H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2006
11/23/2006	US20060261462 Semiconductior package substrate with embedded resistors and method for fabricating same
11/23/2006	US20060261452 Structural unit and method for the production of a structural unit
11/23/2006	US20060261450 Leadframeless package structure and method
11/23/2006	US20060261446 Backside method and system for fabricating semiconductor components with conductive interconnects
11/23/2006	US20060261445 Integrated circuit device with treated perimeter edge
11/23/2006	US20060261442 Semiconductor device and manufacturing the same
11/23/2006	US20060261441 Process for forming a low carbon, low resistance metal film during the manufacture of a semiconductor device and systems including same
11/23/2006	US20060261440 Methods of forming a plurality of capacitors, and integrated circuitry comprising a pair of capacitors
11/23/2006	US20060261436 Electronic device including a trench field isolation region and a process for forming the same
11/23/2006	US20060261435 Methods for making nearly planar dielectric films in integrated circuits
11/23/2006	US20060261434 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region
11/23/2006	US20060261433 Nanotube Schottky diodes for high-frequency applications
11/23/2006	US20060261428 Ultra thin image sensor package structure and method for fabrication
11/23/2006	US20060261425 Magnetic memory and method of manufacturing the memory
11/23/2006	US20060261422 Semiconductor device and method for manufacturing the same
11/23/2006	US20060261421 Boron incorporated diffusion barrier material
11/23/2006	US20060261420 Semiconductor device and method of manufacturing thereof
11/23/2006	US20060261419 Method for fabricating a nanoelement field effect transistor with surrounded gate structure
11/23/2006	US20060261416 Semiconductor device and method of manufacturing the same
11/23/2006	US20060261415 Method to chemically remove metal impurities from polycide gate sidewalls
11/23/2006	US20060261411 Nonplanar device with stress incorporation layer and method of fabrication
11/23/2006	US20060261407 High-voltage transistor fabrication with trench etching technique
11/23/2006	US20060261406 Vertical integrated-gate CMOS device and its fabrication process
11/23/2006	US20060261405 Vertical device 4F² eeprom memory
11/23/2006	US20060261404 Vertical NROM NAND flash memory array
11/23/2006	US20060261402 Air tunnel floating gate memory cell and method for making the same
11/23/2006	US20060261401 Novel low power non-volatile memory and gate stack
11/23/2006	US20060261397 Lanthanide oxide/hafnium oxide dielectric layers
11/23/2006	US20060261396 Multiple stacked capacitors formed within an opening with thick capacitor dielectric
11/23/2006	US20060261395 Semiconductor fabrication using a collar
11/23/2006	US20060261392 Semiconductor device and method of manufacturing the same
11/23/2006	US20060261389 Systems and methods for forming zirconium and/or hafnium-containing layers
11/23/2006	US20060261388 Method for manufacturing ferroelectric capacitor
11/23/2006	US20060261387 Semiconductor device and manufacturing method thereof
11/23/2006	US20060261374 Electrical coupling stack and processes for making same
11/23/2006	US20060261370 Gallium nitride high electron mobility transistor structure
11/23/2006	US20060261356 Semiconductor device
11/23/2006	US20060261343 Solid-state light emitting display and fabrication method thereof
11/23/2006	US20060261341 Semiconductor device and manufacturing method of the same
11/23/2006	US20060261340 Microelectronic imagers and methods of packaging microelectronic imagers
11/23/2006	US20060261339 Thin film semiconductor device and method for manufacturing same
11/23/2006	US20060261338 Semiconductor device and method for fabricating the same
11/23/2006	US20060261334 Electrode substrate, thin-film transistor, display and its production method
11/23/2006	US20060261330 MEMS device and method of forming a MEMS device
11/23/2006	US20060261326 Semiconductor device with different lattice properties
11/23/2006	US20060261306 Efficient polishing rate, excellent selectivity and good surface quality; composite particles of nonpolymeric organic component melamine or a melamine derivative and chemical component different from nonpolymeric organic component
11/23/2006	US20060261050 Focusing an optical beam to two foci
11/23/2006	US20060261042 Forming a trench in the wafer of crystalline material on a first side of a crystalline material, the trench comprising blade profile of a blade; isotropically etching
11/23/2006	US20060261041 Method for manufacturing metal line contact plug of semiconductor device
11/23/2006	US20060261040 Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
11/23/2006	US20060261039 Molding a raw material resin; carbonizing molding; roughening simultaneously the inner and outer surfaces, purification, mechanical surface roughening and chemical surface etching; improved adhesion to CVD deposit film and also has a high degree of roundness
11/23/2006	US20060261038 Single wafer cleaning method to reduce particle defects on a wafer surface
11/23/2006	US20060261037 Substrate processing method and substrate processing apparatus
11/23/2006	US20060261036 Method for patterning on a wafer having at least one substrate for the realization of an integrated circuit
11/23/2006	US20060260932 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
11/23/2006	US20060260916 Methods and apparatus for transporting substrate carriers
11/23/2006	US20060260910 Break-away positioning conveyor mount for accommodating conveyor belt bends
11/23/2006	US20060260909 Break-away positioning conveyor mount for accommodating conveyor belt bends
11/23/2006	US20060260750 Plasma processing apparatuses and methods
11/23/2006	US20060260748 Plasma processing apparatus and method
11/23/2006	US20060260747 Gas introduction system for temperature adjustment of object to be processed
11/23/2006	US20060260746 Plasma processing apparatus
11/23/2006	US20060260745 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device
11/23/2006	US20060260742 Methods for application of adhesive tape to semiconductor devices
11/23/2006	US20060260661 Method and apparatus for wafer cleaning
11/23/2006	US20060260660 Method and apparatus for wafer cleaning
11/23/2006	US20060260659 Method and apparatus for wafer cleaning
11/23/2006	US20060260653 Apparatus for cleaning and drying substrates
11/23/2006	US20060260647 Cleaning method and solution for cleaning a wafer in a single wafer process
11/23/2006	US20060260645 Methods and apparatus for processing wafers
11/23/2006	US20060260644 Method and apparatus for wafer cleaning
11/23/2006	US20060260643 Method and apparatus for wafer cleaning
11/23/2006	US20060260642 Method and apparatus for wafer cleaning
11/23/2006	US20060260545 Low temperature absorption layer deposition and high speed optical annealing system
11/23/2006	US20060260544 Substrate processing and method of manufacturing device
11/23/2006	US20060260539 Screen mask
11/23/2006	US20060260398 Method and apparatus for measuring frequency characteristics of acceleration sensor
11/23/2006	US20060260149 Wafer guides for processing semiconductor substrates
11/23/2006	DE4323363B4 Verfahren zur Herstellung eines Kondensators für ein Halbleiterspeicherbauelement A method of manufacturing a capacitor for a semiconductor memory device
11/23/2006	DE202006005237U1 Device for breaking of semiconductor disks or wafers has breaking wedge, tilted and aligned opposite to section of semiconductor disk for single semiconductor disk that is pre scratched in initial area of reference break line
11/23/2006	DE202004021128U1 Semiconductor wafer testing arrangement used in semiconductor production, has temperature control station that transfers wafer to prober through handling system, after applying thermal or mechanical load to wafer
11/23/2006	DE19964316B4 Semiconductor device manufacturing method for e.g. GaAs FET involves sticking chips to substrate, sticking lid to substrate and separating chips along adjoining areas
11/23/2006	DE19861228B4 Verfahren zum Herstellen einer transparenten Elektrode A method for producing a transparent electrode,
11/23/2006	DE19747159B4 Halbleiterbauteil mit MOS-Gatesteuerung und Verfahren zu seiner Herstellung A semiconductor device comprising MOS gated and process for its preparation
11/23/2006	DE19610283B4 Verfahren zum Herstellen einer Flüssigkristallanzeigevorrichtung mit Speicherkondensatoren erhöhter Kapazität und Flüssigkristallvorrichtung A method of manufacturing a liquid crystal display device with increased capacity and storage capacitors liquid crystal device
11/23/2006	DE112004002702T5 Matrixförmige Halbleiterbaugruppe mit Kühlkörper Matrix-shaped semiconductor package with heat sink
11/23/2006	DE112004002554T5 Active wafer probe Active wafer probe
11/23/2006	DE112004001540T5 Erzeugen von Sätzen maßgeschneiderter Laserimpulse Generating sets of customized laser pulses
11/23/2006	DE10304777B4 Verfahren zur Herstellung eines Chipnutzens mittels eines Hitze- und Druckprozesses unter Verwendung eines thermoplastischen Materials und Vorrichtung zur Durchführung des Verfahrens A process for producing a chip by means of a utility heat and pressure process using a thermoplastic material and apparatus for carrying out the method
11/23/2006	DE10255866B4 Verfahren und Strukturen zur Erhöhung der Strukturdichte und der Speicherkapazität in einem Halbleiterwafer Methods and structures to increase the structural density and the memory capacity in a semiconductor wafer
11/23/2006	DE10230674B4 Halbleiterkondensator und damit aufgebauter MOSFET Semiconductor capacitor and thus constructed MOSFET
11/23/2006	DE102006021468A1 Schnittstellenaufbau und Trockengas einschließende Vorrichtung, die diesen verwendet Interface structure and dry gas occluding device employing this
11/23/2006	DE102006007439A1 Verfahren und Vorrichtung zum Testen von Halbleitern unter Verwendung von Einzelchips mit integrierten Schaltungen A method and apparatus for testing semiconductors using single chips with integrated circuits
11/23/2006	DE102005041539A1 Adhesive film to attach semiconductor chips to a carrier before embedding in plastic has temperature-sensitve and/or pressure-sensitive film that decomposes to gaseous products
11/23/2006	DE102005023129A1 Heat sink for semiconductor chip, which it contacts by bottom element, includes top contact faces for heat convection from chip
11/23/2006	DE102005023122A1 Integrierte Schaltungsanordnung mit Schichtstapel und Verfahren An integrated circuit device having a layer stack and method
11/23/2006	DE102005022884A1 Verfahren zur Inspektion einer Leiterbahnstruktur A method for inspection of a conductor track structure
11/23/2006	DE102005022600A1 Integrierter Schaltkreis mit Abgleichelementen und Verfahren zu seiner Herstellung An integrated circuit comprising adjustment elements and process for its preparation
11/23/2006	DE102005022354A1 Method of treating objects using laser radiation esp. for boring or shaping electronic circuit substrates
11/23/2006	DE102005021831A1 Vorrichtung zum Transportieren von Plättchen Apparatus for transporting platelets

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