333 Active matrix substrate, electro-optical device, and electronic device
11/09/2006	US20060250139 Bond pad structure comprising multiple bond pads with metal overlap
11/09/2006	US20060249965 Gripper and method for operating the same
11/09/2006	US20060249873 Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
11/09/2006	US20060249863 Prism manufacturing method
11/09/2006	US20060249858 Stencil and method for depositing material onto a substrate
11/09/2006	US20060249857 Microelectronic packages and methods therefor
11/09/2006	US20060249856 Bumpless semiconductor device
11/09/2006	US20060249855 Method and apparatus for soldering modules to substrates
11/09/2006	US20060249853 Semiconductor device and method of manufacturing the same
11/09/2006	US20060249847 Substrate with bonding metallization
11/09/2006	US20060249845 Semiconductor device and manufacturing method of the same
11/09/2006	US20060249843 Semiconductor device, circuit board, and electronic instrument
11/09/2006	US20060249841 Small scale wires with microelectromechanical devices
11/09/2006	US20060249833 Wiring board, multilayer wiring board, and method for manufacturing the same
11/09/2006	US20060249832 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/09/2006	US20060249818 Compositions for preparing low dielectric materials
11/09/2006	US20060249816 Dual pulsed beam laser micromachining method
11/09/2006	US20060249814 Transistor structure with minimized parasitics and method of fabricating the same
11/09/2006	US20060249812 Capacitor cell, semiconductor device and process for manufacturing the same
11/09/2006	US20060249811 Composition for thin film capacitance element, insulating film of high dielectric constant, thin film capacitance element, thin film laminated capacitor and method for manufacturing thin film capacitance element
11/09/2006	US20060249807 Dielectric isolation type semiconductor device and manufacturing method therefor
11/09/2006	US20060249806 Semiconductor device
11/09/2006	US20060249802 Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method
11/09/2006	US20060249800 Semiconductor device and method of manufacturing the same
11/09/2006	US20060249799 Concurrent fin-fet and thick body device fabrication
11/09/2006	US20060249797 Semiconductor device and manufacturing method thereof
11/09/2006	US20060249794 Method to remove spacer after salicidation to enhance contact etch stop liner stress on MOS
11/09/2006	US20060249790 Method for fabricating SiGe-on-insulator (SGOI) and Ge-on-inulator (GOI) substrates
11/09/2006	US20060249788 High voltage power MOSFET having low on-resistance
11/09/2006	US20060249786 Alignment of trench for MOS
11/09/2006	US20060249785 Power MOSFET device structure for high frequency applications
11/09/2006	US20060249783 Ultrascalable vertical MOS transistor with planar contacts
11/09/2006	US20060249781 Non-Volatile Semiconductor Memory Device
11/09/2006	US20060249780 Non-Volatile Semiconductor Memory Device
11/09/2006	US20060249778 Constructions comprising hafnium oxide
11/09/2006	US20060249777 Device, system, and method for a trench capacitor having micro-roughened semiconductor surfaces
11/09/2006	US20060249776 Memory cell, device, system and method for forming same
11/09/2006	US20060249771 Non-volatile semiconductor memory and method of manufacturing the same
11/09/2006	US20060249770 Single Transistor Floating-Body DRAM Devices Having Vertical Channel Transistor Structures and Methods of Fabricating the Same

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