H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2006
11/16/2006	US20060256309 Lithographic apparatus and device manufacturing method
11/16/2006	US20060256273 Electro-optical device and method for manufacturing the same
11/16/2006	US20060256251 Polycrystalline liquid crystal display device and method of fabricating the same
11/16/2006	US20060256059 Integrated displays using nanowire transistors
11/16/2006	US20060256052 Semiconductor device and liquid crystal panel driver device
11/16/2006	US20060256047 Transistor circuit, display panel and electronic apparatus
11/16/2006	US20060256046 Light Emitting Device, Method of Driving a Light Emitting Device, Element Substrate, and Electronic Equipment
11/16/2006	US20060255901 Production of microelectromechanical systems (mems) using the high-temperature silicon fusion bonding of wafers
11/16/2006	US20060255842 Semiconductor integrated circuit controlling output impedance and slew rate
11/16/2006	US20060255823 Semiconductor device, method for testing the same and IC card
11/16/2006	US20060255481 Growing a desired portion of the nanowire, growing a sacrificial portion of the nanowire that is doped differently than the desired portion, differentially removing the sacrificial portion, and removing a growth stub from the desired portion, especially by etching
11/16/2006	US20060255478 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
11/16/2006	US20060255474 Packaging structure and method
11/16/2006	US20060255473 Flip chip interconnect solder mask
11/16/2006	US20060255472 Semiconductor device
11/16/2006	US20060255471 Flip chip package having protective cap and method of fabricating the same
11/16/2006	US20060255470 ZrAlxOy DIELECTRIC LAYERS
11/16/2006	US20060255469 Semiconductor device and method of fabricating the same
11/16/2006	US20060255466 Carbon containing silicon oxide film having high ashing tolerance and adhesion
11/16/2006	US20060255463 Electrical interconnection, and image sensor having the electrical interconnection
11/16/2006	US20060255462 Structures and methods to enhance copper metallization
11/16/2006	US20060255447 Plasma etching method
11/16/2006	US20060255446 Stacked modules and method
11/16/2006	US20060255444 System and method for vertically stacking computer memory components
11/16/2006	US20060255439 Semiconductor device and method for fabricating the same
11/16/2006	US20060255432 Forming semiconductor structures
11/16/2006	US20060255428 Semiconductor device and a method of manufacturing the same
11/16/2006	US20060255426 Semiconductor device with shallow trench isolation and its manufacture method
11/16/2006	US20060255425 Low crosstalk substrate for mixed-signal integrated circuits
11/16/2006	US20060255414 Method and apparatus for fabricating a carbon nanotube transistor having unipolar characteristics
11/16/2006	US20060255413 Highly integrated semiconductor device with silicide layer that secures contact margin and method of manufacturing the same
11/16/2006	US20060255410 FinFET TRANSISTOR AND CIRCUIT
11/16/2006	US20060255405 Fully-depleted SOI MOSFET device and process for fabricating the same
11/16/2006	US20060255404 Semiconductor resistance element and fabrication method thereof
11/16/2006	US20060255398 Ultra-violet protected tamper resistant embedded EEPROM
11/16/2006	US20060255397 Ultra high density flash memory
11/16/2006	US20060255394 Flash memory device and method of manufacturing the same
11/16/2006	US20060255391 Method of forming a reliable high performance capacitor using an isotropic etching process
11/16/2006	US20060255390 Semiconductor device and method of manufacturing the same
11/16/2006	US20060255388 Trench capacitors with buried isolation layer and methods for manufacturing the same
11/16/2006	US20060255387 Integrated circuit having laterally dielectrically isolated active regions above an electrically contacted buried material, and method for producing the same
11/16/2006	US20060255384 Memory device and method of manufacturing the same
11/16/2006	US20060255378 Semiconductor device
11/16/2006	US20060255373 Semiconductor structure comprising a highly doped conductive channel region and method for producing a semiconductor structure
11/16/2006	US20060255370 Method of manufacturing semiconductor device and semiconductor device
11/16/2006	US20060255368 Single electron transistor having memory function and method of manufacturing the same
11/16/2006	US20060255367 Compound semiconductor epitaxial substrate
11/16/2006	US20060255366 Nitride-based transistors with a protective layer and a low-damage recess
11/16/2006	US20060255365 Structure and method of a strained channel transistor and a second semiconductor component in an integrated circuit
11/16/2006	US20060255364 Heterojunction transistors including energy barriers and related methods
11/16/2006	US20060255360 Semiconductor device having multiple lateral channels and method of forming the same
11/16/2006	US20060255356 Light-emitting diode and manufacturing method thereof
11/16/2006	US20060255354 Semiconductor device and method for manufacturing the same
11/16/2006	US20060255350 Semiconductor device and method for fabricating the same
11/16/2006	US20060255348 Light emitting diode and manufacturing method thereof
11/16/2006	US20060255347 Multi element, multi color solid state LED/laser
11/16/2006	US20060255344 Field emission device, display adopting the same and method of manufacturing the same
11/16/2006	US20060255335 Method for manufacturing semiconductor element, semiconductor element, and semiconductor device
11/16/2006	US20060255331 Strained silicon forming method with reduction of threading dislocation density
11/16/2006	US20060255316 Etch solution for selectively removing silicon
11/16/2006	US20060255314 Polishing slurry and method of reclaiming wafers
11/16/2006	US20060255104 Diebond strip
11/16/2006	US20060255024 Laser beam machining method
11/16/2006	US20060255016 Method for polishing copper on a workpiece surface
11/16/2006	US20060255015 Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
11/16/2006	US20060255014 Etching method and apparatus for semiconductor wafers
11/16/2006	US20060255011 Method of forming contact openings
11/16/2006	US20060254812 Printed circuit boards having embedded thick film capacitors
11/16/2006	US20060254808 Substrate precursor structures
11/16/2006	US20060254719 Structure of disturbing plate having bent-down part
11/16/2006	US20060254717 Plasma processing apparatus
11/16/2006	US20060254716 Processing system and method for chemically treating a tera layer
11/16/2006	US20060254715 Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module
11/16/2006	US20060254712 Method for making a flat-top pad
11/16/2006	US20060254516 Heating element CVD system and heating element CVD metod using the same
11/16/2006	US20060254515 Deposition tool cleaning process having a moving plasma zone
11/16/2006	US20060254506 Methods of depositing an elemental silicon-comprising material over a substrate
11/16/2006	US20060254497 Semiconductor thin film decomposing method, decomposed semiconductor thin film, decomposed semiconductor thin film evaluation method, thin film transistor made of decomposed semiconductor thin film, and image display device having circuit constituted of thin film transistors
11/16/2006	US20060254496 Phase transition method of organic based complex and its functional element
11/16/2006	US20060254348 Scanning probe device and processing method of scanning probe
11/16/2006	US20060254347 Scanning probe device and processing method by scanning probe
11/16/2006	US20060254078 Apparatus and method for utilizing a meniscus in substrate processing
11/16/2006	US20060254052 Dielectric substrate with aperture; grounding layer; electroconductive overcoating; multilayer ; irradiating with ions
11/16/2006	DE4320060B4 Verfahren zur Herstellung eines Halbleiterspeicherzellenkondensators A method for fabricating a semiconductor memory cell capacitor
11/16/2006	DE19957123B4 Verfahren zur Herstellung einer Zellenanordnung für einen dynamischen Halbleiterspeicher A process for preparing a cell arrangement for dynamic semiconductor memory
11/16/2006	DE19947044B4 Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben Surface-mountable optoelectronic component with a reflector and method of manufacturing the same
11/16/2006	DE19842481B4 Stapelbarer Halbleiterchip und Verfahren zur Herstellung eines gestapelten Halbleiterchipmoduls A stackable semiconductor chip and method of manufacturing a stacked semiconductor chip module
11/16/2006	DE19747296B4 Sterilisierverbindung zum Herstellen ultrareinen Wassers bei einem Verfahren zum Herstellen von Halbleitervorrichtungen, Verfahren zum Sterilisieren ultrareinen Wassers sowie System zum Erzeugen ultrareinen Wassers Sterilisierverbindung for producing ultra pure water in a method for the manufacture of semiconductor devices, methods of sterilizing ultra pure water and system for producing ultra pure water
11/16/2006	DE112005000153T5 Erweiterte Multidruck-Werkstückprozessierung Advanced multi-pressure Werkstückprozessierung
11/16/2006	DE112004002610T5 Haltesystem für Halbleiterwafer und Verfahren davon Holding system for semiconductor wafer and method thereof
11/16/2006	DE112004002608T5 Leistungshalbleitervorrichtungen und Herstellungsverfahren Power semiconductor devices and manufacturing processes
11/16/2006	DE112004002373T5 Strained-Transistor-Integration für CMOS Strained-transistor CMOS integration for
11/16/2006	DE112004002173T5 Verfahren zur Herstellung eines epitaktischen Verbindungshalbleitersubstrats A process for producing a compound semiconductor epitaxial substrate
11/16/2006	DE10352349B4 Halbleiterchip mit Flip-Chip-Kontakten und Verfahren zur Herstellung desselben Of the same semiconductor chip having flip chip contacts, and processes for preparing
11/16/2006	DE10345162B4 Herstellungsverfahren für einen Grabenkondensator mit einem Isolationskragen, der über einen vergrabenen Kontakt einseitig mit einem Substrat elektrisch verbunden ist, insbesondere für eine Halbleiterspeicherzelle Manufacturing method for a grave capacitor with an insulation collar, which is electrically connected through a buried contact on one side with a substrate, in particular for a semiconductor memory cell
11/16/2006	DE10325225B4 Systemgehäuse System Cabinets
11/16/2006	DE10322983B4 Herstellungsverfahren für eine Halbleiterstruktur und enstprechende Halbleiterstruktur Manufacturing method of a semiconductor structure and semiconductor structure enstprechende
11/16/2006	DE10321494B4 Herstellungsverfahren für eine Halbleiterstruktur Manufacturing method of a semiconductor structure
11/16/2006	DE10310543B4 Wafer-Reinigungssystem und Verfahren zum Reinigen eines Wafers Wafer cleaning system and method for cleaning of a wafer
11/16/2006	DE10236678B4 DRAM-Zellenstruktur mit eingebettetem umgebenden Kondensator und Verfahren zu deren Herstellung DRAM cell structure with embedded surrounding capacitor and process for their preparation

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