H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2006
11/09/2006	US20060249768 Semiconductor device and method of manufacturing the same
11/09/2006	US20060249761 Semiconductor material for electronic device and semiconductor element using same
11/09/2006	US20060249760 High-voltage transistor of semiconductor device and method of forming the same
11/09/2006	US20060249759 Buried guard ring and radiation hardened isolation structures and fabrication methods
11/09/2006	US20060249756 Method of manufacturing semiconductor device having trench isolation
11/09/2006	US20060249755 Method to prevent arcing during deep via plasma etching
11/09/2006	US20060249753 High-density nonvolatile memory array fabricated at low temperature comprising semiconductor diodes
11/09/2006	US20060249750 Gallium nitride material devices including an electrode-defining layer and methods of forming the same
11/09/2006	US20060249749 Electronic device
11/09/2006	US20060249738 Surface-emitting semiconductor laser comprising a structured waveguide
11/09/2006	US20060249735 TFT mask ROM and method for making same
11/09/2006	US20060249734 Image display device and method of manufacturing the same
11/09/2006	US20060249733 Semiconductor device and method for fabricating the same
11/09/2006	US20060249730 Semiconductor device and its manufacturing method
11/09/2006	US20060249729 Methods of and apparatuses for measuring electrical parameters of a plasma process
11/09/2006	US20060249723 Planarization process for semiconductor substrates
11/09/2006	US20060249713 Compositions for preparing low dielectric materials
11/09/2006	US20060249701 Methods and apparatus for sealing an opening of a processing chamber
11/09/2006	US20060249697 Method, apparatus and system for specimen fabrication by using an ion beam
11/09/2006	US20060249693 Lithographic apparatus, device manufacturing method, and device manufactured thereby
11/09/2006	US20060249676 Apparatus and method for wafer pattern inspection
11/09/2006	US20060249495 Methods for preparing ball grid array substrates via use of a laser
11/09/2006	US20060249494 Methods for preparing ball grid array substrates via use of a laser
11/09/2006	US20060249493 Methods for preparing ball grid array substrates via use of a laser
11/09/2006	US20060249492 Methods for preparing ball grid array substrates via use of a laser
11/09/2006	US20060249482 Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using same
11/09/2006	US20060249481 Plasma processing method
11/09/2006	US20060249480 Laser machining using an active assist gas
11/09/2006	US20060249254 Plasma processing apparatus and plasma processing method
11/09/2006	US20060249253 Manifold assembly for feeding reactive precursors to substrate processing chambers
11/09/2006	US20060249252 Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
11/09/2006	US20060249229 Metal layer forming methods and capacitor electrode forming methods
11/09/2006	US20060249175 High efficiency UV curing system
11/09/2006	US20060249134 Multi-wire saw
11/09/2006	US20060249070 Processes of forming small diameter rods and tubes
11/09/2006	US20060248977 Supporting unit, and moving table device and linear-motion guiding device using the supporting unit
11/09/2006	US20060248919 Refrigerant supply apparatus
11/09/2006	US20060248804 Abrasive, method of polishing target member and process for producing semiconductor device
11/09/2006	US20060248716 Self-supporting contacting structures that are directly produced on components without housings
11/09/2006	US20060248715 Manufacturing method of solid-state image sensing device
11/09/2006	US20060248696 Working method of metal material and semiconductor apparatus fabricated by the method
11/09/2006	US20060248692 Bare die tray clip
11/09/2006	DE4407248B4 EEPROM-Flash-Speicherzelle und Verfahren zum Bilden einer EEPROM-Flash-Speicherzelle EEPROM flash memory cell and method for forming an EEPROM flash memory cell
11/09/2006	DE19823035B4 Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit Isolationsgräben A process for producing an integrated circuit arrangement with isolation trenches
11/09/2006	DE112004002611T5 Amorpher Ätzstopp zum anisotropen Ätzen von Substraten Amorphous etch stop for the anisotropic etching of substrates
11/09/2006	DE112004002277T5 Anlage zur raschen thermischen Bearbeitung Facility for rapid thermal processing
11/09/2006	DE10249193B4 Verfahren zur Reparatur einer Phasenschiebemaske und mit Hilfe dieses Verfahrens reparierte Phasenschiebemaske A method of repairing a phase shifting mask and using this method repaired phase shift mask
11/09/2006	DE10241990B4 Verfahren zur Strukturierung von Schichten auf Halbleiterbauelementen A process for patterning layers on semiconductor devices
11/09/2006	DE10234464B4 Verfahren zum Erzeugen von Daten für die Maskenlithographie A method for generating data for the mask lithography
11/09/2006	DE10225860B4 Halbleiterbauteil Semiconductor device
11/09/2006	DE102005062915A1 Planarisierung zur Kompensation von Film-unebenheiten nach STI-Oxid-Prozess Planarization to compensate for uneven film after STI-oxide process
11/09/2006	DE102005058680A9 TFT-Array-Substrat und Herstellungsverfahren TFT array substrate manufacturing process and
11/09/2006	DE102005050637A1 Surface mountable semiconductor module has plastic housing having area in which ball sections of solder balls protrude out of socket contact surface
11/09/2006	DE102005021324A1 Silicon wafers bonding method for production of pressure sensor, involves carrying out in situ-reaction of oxygen in cavities with silicon of walls under formation of silicon dioxide during annealing step
11/09/2006	DE102005020850A1 Sealing ring for electrochemical cell has light passage opening whose conical shape extends from base to end of sealing rim in straight line
11/09/2006	DE102005020453A1 Flachleiterstruktur für ein Halbleiterbauteil und Verfahren zur Herstellung derselben Flat conductor structure for a semiconductor device and method of manufacturing the same
11/09/2006	DE102005020427A1 Producing integrated component for large number of different sizes of microchips, involves ejecting carrier strip with protective layer from cavity or cavities by exerting force on protective layer surface facing cavity using ejector(s)
11/09/2006	DE102005020133A1 Technik zur Herstellung einer Kontaktisolationsschicht mit verbesserter Spannungsübertragungseffizienz Technique for manufacturing a contact insulation layer having improved stress transfer efficiency
11/09/2006	DE102005020132A1 Technik zur Herstellung selbstjustierter Durchführungen in einer Metallisierungsschicht Technology for the production of self-aligned penetrations in a metallization layer
11/09/2006	DE102005020091A1 Integrated semiconductor component e.g. thyristor, arrangement, has passivation layer area turned away from surface area of material area and formed with covering layer that is chemically inert and corrode-resistant against oxygen radicals
11/09/2006	DE102005020087A1 Even surface area producing method for e.g. semiconductor chip, involves evenly pressing surface by action of die or roller on surface of carrier for semiconductor device, and using steel plate as base for carrier
11/09/2006	DE102005020075A1 Manufacturing method for ditch structure semiconductor device involves forming neighboring ditch structures simultaneously in common process block
11/09/2006	DE102005020058A1 Halbleiterbauelement mit einem Gatedielektrikum mit unterschiedlichen Blockiereigenschaften A semiconductor device having a gate dielectric with different blocking properties
11/09/2006	DE102005019574A1 Contact arrangement for semiconductor component e.g. integrated circuit (IC) has reinforcement layer formed on contact surface and protrudes above insulating layer
11/09/2006	DE102005019330A1 Transportsystem für ein scheibenförmiges Objekt und System zur Inspektion eines scheibenförmigen Objekts Transport system for a disc-shaped object and system for inspecting a disk-shaped object
11/09/2006	DE102004058133B4 Verfahren zum Überwachen eines CMP-Polierverfahrens und Anordnung zur Durchführung eines CMP-Polierverfahrens A method for monitoring a CMP polishing method and arrangement for performing a CMP polishing method
11/09/2006	DE102004029012B4 Verfahren zur Inspektion eines Wafers Method for inspecting a wafer
11/09/2006	DE10148042B4 Elektronisches Bauteil mit einem Kunststoffgehäuse und Komponenten eines höhenstrukturierten metallischen Systemträgers und Verfahren zu deren Herstellung An electronic part having a plastic housing and components of a height-structured metallic leadframe and method for their preparation
11/09/2006	DE10146499B4 Verfahren zur Optimierung der Abbildungseigenschaften von mindestens zwei optischen Elementen sowie Verfahren zur Optimierung der Abbildungseigenschaften von mindestens drei optischen Elementen Method for optimizing imaging properties of at least two of the optical elements as well as methods for optimizing imaging properties of at least three optical elements
11/09/2006	DE10129289B4 Halbleitervorrichtung mit einer Diode für eine Eingangsschutzschaltung einer MOS-Vorrichtung und Verfahren zu deren Herstellung A semiconductor device comprising a diode for input protection circuit of a MOS device and process for their preparation
11/09/2006	CA2673326A1 Method of making scratch resistant coated glass article including layer(s) resistant to fluoride-based etchant(s)
11/08/2006	EP1720381A1 Organic el panel
11/08/2006	EP1720205A2 Trench transistor DRAM cell array and method of making the same
11/08/2006	EP1720204A1 Transient liquid phase eutectic bonding
11/08/2006	EP1720203A2 Multilayer ceramic substrate and production method thereof
11/08/2006	EP1720202A1 Semiconductor device manufacturing method and insulating film etching method
11/08/2006	EP1720201A1 Semiconductor device
11/08/2006	EP1720200A1 Epitaxially growing equipment
11/08/2006	EP1720199A1 Optical system, exposure system, and exposure method
11/08/2006	EP1720198A2 Integrated circuit having at least a capacitor and manufacturing method of the capacitor
11/08/2006	EP1720197A1 Plasma processing apparatus and performance validation system therefore
11/08/2006	EP1720194A1 Projection electron microscope, electron microscope, specimen surface observing method, and micro device producing method
11/08/2006	EP1720121A2 RFID and antenna webs and methods of making same
11/08/2006	EP1720070A2 Pellicle frame with heightened bonding surfaces
11/08/2006	EP1720067A1 Top coat composition
11/08/2006	EP1720066A2 Process for producing an image using a first minimum bottom antireflective coating composition
11/08/2006	EP1720063A1 Resin containing ketene-aldehyde copolymer
11/08/2006	EP1720061A2 Embedded etch stop for phase shift masks and planar phase shift masks to reduce topography induced and wave guide effects
11/08/2006	EP1720047A1 Polarization conversion element, lighting optical device, exposure system, and exposure method
11/08/2006	EP1719823A1 Ion implantation system and ion implantation system
11/08/2006	EP1719804A1 Resin composition for ghz-band electronic component and ghz-band electronic component
11/08/2006	EP1719793A1 Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the same
11/08/2006	EP1719749A1 Polyacene compound and organic semiconductor thin film
11/08/2006	EP1719744A1 Non oxide ceramic having oxide layer on the surface thereof, method for production thereof and use thereof
11/08/2006	EP1719614A2 Aerogel substrate and process for producing the same
11/08/2006	EP1719184A2 High voltage pmos transistor
11/08/2006	EP1719183A2 Ldmos transistor and method of making the same
11/08/2006	EP1719181A1 Gradient deposition of low-k cvd materials
11/08/2006	EP1719173A1 Microelectronic interconnect device comprising localised conductive pins
11/08/2006	EP1719172A1 System comprising an electrical component and an electrical connecting lead for said component, and method for the production of said system

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