Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2006
12/14/2006WO2006132119A1 Method and device for nano-imprinting
12/14/2006WO2006132111A1 Stage mechanism
12/14/2006WO2006132089A1 Thermoacid generator for antireflection film formation, composition for antireflection film formation, and antireflection film made therefrom
12/14/2006WO2006132088A1 Coating-type underlayer film forming composition containing naphthalene resin derivative for lithography
12/14/2006WO2006132078A1 Adhesion control apparatus
12/14/2006WO2006132077A1 Transfer apparatus, transfer method, peeling apparatus, peeling method, adhering apparatus and adhering method
12/14/2006WO2006132055A1 Semiconductor abrasive
12/14/2006WO2006132008A1 Organic film release agent, and method and appartus for removing organic film using said release agent
12/14/2006WO2006132007A1 Semiconductor integrated circuit
12/14/2006WO2006131986A1 Semiconductor device, semiconductor system and semiconductor device manufacturing method
12/14/2006WO2006131883A1 Visual inspection system and process for electronic modules
12/14/2006WO2006131616A1 New type of molecular junction between a semiconductor and a metal
12/14/2006WO2006131615A1 Channel transistor based on germanium encased by a gate electrode and method for producing this transistor
12/14/2006WO2006131427A2 Image sensor provided with a thinned semiconductor substrate with backside metallisation
12/14/2006WO2006131251A1 Mixture for doping semiconductors
12/14/2006WO2006130995A2 Fluorescent photopolymerizable resins and uses thereof
12/14/2006WO2006130914A1 A patterning process
12/14/2006WO2006109343A3 Process for the formation of miniaturized getter deposits and getterdeposits so obtained
12/14/2006WO2006107564A3 Semiconductor power deviceand corrisponding manufacturing process
12/14/2006WO2006107517A3 Composition for cleaning ion implanted photoresist in front end of line applications
12/14/2006WO2006101769A3 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
12/14/2006WO2006094769A3 Method for designing an integrated circuit
12/14/2006WO2006094241A3 Thin-film device comprising an oxide semiconductor and method of selective annealing a blanket coated oxide semiconductor layer
12/14/2006WO2006083546A3 In situ formed halo region in a transistor device
12/14/2006WO2006080796A8 Cerium oxide abrasive and slurry containing the same
12/14/2006WO2006078985A3 Optoelectronic architecture having compound conducting substrate
12/14/2006WO2006057775B1 Method for fabricating a mim capacitor having increased capacitance density and related structure
12/14/2006WO2006044127A3 System and method for planarizing a substrate
12/14/2006WO2006004751A3 Methods and apparatus for attaching a die to a substrate
12/14/2006WO2005122253A3 PE-ALD OF TaN DIFFUSION BARRIER REGION ON LOW-K MATERIALS
12/14/2006WO2005104210A3 Arrayed ultrasonic transducer
12/14/2006WO2005104164A3 Honeycomb optical window deposition shield and method for a plasma processing system
12/14/2006WO2005089484A3 Integrated circuit metal silicide method
12/14/2006WO2004109761A3 Gas distribution system
12/14/2006US20060282727 Scan test design method, scan test circuit, scan test circuit insertion cad program, large-scale integrated circuit and mobile digital equipment
12/14/2006US20060282229 Quality Evaluation Method for Single Crystal Ingot
12/14/2006US20060282190 Automatic defect review and classification system
12/14/2006US20060281872 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
12/14/2006US20060281863 Heat releasable wafer dicing tape
12/14/2006US20060281395 Retaining ring with flange for chemical mechanical polishing
12/14/2006US20060281338 Method for prediction of premature dielectric breakdown in a semiconductor
12/14/2006US20060281337 Method and apparatus for forming silicon oxide film
12/14/2006US20060281336 Semiconductor device and method of manufacturing the same
12/14/2006US20060281335 Method of fabricating semiconductor integrated circuits
12/14/2006US20060281334 Method for forming high-resolution pattern and substrate having prepattern formed thereby
12/14/2006US20060281333 Method for forming high-resolution pattern with direct writing means
12/14/2006US20060281332 Structure for a semiconductor arrangement and a method of manufacturing a semiconductor arrangement
12/14/2006US20060281331 Charge trapping dielectric structure for non-volatile memory
12/14/2006US20060281330 Iridium / zirconium oxide structure
12/14/2006US20060281329 Sealing porous dielectric material using plasma-induced surface polymerization
12/14/2006US20060281328 Compound semiconductor substrate, epitaxial substrate, processes for producing compound semiconductor substrate, and epitaxial substrate
12/14/2006US20060281327 Semiconductor laser element and method of fabrication thereof
12/14/2006US20060281326 Washing apparatus, washing stystem, and washing method
12/14/2006US20060281325 Method of defining polysilicon patterns
12/14/2006US20060281324 Method of controlling the pressure in a process chamber
12/14/2006US20060281323 Method of cleaning substrate processing apparatus
12/14/2006US20060281322 Epitaxial semiconductor deposition methods and structures
12/14/2006US20060281321 Nanowire sensor device structures
12/14/2006US20060281320 Method for forming an anti-etching shielding layer of resist patterns in semiconductor fabrication
12/14/2006US20060281319 Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device
12/14/2006US20060281318 Method of Manufacturing Semiconductor Device
12/14/2006US20060281317 A first conductive layer of a high-melting point metal is in contact with an insulating layer by droplet discharge; a second conductive layer of silver, gold, copper, or indium tin oxide in contact with the first conductive layer,has improved adhesiveness with the insulating layer; antipeeling agents
12/14/2006US20060281316 Semiconductor device and method of manufacturing the same
12/14/2006US20060281315 Process of manufacture of ultra thin semiconductor wafers with bonded conductive hard carrier
12/14/2006US20060281314 Wafer Holder And Method Of Holding A Wafer
12/14/2006US20060281313 Etching method and method for forming contact opening
12/14/2006US20060281312 Hydrogen and oxygen based photoresist removal process
12/14/2006US20060281311 Integrated circuitry
12/14/2006US20060281310 Rotating substrate support and methods of use
12/14/2006US20060281309 Coaxial through chip connection
12/14/2006US20060281308 Integration flow to prevent delamination from copper
12/14/2006US20060281307 Post-attachment chip-to-chip connection
12/14/2006US20060281306 Carbon nanotube interconnect contacts
12/14/2006US20060281305 Methods of forming self-aligned silicide layers using multiple thermal processes
12/14/2006US20060281304 Semiconductor device and method of manufacturing the same
12/14/2006US20060281303 Tack & fuse chip bonding
12/14/2006US20060281302 Semiconductor damascene trench and methods thereof
12/14/2006US20060281301 Method for manufacturing dual damascene pattern
12/14/2006US20060281300 Semiconductor substrate and method of fabricating semiconductor device
12/14/2006US20060281299 Method of fabricating silicon carbide-capped copper damascene interconnect
12/14/2006US20060281298 Semiconductor device and manufacturing method of the same
12/14/2006US20060281297 Multilayer electronic part and structure for mounting multilayer electronic part
12/14/2006US20060281296 Routingless chip architecture
12/14/2006US20060281295 Methods of manufacturing semiconductor devices and structures thereof
12/14/2006US20060281294 Method of forming a penetration electrode and substrate having a penetration electrode
12/14/2006US20060281293 Semiconductor device and method for manufacturing the same
12/14/2006US20060281292 Rigid-backed, membrane-based chip tooling
12/14/2006US20060281291 Method for manufacturing a metal-semiconductor contact in semiconductor components
12/14/2006US20060281290 Semiconductor device and method of manufacturing the same
12/14/2006US20060281289 Method of forming polycide layer and method of manufacturing semiconductor device having polycide layer
12/14/2006US20060281288 Semiconductor device fabrication method
12/14/2006US20060281287 Method of aligning deposited nanotubes onto an etched feature using a spacer
12/14/2006US20060281286 Method for fabricating metal line in semiconductor device
12/14/2006US20060281285 Semiconductor device and a method of manufacturing the same
12/14/2006US20060281284 Method of manufacturing gallium nitride based high-electron mobility devices
12/14/2006US20060281283 Silicon epitaxial wafer, and silicon epitaxial wafer manufacturing method
12/14/2006US20060281282 Method for maching a wafer
12/14/2006US20060281281 Method of inspecting semiconductor wafer
12/14/2006US20060281280 Method for producing bonded wafer
12/14/2006US20060281279 Structure and method for III-nitride monolithic power IC