H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2006
12/21/2006	US20060286778 Method of manufacturing dual orientation wafers
12/21/2006	US20060286777 Method of fabricating nitride-based compound layer, GaN Substrate and vertical structure nitride-based semiconductor light emitting device
12/21/2006	US20060286776 Method for forming silicon-containing materials during a photoexcitation deposition process
12/21/2006	US20060286775 Method for forming silicon-containing materials during a photoexcitation deposition process
12/21/2006	US20060286774 Method for forming silicon-containing materials during a photoexcitation deposition process
12/21/2006	US20060286773 Wafer dicing process for optical electronic packing
12/21/2006	US20060286772 Method of cross-section milling with focused ion beam (FIB) device
12/21/2006	US20060286771 Layer transfer technique
12/21/2006	US20060286770 Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
12/21/2006	US20060286769 Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
12/21/2006	US20060286768 Method of supporting microelectronic wafer during backside processing
12/21/2006	US20060286767 Novel thinning process for 3 - dimensional integration via wafer bonding
12/21/2006	US20060286766 Isolation structures for preventing photons and carriers from reaching active areas and methods of formation
12/21/2006	US20060286765 Method for manufacturing element isolation structural section
12/21/2006	US20060286764 Deposition-selective etch-deposition process for dielectric film gapfill
12/21/2006	US20060286763 Gate electrode dopant activation method for semiconductor manufacturing
12/21/2006	US20060286762 Method for non-volatile memory fabrication
12/21/2006	US20060286761 Wet electrolytic capacitors
12/21/2006	US20060286760 Electrode for an electrical component, component with the electrode, and manufacturing method for the electrode and the component
12/21/2006	US20060286759 Metal oxide semiconductor (MOS) device having both an accumulation and a enhancement mode transistor device on a similar substrate and a method of manufacture therefor
12/21/2006	US20060286758 Super anneal for process induced strain modulation
12/21/2006	US20060286757 Semiconductor product and method for forming a semiconductor product
12/21/2006	US20060286756 Semiconductor process and method for reducing parasitic capacitance
12/21/2006	US20060286755 Method for fabricating transistor with thinned channel
12/21/2006	US20060286754 Semiconductor device with interface circuit and method of configuring semiconductor devices
12/21/2006	US20060286753 Method for Producing a Stop Zone in a Semiconductor Body and Semiconductor Component Having a Stop Zone
12/21/2006	US20060286752 Method of fabricating non-volatile memory
12/21/2006	US20060286751 Semiconductor device and method for manufacturing the same
12/21/2006	US20060286750 Method and system for forming straight word lines in a flash memory array
12/21/2006	US20060286749 Method of fabricating non-volatile memory
12/21/2006	US20060286748 Terraced film stack
12/21/2006	US20060286747 Floating-gate structure with dielectric component
12/21/2006	US20060286746 Flash memory and fabricating method thereof
12/21/2006	US20060286745 Semiconductor device having a capacitor with a stepped cylindrical structure and method of manufacturing the same
12/21/2006	US20060286744 Semiconductor device suitable for forming conductive film such as platinum with good coverage, and its manufacture
12/21/2006	US20060286743 Method for Manufacturing a Narrow Structure on an Integrated Circuit
12/21/2006	US20060286742 Method for fabrication of surface mounted metal foil chip resistors
12/21/2006	US20060286741 Methods of fabricating high voltage devices
12/21/2006	US20060286740 A method for forming a device having multiple silicide types
12/21/2006	US20060286739 Shallow trench isolation structures comprising a graded doped sacrificial silicon dioxide material and a method for forming shallow trench isolation structures
12/21/2006	US20060286738 Method of forming floating-gate tip for split-gate flash memory process
12/21/2006	US20060286737 Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
12/21/2006	US20060286736 Method for forming an electronic device
12/21/2006	US20060286735 Integrated circuit transistor insulating region fabrication method
12/21/2006	US20060286734 MIM/MIS structure with praseodymium titanate or praseodymium oxide as insulator material
12/21/2006	US20060286733 Method for manufacturing a semiconductor element
12/21/2006	US20060286732 Power semiconductor device
12/21/2006	US20060286731 Method of fabricating conductive lines and structure of the same
12/21/2006	US20060286730 Semiconductor structure and method for forming thereof
12/21/2006	US20060286729 Complementary metal oxide semiconductor integrated circuit using raised source drain and replacement metal gate
12/21/2006	US20060286728 Method for forming recess gate of semiconductor device
12/21/2006	US20060286727 Polycrystalline silicon liquid crystal display device and fabrication method thereof
12/21/2006	US20060286726 Forming interconnects
12/21/2006	US20060286725 Method for manufacturing thin film transistors
12/21/2006	US20060286724 Substrate backgate for trigate fet
12/21/2006	US20060286723 Electrode structure, fabrication method thereof and pdp utilizing the same
12/21/2006	US20060286722 Methods for making microwave circuits
12/21/2006	US20060286721 Breakable interconnects and structures formed thereby
12/21/2006	US20060286720 Method for fabricating nonvolatile semiconductor memory device
12/21/2006	US20060286719 Semiconductor packages and methods of manufacturing thereof
12/21/2006	US20060286718 Manufacturing method capable of simultaneously sealing a plurality of electronic parts
12/21/2006	US20060286717 Stacked microelectronic assemblies having basal compliant layers
12/21/2006	US20060286716 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
12/21/2006	US20060286715 Manufacturing method of semiconductor integrated circuit device
12/21/2006	US20060286714 Semiconductor device and system having semiconductor device mounted thereon
12/21/2006	US20060286713 Methods of fabricating semiconductor devices including trench device isolation layers having protective insulating layers and related devices
12/21/2006	US20060286712 Thermal interface with a patterned structure
12/21/2006	US20060286711 Signal isolation in a package substrate
12/21/2006	US20060286710 Method for bonding substrates, bonded substrate, and direct bonded substrare
12/21/2006	US20060286709 Manufacturing methods for thin film fuse phase change ram
12/21/2006	US20060286708 Image sensor and pixel having an optimized floating diffusion
12/21/2006	US20060286707 Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level
12/21/2006	US20060286706 Method of making a substrate contact for a capped MEMS at the package level
12/21/2006	US20060286705 Method of passivating compound semiconductor surfaces
12/21/2006	US20060286704 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus
12/21/2006	US20060286703 Thin film transistor array panel and liquid crystal display including the same
12/21/2006	US20060286702 Method of manufacturing a transparent element including transparent electrodes
12/21/2006	US20060286701 Apparatus for inspecting alignment film and method for fabricating liquid crystal display device using the same
12/21/2006	US20060286700 Apparatus for stacking cassette and a method of fabricating a liquid crystal display device using the same
12/21/2006	US20060286699 Fabricating method for flat panel display device
12/21/2006	US20060286698 Electro-optical device, method of manufacturing the same, and electronic apparatus
12/21/2006	US20060286697 Method for manufacturing light emitting diodes
12/21/2006	US20060286696 Passive electrical article
12/21/2006	US20060286695 Method for producing semiconductor light emitting device, method for producing semiconductor device, method for producing device, method for growing nitride type iii-v group compound semiconductor layer, method for growing semiconductor layer, and method for growing layer
12/21/2006	US20060286694 Method for fabricating LED
12/21/2006	US20060286693 Fabrication of three-dimensional photonic crystals in gallium arsenide-based material
12/21/2006	US20060286692 Method for manufacturing semiconductor element, apparatus for manufacturing semiconductor element and semiconductor element
12/21/2006	US20060286691 Capacitance modeling
12/21/2006	US20060286690 Mask CD correction based on global pattern density
12/21/2006	US20060286689 Semiconductor device and manufacturing method thereof
12/21/2006	US20060286688 Integrated circuitry and method for manufacturing the same
12/21/2006	US20060286687 Method for manufacturing semiconductor device
12/21/2006	US20060286686 Integrated light emitting diode displays using biofabrication
12/21/2006	US20060286486 First organic layer, silicon-containing sacrificial layer, and second organic layer; photolithographically patterning the 2nd organic layer and using it as a mask to etch the sacrificial layer; using the etched sacrificial layer as a mask to etch first organic layer; using product to etch the substrate
12/21/2006	US20060286388 Anodically bonded stack of two conductive ceramic components separated by an intermediate film at low temperatures wherein a transition layer is formed
12/21/2006	US20060286385 Method for producing and treating epoxide resin moulding materials
12/21/2006	US20060286369 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
12/21/2006	US20060286350 Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
12/21/2006	US20060286301 Substrates and method of manufacturing same
12/21/2006	US20060286300 Cluster tool architecture for processing a substrate

1 ... 3176 3177 3178 3179 3180 3181 3182 3183 3184 3185 3186 3187 3188 3189 3190 3191 3192 3193 3194 3195 3196 ... 6590