H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2006
11/22/2006	CN1868041A Low temperature deposition of silicon oxides and oxynitrides
11/22/2006	CN1868040A Surface-protecting sheet and semiconductor wafer lapping method
11/22/2006	CN1868039A Minimizing the loss method of barrier materials during photoresist stripping
11/22/2006	CN1868038A Mounting device and method
11/22/2006	CN1868037A Composition for forming silicon-cobalt film, silicon-cobalt film, and forming method therefor
11/22/2006	CN1868036A Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
11/22/2006	CN1868035A Junction forming method and object to be processed and formed by using same
11/22/2006	CN1868034A Method for depositing materials on a substrate
11/22/2006	CN1868033A Multilayer mirror, method for manufacturing the same, and exposure equipment
11/22/2006	CN1868032A Exposing device and exposing method, and device manufacturing method
11/22/2006	CN1868031A Substrate holding structure and substrate processing apparatus
11/22/2006	CN1868030A Method of fabrication and device comprising elongated nanosize elements
11/22/2006	CN1868002A Nanotube-based switching elements with multiple controls and circuits made from same
11/22/2006	CN1867921A Esd test array and corresponding method
11/22/2006	CN1867818A Inspection method and inspection assisting device of quartz product in semiconductor processing system
11/22/2006	CN1867703A Electroplating compositions and methods for electroplating
11/22/2006	CN1867697A Electroless copper plating solution and method for electroless copper plating
11/22/2006	CN1867695A Method of improving post-develop photoresist profile on a deposited dielectric film
11/22/2006	CN1867694A Substrate heater assembly
11/22/2006	CN1867659A Cleaning agent
11/22/2006	CN1867506A Adhesive tape peeling device
11/22/2006	CN1867504A Free ball bearing and supporting table
11/22/2006	CN1867430A Calibration method
11/22/2006	CN1867424A Polishing apparatus
11/22/2006	CN1867419A Laser-based system for memory link processing with picosecond lasers
11/22/2006	CN1867411A Compositions and methods for the electroless deposition of NiFe on a work piece
11/22/2006	CN1866564A Method of forming ohmic contact layer and method of fabricating light emitting device having ohmic contact layer
11/22/2006	CN1866563A Apparatus with a plastic member and a LED
11/22/2006	CN1866561A Light emitting device package and method for manufacturing the same
11/22/2006	CN1866545A Air tunnel floating gate memory cell and method for making the same
11/22/2006	CN1866542A MOS field effect transistor with isolating structure and making method thereof
11/22/2006	CN1866541A Field effect transistor and method for manufacturing same
11/22/2006	CN1866540A Semiconductor device and manufacturing method thereof
11/22/2006	CN1866539A 集成电路元件及其形成方法 Integrated circuit device and method of forming the
11/22/2006	CN1866538A 半导体衬底及其制造方法 A semiconductor substrate and manufacturing method thereof
11/22/2006	CN1866537A Organic electroluminescent device and method for manufacturing the same
11/22/2006	CN1866535A Electroluminescent display element and manufacturing method thereof
11/22/2006	CN1866533A Semiconductor storage device and manufacturing method thereof
11/22/2006	CN1866532A AC light emitting apparatus and manufacturing method thereof
11/22/2006	CN1866530A Solid-state imaging device and manufacturing method of the same
11/22/2006	CN1866529A Semiconductor wafer, semiconductor device and manufacturing method of semiconductor device
11/22/2006	CN1866528A Stress inducing spacers
11/22/2006	CN1866527A 薄膜晶体管阵列面板及其方法 The thin film transistor array panel and method
11/22/2006	CN1866525A Nonvolatile memory device
11/22/2006	CN1866524A Semiconductor device and method of manufacturing the same
11/22/2006	CN1866523A Semiconductor device having shallow trench isolation structure and method of manufacturing the same
11/22/2006	CN1866521A Electronic circuit, electronic circuit device and method for manufacturing electronic circuit
11/22/2006	CN1866520A A semiconductor device and methods of manufacturing thereof, a semiconductor device structure
11/22/2006	CN1866519A Bank structure, wiring pattern forming method, device, electro-optical device, and electronic apparatus
11/22/2006	CN1866518A Circuitry component
11/22/2006	CN1866517A Circuitry component
11/22/2006	CN1866515A SIP (system-in-package) type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
11/22/2006	CN1866510A Overlay vernier and method for manufacturing semiconductor device using the same
11/22/2006	CN1866508A Semiconductor device having trench structures and manufacturing method thereof
11/22/2006	CN1866507A Multi-layered complementary wire structure and manufacturing method thereof
11/22/2006	CN1866505A Semiconductor device and method of manufacturing the same
11/22/2006	CN1866504A Semiconductor device and making method thereof
11/22/2006	CN1866500A Integrated circuit packaging and manufacturing method
11/22/2006	CN1866499A Contact scheme for memory array and manufacturing methods thereof
11/22/2006	CN1866498A Method for preventing clearance generation between different materials in semiconductor device
11/22/2006	CN1866497A Method of fabricating flash memory device
11/22/2006	CN1866496A Method for preparing nanoelectronic memory by electron beam exposure and mechanochemical polishing process
11/22/2006	CN1866495A Method for making copper dual-damascene structure
11/22/2006	CN1866494A High precision silicon slice bench and uses thereof
11/22/2006	CN1866493A Processing unit and aligning method
11/22/2006	CN1866492A system and method for identification of a reference integrated circuit for a pick-and-place equipment
11/22/2006	CN1866491A Pod swapping internal to tool run time
11/22/2006	CN1866490A Test probe and manufacturing method for test probe
11/22/2006	CN1866489A Electronic component joint device
11/22/2006	CN1866488A Welding pad layout method and structure
11/22/2006	CN1866487A Ball mounting method and apparatus for ball grid array packaging substrate
11/22/2006	CN1866486A Integrated circuit packaging mould with high-hardness corrosion-resistant coating
11/22/2006	CN1866485A Method for decreasing adhesion of resin on semiconductor packaging mould surface
11/22/2006	CN1866484A Method for manufacturing photoelectric chip packaging structure with control chip
11/22/2006	CN1866483A Wiring substrate and manufacturing method thereof
11/22/2006	CN1866482A Thin film transistor and making method thereof
11/22/2006	CN1866481A Manufacturing method of thin film transistor
11/22/2006	CN1866480A Source electrode/drain electrode ion doping method
11/22/2006	CN1866479A Power junction field effect transistor structure and making method thereof
11/22/2006	CN1866478A Power junction field effect transistor structure and making method thereof
11/22/2006	CN1866477A Method for removing etching residue on wafer surface
11/22/2006	CN1866476A Nitride-based compound semiconductor, method of cleaning a compound semiconductor, method of producing the same, and substrate
11/22/2006	CN1866475A Mechanochemical grinding process and method for increasing grinding end point accuracy
11/22/2006	CN1866474A Process for exfoliating a thin film
11/22/2006	CN1866473A Silicon sheet thinning method
11/22/2006	CN1866472A Method for making T-type grating of transistor circuit with high electron mobility
11/22/2006	CN1866471A Method for implanting ions to a wafer for manufacturing of semiconductor device and method of fabricating graded junction using the same
11/22/2006	CN1866470A Method for forming patterned material layer
11/22/2006	CN1866469A Bank structure, wiring pattern forming method, device, electro-optical device, and electronic apparatus
11/22/2006	CN1866468A Circuitry component fabricating method
11/22/2006	CN1866467A Circuitry component fabricating method
11/22/2006	CN1866466A Method for removing integrated circuit wafer surface contaminant by electromechanical process
11/22/2006	CN1866465A Growth process capable of increasing zb-CrSb thickness
11/22/2006	CN1866464A Mirror charge effect quantum cellular automation making method
11/22/2006	CN1866461A Ion beam transmission control optimizing method
11/22/2006	CN1866361A Magnetic recording element and method of manufacturing magnetic recording element
11/22/2006	CN1866324A 像素阵列结构 Pixel array structure
11/22/2006	CN1866323A Display device and its manufacturing method
11/22/2006	CN1866131A Method for defining edges of polygon in region with edges
11/22/2006	CN1866130A Method for reducing critical dimension

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